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Polyimide film as well as preparation method and application thereof

A technology of polyimide film and polyamic acid, which is applied in the field of polymer materials and high-frequency polyimide film, can solve the problem of poor water absorption, dielectric constant and dielectric loss limitation of polyimide, and reduce Imide group concentration and other issues, to achieve the effect of increasing flexibility and regularity, low dielectric properties, good heat resistance

Active Publication Date: 2021-06-11
SHANGHAI BAYI SPACE ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Polyimide exhibits good heat resistance due to its unique aromatic ring conjugated structure in its structure, but its high water absorption, dielectric constant and dielectric loss greatly limit other high-frequency and high-speed materials. Applications
[0004] In order to solve the above-mentioned problems such as poor water absorption and poor dielectric properties of polyimide, patent CN109843588A discloses a polyimide film for metal lamination and a polyimide metal laminate using it. Patriotic dianhydrides react with long-chain aromatic diamines to reduce the concentration of imide groups in the molecular structure, and at the same time successfully prepare low dielectric loss and high heat-resistant polyimide films, which can be used at 11.4GHz frequency Realize dielectric loss tangent ≤ 0.007, and the temperature (T5%) at the time of 5% thermal weight loss of the film in nitrogen atmosphere is above 500°C, but there are still problems such as high water absorption and dielectric properties

Method used

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  • Polyimide film as well as preparation method and application thereof
  • Polyimide film as well as preparation method and application thereof
  • Polyimide film as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] Exhaust the reaction vessel with nitrogen in advance, after 30min, add 165.39g N,N-dimethylacetamide (DMAc, remove water with molecular sieve 24h in advance), then add 9.76g (37.5mmol) compound DATP and 2.16g (4.2mmol) compound HFBAPP, stirred at 25°C until completely dissolved; then gradually added 6.13g (20.8mmol) compound BPDA and 11.13g (20.8mmol) compound TABP, and stirred at room temperature for 12h to obtain 15wt% polyimide acid solution.

[0079] After the reaction is over, add acetic anhydride and isoquinoline in equimolar amounts of carboxylic acid groups respectively, add DMAc that has been dehydrated, and adjust to a solution of 10 to 13 wt %; the obtained polyimide acid solution is coated on the On the glass substrate, it was pre-dried at 80°C for 20 minutes, then transferred to the needle plate, and then transferred to the oven, and heat-treated at 150°C / 250°C / 300°C / 350°C for 30 minutes respectively, and thermal imidization was carried out, so as to produc...

Embodiment 2

[0081] Exhaust the reaction vessel with nitrogen in advance. After 30 minutes, add 143.40g of N,N-dimethylacetamide (DMAc, remove water with molecular sieve 24h in advance), and then add 0.98g (3.8mmol) of the compound DATP, 1.94g (3.8mmol) compound HFBAPP and 6.85g (30.0mmol) compound APAB, stirred at 25°C until completely dissolved; then gradually added 5.52g (18.8mmol) compound BPDA and 10.02g (18.8mmol) compound TABP, stirred at room temperature for 12h, Thus, a 15 wt% polyimide acid solution was obtained.

[0082] After the reaction, the obtained polyimide acid solution was coated on the glass substrate with a scraper, pre-dried at 80°C for 30 minutes, then transferred to the needle plate, and then transferred to the oven, respectively, at 150°C / 250°C Heat treatment at 300° C. / 350° C. for 30 minutes for thermal imidization, thereby preparing a polyimide film with a thickness of about 25 μm.

Embodiment 3～15 and comparative example 1～5

[0084] Replace the diamine and dianhydride with the ratios shown in the following Table 1 and Table 2 to carry out resin polymerization respectively, and keep warm at 25-100°C for 1h-12h polymerization to obtain polyamic acid with a solid content of 10-30% solution;

[0085] Then, in the same manner as in Example 1, a 25 μm thick polyimide film was prepared.

[0086] For the polyimide films obtained in Examples and Comparative Examples, the properties of the prepared polyimide films were measured according to the methods described below, and the results are summarized in Table 1 and Table 2.

[0087] (1) Mechanical properties (tensile strength, elongation at break and modulus of elasticity)

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Abstract

The invention relates to a polyimide film as well as a preparation method and application thereof. The polyimide film comprises a repeating unit shown in the following chemical formula (1), structures such as F or CF3, an ether group and an ester group are further introduced into polyimide on the basis of biphenyl, terphenyl and other long-chain frameworks, the concentration of the imide group in the molecular structure is optimized, the flexibility and regularity of a chain segment are effectively improved, and therefore, the polyimide film with low water absorption, low dielectric properties (dielectric constant D and dielectric loss Df), and high heat resistance is realized, wherein Dk<=3.40 and Df<=0.005; meanwhile, the low water absorption rate smaller than or equal to 0.7% and the high heat resistance can be achieved, wherein T5% is larger than 500 DEG C; and the polyimide film is suitable for the fields of high-frequency flexible circuit substrate materials, high-frequency high-speed communication materials and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to the technical field of high-frequency polyimide films. Specifically, it relates to a polyimide film and its preparation method and application. Background technique [0002] With the development of light, thin, portable and multi-functional electronic products, and the high-frequency and high-speed development requirements of signal transmission for information processing, there are not low requirements for the heat resistance of materials. The requirements for dielectric constant and low dielectric loss are becoming more and more stringent, which promotes the further development of low dielectric materials, and has become one of the materials that need to be developed in the high frequency field. [0003] Polyimide exhibits good heat resistance due to its unique aromatic ring conjugated structure in its structure, but its high water absorption, dielectric constant and...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08G73/10C08L79/08
CPCC08J5/18C08G73/1067C08G73/1071C08G73/1039C08G73/1042C08G73/1007C08J2379/08
Inventor 游维涛李磊白蕊王俊杰黄明义
Owner SHANGHAI BAYI SPACE ADVANCED MATERIAL CO LTD
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