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Electroplating solution for enhancing electrical conductivity of electronic copper foil, preparation method and electroplating process

A technology of electronic copper foil and electroplating solution, applied in the field of copper foil manufacturing, can solve the problems of long production cycle, environmental pollution, complicated equipment, etc., and achieve the effects of low cost, no environmental pollution, and little pollution

Active Publication Date: 2021-05-11
ANHUI TONGGUAN COPPER FOIL +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] More research work is now focused on the preparation of niobium arsenide thin films. Various techniques such as MBE, CVD, MOCVD, LPE and RF sputtering have been used to prepare niobium arsenide (NbAS) thin films, but most of them have long production cycles and equipment Complexity, high energy consumption, high cost, and environmental pollution, etc., and in the prior art, there is no application of electrodepositing niobium arsenide thin films on copper foil to enhance the conductivity of electronic copper foil

Method used

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  • Electroplating solution for enhancing electrical conductivity of electronic copper foil, preparation method and electroplating process

Examples

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Effect test

preparation example Construction

[0025] A preparation method according to the above-mentioned electroplating solution, in an inert gas environment, a solution mixed with 100 to 150 parts of EMIMCl and 63 to 95 parts of absolute ethanol is put into an electrolytic cell, and no Arsenic trichloride (AsCl) for water treatment 3 ) 1 to 6 parts, anhydrous niobium pentachloride (NbCl 5 ) 2 to 9 parts, 0.3 to 0.8 parts of propylene carbonate, 10 to 20 parts of cationic cellulose, 0.1 to 0.5 parts of 8-hydroxyquinoline, mechanically stirred and ultrasonically stirred for 4 to 12 hours to obtain an electroplating solution.

[0026] A kind of electroplating process according to above-mentioned electroplating solution, comprises the following steps:

[0027] S1: Use electronic copper foil as the cathode, platinum sheet or graphite as the anode, wash with acetone, activate with dilute hydrochloric acid, rinse with deionized water, degrease with acetone, and air dry;

[0028] S2: In an inert gas environment, prepare the ...

Embodiment 1

[0031] The electroplating solution provided by the present embodiment, in parts by mass, 146 parts of EMIMCl, 94 parts of absolute ethanol, 4 parts of anhydrous AsCl 3 , 6 parts of anhydrous NbCl 5 , 12.6 parts of cosolvent, 0.4 part of additive;

[0032] Wherein the co-solvent is 12 parts of cationic cellulose and 0.6 part of propylene carbonate;

[0033] Wherein the additive is 0.4 part of 8-hydroxyquinoline.

[0034] The electroplating solution is prepared according to the following steps: put the mixed solution of EMIMCl and absolute ethanol in the self-made electrolytic cell, and then add anhydrous AsCl to the mixed solution 3 , anhydrous NbCl 5, cationic cellulose, 8-hydroxyquinoline and propylene carbonate, mechanically stirred and ultrasonically stirred for 10 hours to mix uniformly to obtain an electroplating solution.

[0035] The electroplating process of electroplating using this electroplating solution is carried out according to the following steps:

[0036]...

Embodiment 2

[0040] The electroplating solution preparation method and electroplating process steps used in this example are the same as in Example 1, the difference is that the proportions of the components used in this example are different, and the electroplating solution provided in this example is calculated in parts by mass, 100 parts EMIMCl, 63 parts absolute ethanol, 1 part absolute AsCl 3 , 2 parts anhydrous NbCl 5 , 10.3 parts of cosolvent, 0.1 part of additive;

[0041] Wherein the co-solvent is 10 parts of cationic cellulose and 0.3 part of propylene carbonate;

[0042] Wherein the additive is 0.1 part of 8-hydroxyquinoline.

[0043] The preparation method and the electroplating process of the electroplating solution in this embodiment are the same as those in Embodiment 1.

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Abstract

The invention discloses an electroplating solution for enhancing the electrical conductivity of electronic copper foil, a preparation method and an electroplating process. The electroplating solution comprises the following components: a mixed solution of 100-150 parts of 1-ethyl-3-methylimidazolium chloride (EMIMCl) and 63-95 parts of absolute ethyl alcohol (AE) serves as a solvent, and 1-6 parts of anhydrous arsenic trichloride (AsCl3), 2-9 parts of anhydrous niobium pentachloride (NbCl5), 10.3-20.8 parts of a cosolvent and 0.1-0.5 part of an additive serve as solutes. According to the electroplating solution, the preparation method and the electroplating process, a NbAs alloy film layer is electrically deposited on the electronic copper foil, the electrical conductivity of the electronic copper foil is enhanced, the bonding capacity of the prepared NbAs alloy film layer and the electronic copper foil is high, the electrical conductivity and heat conductivity are high, the chemical stability is good, in addition, the process is simple, environmental pollution is avoided, the energy consumption is small, and the repeatability is high.

Description

technical field [0001] The invention relates to the field of copper foil manufacturing, in particular to an electroplating solution for enhancing the conductivity of electronic copper foil, a preparation method and an electroplating process. Background technique [0002] Electronic copper foil is widely used in battery structures, which can effectively improve the adhesion between positive electrode materials and collectors using water-based systems. However, the traditional copper foil production process has low production efficiency and excessive resistance, resulting in poor energy conversion effect and poor electrical conductivity of the product. Poor, short service life, difficult to remove after being damaged, causing environmental damage and other problems that urgently need to be improved, restricting the further development of integrated circuit technology such as chips. [0003] At present, scholars have used niobium chloride, arsenic, and hydrogen to carry out che...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D7/06
CPCC25D3/56C25D7/0614
Inventor 陆冰沪杜荣斌李大双王同刘涛郑小伟贾金涛孙德旺周杰刘励昀吴斌
Owner ANHUI TONGGUAN COPPER FOIL
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