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Polyimide composite film with electromagnetic shielding function and preparation method and application thereof

A polyimide, composite film technology, applied in magnetic field/electric field shielding, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve the problem of electromagnetic waves without shielding performance

Pending Publication Date: 2021-07-23
SONGSHAN LAKE MATERIALS LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the insulating properties of PI, it has almost no shielding performance for electromagnetic waves.

Method used

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  • Polyimide composite film with electromagnetic shielding function and preparation method and application thereof
  • Polyimide composite film with electromagnetic shielding function and preparation method and application thereof
  • Polyimide composite film with electromagnetic shielding function and preparation method and application thereof

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preparation example Construction

[0036] In addition, the application also provides a kind of preparation method of above-mentioned polyimide composite film, and it comprises the following steps:

[0037] A. Obtain composite slurry.

[0038] Wherein, the composite slurry is obtained by dispersing components (that is, components constituting the three-dimensional conductive network) in a polyamic acid solution.

[0039] Among them, the polyacid solution can be purchased directly, or obtained through the reaction of diamine and dianhydride.

[0040] Optionally, the polyamic acid solution is obtained by polycondensation of dianhydride and diamine in a polar solvent.

[0041] Wherein, the polycondensation is carried out under ice bath conditions, and the ice bath here means that the polycondensation reaction is kept at -10°C to 10°C.

[0042] Optionally, the polar solvent includes one or more of chloroform, N-methylpyrrolidone, N,N-dimethylformamide and N,N-dimethylacetamide.

[0043]Optionally, the dianhydride...

Embodiment 1

[0058] Diaminodiphenyl ether and pyromellitic dianhydride were dried in an oven at 60°C for 12 hours. Get the diaminodiphenyl ether of 5.332g and join in 500g chloroform, in the there-necked flask, ultrasonically stir for 30min, diaminodiphenyl ether is dissolved completely, then in N 2 Under the protection of the atmosphere, 4.647g of pyromellitic dianhydride was added therein, mechanically stirred in an ice bath for 5h to obtain polyamic acid, and then 0.00998g of three-dimensional graphene with an average particle diameter of 100nm was added to the polyamic acid solution, and mechanically stirred at room temperature Stir for 1 h to obtain polyamic acid / three-dimensional graphene composite slurry, the viscosity of the polyamic acid / three-dimensional graphene slurry is 5 Pa·s. Wherein, the molar ratio of dianhydride and diamine is 0.8:1.

[0059] Clean a glass plate with de-acetone and deionized water and dry in an oven. Then, the polyamic acid / three-dimensional graphene co...

Embodiment 2

[0062] Dry ethylenediamine and tetraacetic dianhydride in an oven at 140°C for 12h. Take 5.332g of ethylenediamine and add it to 40.88g of N,N-dimethylacetamide, stir ultrasonically for 30min in a three-necked flask to completely dissolve ethylenediamine, and then, under Ar atmosphere, dissolve 34.096g of homophenylene Tetraformic acid dianhydride was added therein, mechanically stirred in an ice bath, and 26.28g of three-dimensional graphene with a particle size of 10nm was added to a three-necked flask during the stirring process in an ice bath, and the stirring was continued for 5 hours to obtain polyamic acid / three-dimensional graphene slurry, polyamide The acid / 3D graphene slurry has a viscosity of 100 Pa·s. The molar ratio of dianhydride and diamine is 1.5:1.

[0063] Clean a glass plate with de-acetone and deionized water and dry in an oven. Then, the polyamic acid / three-dimensional graphene composite slurry was coated on the clean glass surface with a film maker, and...

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Abstract

The invention discloses a polyimide composite film with an electromagnetic shielding function and a preparation method and application thereof, which relate to the field of polyimide synthesis. The polyimide composite film comprises a polyimide matrix and a three-dimensional conductive network dispersed in the polyimide matrix. The component forming the three-dimensional conductive network comprises three-dimensional graphene, and the three-dimensional graphene comprises nano carbon particles serving as a substrate and graphene sheets vertically growing on the surfaces of the nano carbon particles. The polyimide composite film has better conductivity, electromagnetic shielding performance, heat resistance and flame retardance, has flexibility, can be applied to electromagnetic shielding elements and / or conductive elements, and is suitable for the fields of communication, medical treatment, flexible electronic devices and the like.

Description

technical field [0001] This application relates to the field of polyimide synthesis, in particular, to a polyimide composite film with electromagnetic shielding function and its preparation method and application. Background technique [0002] Electromagnetic radiation refers to the phenomenon that electromagnetic waves generated by the interactive changes of electric field and magnetic field are emitted or leaked into the air. With the rapid development of the electronic communication industry, especially 5G communication, a large number of emerging electronic and electrical equipment have appeared in every corner of society, providing great convenience for human daily life. However, while human beings enjoy this convenience, they are also suffering from more and more serious harm caused by electromagnetic radiation, which has caused a series of social and environmental problems, such as electromagnetic interference between electronic components, Electromagnetic informatio...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/04C08J5/18H05K9/00H01B1/24
CPCC08J5/18H05K9/0083H01B1/24C08J2379/08C08K3/042C08K3/04C08K2201/001
Inventor 于杰李振伟王恩哥
Owner SONGSHAN LAKE MATERIALS LAB
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