Conductive silver paste for 5G mobile phone antenna and preparation method thereof

A mobile phone antenna and conductive silver paste technology, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as poor printing resolution, short storage time, and poor conductivity

Pending Publication Date: 2021-07-02
SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Domestic products have defects such as poor hardness, poor printing resolution, poor electrical cond...

Method used

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  • Conductive silver paste for 5G mobile phone antenna and preparation method thereof
  • Conductive silver paste for 5G mobile phone antenna and preparation method thereof
  • Conductive silver paste for 5G mobile phone antenna and preparation method thereof

Examples

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Effect test

preparation example Construction

[0053] The second aspect of the present invention provides the preparation method of described 5G mobile phone antenna conductive silver paste, comprising the following steps:

[0054] (1) Resin carrier premix

[0055] Add phenolic resin and aliphatic epoxy resin into the reactor according to the ratio, and gradually heat up to the first temperature, then add propylene glycol methyl ether acetate and isophorone into the reactor in a dropwise manner, and the dropping time 1.5~2h, continue to react for 2~4h after the dropwise addition is completed, then, raise the temperature of the reactor to the second temperature, add ultra-fine flake graphite and fumed silica into the reactor, react for 2~4h and discharge while hot , filtered to obtain the mixed resin carrier, and stored away from light;

[0056] (2) Powder heat treatment

[0057] Pre-disperse flake silver powder, nano-rod silver powder, silver-coated nickel powder and ultra-fine diamond powder, and then place them in a va...

Embodiment 1～5

[0071] A preparation method of conductive silver paste for 5G mobile phone antenna, each component and composition are shown in Table 1. Among them, the mixed carrier of phenolic resin and aliphatic epoxy resin is used as the bonding phase. The formula is: first add the phenolic resin and aliphatic epoxy resin to the reaction kettle, and gradually raise the temperature to 50 ° C, and then add propylene glycol methyl ether acetic acid Ester and isophorone are added dropwise in proportion and then heated and melted; the average particle size of the flake silver powder used is 3.0-5.0 μm; the nano-rod silver powder used is nano-silver powder, which is a core-shell prepared by chemical deposition Structural ultra-fine silver powder, the powder shape is a one-dimensional rod structure, with an average diameter of 50nm to 60nm. Silver-coated nickel powder adopts advanced chemical plating technology to form silver coatings of different thicknesses on the surface of ultra-fine nickel ...

Embodiment 6

[0085] A conductive silver paste for 5G mobile phone antenna is obtained by the following method:

[0086] (1) Weigh each component by the following parts by weight:

[0087]

[0088] (2) Resin carrier premix

[0089] Add phenoxy resin and cycloaliphatic epoxy resin to the reaction kettle, and gradually raise the temperature to 50°C, then add dibasic acid ester, propylene glycol methyl ether acetate and isophorone dropwise into the reaction kettle, drop The reaction time is 1.5 hours. After the dropwise addition is completed, the reaction is continued for 2 hours. Then, the temperature of the reaction kettle is raised to 70°C, and flake graphite is added to the reaction kettle. Keep away from light;

[0090] (3) Powder heat treatment

[0091] Mix flake silver powder, nano-rod silver powder, silver-coated nickel powder and ultra-fine diamond powder and pre-disperse them, then place them in a vacuum oven at 80°C for 3 hours of heat treatment;

[0092] (4) Ingredients

[...

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Abstract

The invention relates to conductive silver paste for a 5G mobile phone antenna and a preparation method thereof. The conductive silver paste comprises the following components in parts by weight: 45-50 parts of flake silver powder, 5-10 parts of nanorod silver powder, 2-5 parts of superfine diamond powder, 10-15 parts of phenoxy resin, 5-10 parts of alicyclic epoxy resin, 5-10 parts of propylene glycol methyl ether acetate, 5-10 parts of isophorone, 0.5-1 part of a cationic curing agent, 0.2-0.5 part of fumed silica and 0.1-0.5 part of superfine flake graphite. The preparation method comprises the steps of resin carrier premixing, powder heat treatment, burdening, high-speed dispersion, three-roller grinding, filtering, finished product detection, homogeneous stirring and canning. Compared with the prior art, the conductive silver paste has the advantages of being low in curing temperature, high in printing resolution, good in conductivity, high in hardness, good in bonding strength and wear resistance, environmentally friendly and the like.

Description

technical field [0001] The invention relates to the technical field of conductive silver paste, in particular to a conductive silver paste for a 5G mobile phone antenna and a preparation method thereof. Background technique [0002] Conductive inks are widely used in printed circuits, semiconductor packaging, solar cells and other fields. Conductive silver paste is the most widely used series of products in conductive ink. Conductive silver paste for 5G mobile phone antenna belongs to silver-based conductive ink, which is composed of silver powder, polymer resin, solvent and curing agent as basic raw materials. PDS is the abbreviation of Printed Direct Structural Technology. The size of this antenna is generally about 30mm×4mm×1.5mm. 5G mobile phone PDS antennas usually use a low-temperature cured silver paste wiring structure. The conductive silver paste for 5G mobile phone antenna is usually printed on the No. 1 PDS antenna position on the edge side of the mobile phone...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 江海涵朱庆明王德龙刘佳禄
Owner SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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