Method for improving pad-off phenomenon of blind holes in multi-stage circuit board, and multi-stage circuit board

A technology for circuit boards and blind holes, which is applied to methods and multi-stage circuit boards, improves the field of pad removal in blind holes of multi-stage circuit boards, and can solve the problems of poor pad opening and small thickness-to-diameter ratio of blind holes, so as to solve the problem of pad removal Poor open circuit, improved production efficiency, and reduced dielectric thickness
CN112752435AActive Publication Date: 2021-05-04珠海崇达电路技术有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
珠海崇达电路技术有限公司
Publication Date
2021-05-04

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Abstract

The invention discloses a method for improving the pad-off phenomenon of blind holes in a multi-stage circuit board, and the multi-stage circuit board. The method comprises the following steps: drilling a plug hole in a core board, metalizing the plug hole, filling the plug hole with resin, and metalizing the surface of the resin after grinding the board with an abrasive belt; manufacturing an inner-layer circuit on the core board; pressing the core plate and a copper foil into a first daughter board; drilling a first blind hole and a first-order blind hole in the first daughter board, and subjecting the first blind hole and the first-order blind hole to filling and levelling-up; pressing the first sub-plate and another copper foil into a second sub-plate; drilling a second blind hole and a second-order blind hole in the second daughter board in a depth-controlled mode, and subjecting the second blind hole and the second-order blind hole to filling and levelling-up; pressing the second daughter board and another copper foil into a production board; drilling a third-order blind hole and a through hole in the production board in a depth-controlled mode, and subjecting the third-order blind hole and the through hole to metalization; and sequentially carrying out subsequent processes on the production board to obtain the multi-stage circuit board. According to the method, dielectric thickness between the blind hole layers can be reduced, so the thickness-diameter ratio of the blind holes is reduced, and the problem of poor open circuit caused by the pad-off phenomenon caused by overlarge dielectric thickness between the blind hole layers is solved.
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Description

technical field

[0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving blind hole pad removal of a multi-level circuit board and the multi-level circuit board. Background technique

[0002] Three-stage laser HDI board, this product is mainly used in the security module of the digital keypad control box of the ATM machine. There are 2 pieces of PCBA in the keyboard control box, one of which is the keyboard touchpad, and the other is the safety control panel under the touchpad. The working principle of the safety control board is as follows: There are safety induction keys at both ends of the PCBA to connect with the ATM machine. When there is external damage / mechanical intrusion, the device senses and transmits the intrusion signal to the safety control core. The BGA starts the self-destruct mode and formats the memory. , ATM automatically shuts down and cannot be restarted. The purpose of this board b...

Claims

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