A double dynamic covalent bond hybrid thermosetting resin, preparation method, application and repair recycling method
A thermosetting and resin technology, applied in the field of preparation and hybrid thermosetting polyamide resin, can solve the problems of reducing the alkalinity of imine polymers, low strength of imine polymers, poor mechanical properties, etc., achieving easy separation, low cost, high yield effect
Active Publication Date: 2022-05-10
JIANGNAN UNIV
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Problems solved by technology
[0004] In order to solve the technical problems of poor mechanical properties and water decomposition of existing Schiff base polymers, the present invention introduces hydrazone bonds into the Schiff base polymer network, and through the hydrogen bonding between hydrazone bonds and Schiff bases, the polymer strength
The hydrazone bond contains a strong electron donor (nitrogen atom), which is introduced into the imine polymer network, which reduces the basicity of the imine polymer and prevents the imine from decomposing due to protonation. Electronic hydrazone dynamic covalent bonds and imine dynamic bonds are copolymerized to prepare a dual dynamic thermosetting resin, which solves the problems of low strength and poor water resistance of imine polymers, which is different from the introduction of rigid groups such as benzene rings to strengthen polymers. completely different
Method used
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Embodiment 1
[0040] Put 10 parts of citric acid and 20 parts of thionyl chloride in N 2 Under protection, after stirring at 0°C for 2 hours, add 30 parts of tetrahydrofuran and 5 parts of hydrazine hydrate to react at 50°C for 72 hours, recrystallize in 20 parts of dichloromethane, suction filter and dry to obtain Multifunctional Hydrazide Monomer 1 .
Embodiment 2
[0042] 10 parts of glutaric acid, 15 parts of thionyl chloride in N 2 Under protection, after stirring at 50°C for 10 hours, add 80 parts of chloroform and 30 parts of hydrazine hydrate to react at 25°C for 72 hours, recrystallize in 100 parts of dichloromethane, suction filter and dry to obtain polyhydrazide monomer 2 .
Embodiment 3
[0044] 15 parts of sebacic acid, 15 parts of thionyl chloride in N 2 Under protection, after stirring at 10°C for 12 hours, add 50 parts of tetrahydrofuran and 10 parts of hydrazine hydrate to react at 40°C for 72 hours, recrystallize in 100 parts of dichloromethane, suction filter and dry to obtain polyhydrazide-based monomer 3 .
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Abstract
A double dynamic covalent bond hybrid thermosetting resin, its preparation method, application and repairing recycling method belong to the technical field of thermosetting resin materials. The invention introduces a hydrazone bond into the Schiff base polymer network, and improves the strength of the polymer through the hydrogen bond between the hydrazone bond and the Schiff base. The hydrazone bond contains a strong electron donor (nitrogen atom), which is introduced into the imine polymer network, which reduces the basicity of the imine polymer and prevents the imine from decomposing due to the protonation reaction. Electronic hydrazone dynamic covalent bonds and imine dynamic bonds are copolymerized to prepare a dual dynamic thermosetting resin, which solves the problems of low strength and poor water resistance of imine polymers, which is different from the introduction of rigid groups such as benzene rings to strengthen polymers. completely different. At the same time, the resin also has the properties of repairability and recycling.
Description
technical field [0001] The invention relates to the technical field of thermosetting resin materials, and furthermore, relates to a repairable, recyclable, water-resistant and high-performance hybrid thermosetting polyacrylic resin, a preparation method and an application thereof. Background technique [0002] Thermosetting resins are a class of high-performance polymers that are used in various aspects of life, such as aerospace, high-performance coatings, due to their excellent mechanical strength, excellent thermal stability, excellent chemical resistance and excellent dielectric properties And automotive, microelectronics and other fields. However, most conventional polyimides, such as commercially available DuPont-Kapton polyimide films, epoxy resins, and phenolic resins, are difficult to reprocess and treat with heat or solvents due to their poor solubility and infusibility Recycle. These materials do not degrade rapidly, therefore, disposal of these materials after ...
Claims
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IPC IPC(8): C08G12/40
CPCC08G12/40
Inventor 东为富李广龙李婷汪洋张旭辉夏碧华
Owner JIANGNAN UNIV