Preparation method of high-heat-insulation, high-pressure-resistance, low-density and heat-resistant composite epoxy foam

A low-density, heat-resistant technology, applied in the field of epoxy resin, can solve the problems of difficulty in matching the foaming process, and it is difficult to further improve the heat resistance and compressive strength of epoxy foam, and achieve compressive performance and heat resistance. boosted effect

Active Publication Date: 2021-06-11
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Then through the two key processes of solidification-foaming step-by-step operation and valve opening and closing foaming, increasing the melt strength in the pre-curing stage in the early stage is conducive to the growth of foaming nuclei, and releasing the air pressure in the later stage to prevent the air pressure in the mold cavity from being too high Cause bubbles to coalesce and burst, and eliminate foam internal stress, thus solving the difficult problem of matching epoxy resin curing and foaming processes
On the other hand, graphene oxide is driven to build bubble walls to strengthen and toughen, which solves the problem of cell structure defects existing in the traditional preparation methods of epoxy foam, and the difficulty of further improving the heat resistance and compressive strength of epoxy foam.

Method used

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  • Preparation method of high-heat-insulation, high-pressure-resistance, low-density and heat-resistant composite epoxy foam
  • Preparation method of high-heat-insulation, high-pressure-resistance, low-density and heat-resistant composite epoxy foam
  • Preparation method of high-heat-insulation, high-pressure-resistance, low-density and heat-resistant composite epoxy foam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The organic dispersant is N, N-dimethylformamide, the diisocyanate is toluene diisocyanate, the organometallic catalyst ① is dibutyltin dilaurate, the organometallic catalyst ② is tetraisobutyl titanate, and the epoxy resin is Silicone epoxy resin, diethyl toluene diamine is selected as amine curing agent, 3,3'-disulfonyl hydrazide diphenyl sulfone is selected as foaming agent, octylphenol polyoxyethylene ether is selected as surfactant, toughening The agent is selected from epoxy-based nitrile rubber, and the specific operation steps are as follows:

[0023] (1) Synthesis process of modified graphene oxide: graphene oxide was added to N, N-dimethylformamide to prepare a suspension with a mass fraction of 0.005 g / ml, and the solvent was first dehydrated through 4A molecular sieve. The suspension was subjected to ultrasonic treatment for 1 h to facilitate dispersion, the ultrasonic power was 100 kW, and the temperature of the water bath was 25°C. Then, a mixed solution ...

Embodiment 2

[0033] The organic dispersant is N, N-dimethylformamide, the diisocyanate is toluene diisocyanate, the organometallic catalyst ① is dibutyltin dilaurate, the organometallic catalyst ② is tetraisobutyl titanate, and the epoxy resin is Silicone epoxy resin, diethyl toluene diamine is selected as amine curing agent, 3,3'-disulfonyl hydrazide diphenyl sulfone is selected as foaming agent, octylphenol polyoxyethylene ether is selected as surfactant, toughening The agent is selected from epoxy-based nitrile rubber, and the specific operation steps are as follows:

[0034] (1) Synthesis process of modified graphene oxide: graphene oxide was added to N, N-dimethylformamide to prepare a suspension with a mass fraction of 0.005 g / ml, and the solvent was first dehydrated through 4A molecular sieve. The suspension was subjected to ultrasonic treatment for 1 h to facilitate dispersion, the ultrasonic power was 100 kW, and the temperature of the water bath was 25°C. Then, a mixed solution ...

Embodiment 3

[0042] The organic dispersant is N, N-dimethylformamide, the diisocyanate is toluene diisocyanate, the organometallic catalyst ① is dibutyltin dilaurate, the organometallic catalyst ② is tetraisobutyl titanate, and the epoxy resin is Silicone epoxy resin, diethyl toluene diamine is selected as amine curing agent, 3,3'-disulfonyl hydrazide diphenyl sulfone is selected as foaming agent, octylphenol polyoxyethylene ether is selected as surfactant, toughening The agent is selected from epoxy-based nitrile rubber, and the specific operation steps are as follows:

[0043] (1) Synthesis process of modified graphene oxide: graphene oxide was added to N, N-dimethylformamide to prepare a suspension with a mass fraction of 0.005 g / ml, and the solvent was first dehydrated through 4A molecular sieve. The suspension was subjected to ultrasonic treatment for 1 h to facilitate dispersion, the ultrasonic power was 100 kW, and the temperature of the water bath was 25°C. Then in a nitrogen atmo...

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Abstract

The invention relates to the technical field of epoxy resin, and mainly relates to a preparation method of high-heat-insulation high-pressure-resistance low-density heat-resistant composite epoxy foam. According to the invention, diisocyanate is selected as bridging small molecules to construct an epoxy resin-diisocyanate-graphene oxide trinity foaming precursor, so that oxazolidinone and isocyanurate rigid macrocycles are introduced into a traditional epoxy-curing agent cross-linked network to enhance the heat resistance. Then through two key procedures of curing-foaming step-by-step operation and valve opening and closing type foaming, a pre-curing stage is added in the earlier stage to enhance the melt strength so as to facilitate the growth of a foaming core, and air pressure is released in the later stage to eliminate the internal stress of foam, so that the problem that epoxy resin curing and foaming procedures are difficult to match is solved. On the other hand, graphene oxide is driven to construct a bubble wall for enhancing toughness , and the problem of bubble structure defects in a traditional preparation method of epoxy foam at present and the problem that the heat resistance and compressive strength of the epoxy foam are difficult to further improve are solved.

Description

technical field [0001] The invention relates to the technical field of epoxy resin, and mainly relates to a preparation method of high heat insulation, high pressure resistance and low density heat-resistant composite epoxy foam. Background technique [0002] As a large amount of chemical energy consumption brings serious environmental pollution, climate warming, energy shortage and biodiversity loss and other problems every year, the pursuit of sustainable development has become one of the most important and urgent tasks facing the world. A large amount of energy in life has not been efficiently used due to heat dissipation. Therefore, energy-saving innovations to improve energy efficiency are becoming more and more important. Due to its extremely low thermal conductivity (30-40mW·m -1 ·K -1 ) has received extensive attention from the industry, plays a vital role in energy conservation, and is the key to reducing energy consumption. Polymer foams have good insulating pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/10C08L63/00C08K9/04C08K3/04
CPCC08J9/105C08J9/009C08J2203/04C08J2363/00
Inventor 贾晓龙张晓乐黎何丰王洪涛史可吉早明杨小平
Owner BEIJING UNIV OF CHEM TECH
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