Graphite piece and processing method thereof, single crystal growth equipment

A processing method and technology of graphite parts, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve the problems of graphite thermal field being corroded, etc., to improve the quality of single crystal growth, increase mechanical strength, and reduce crystal extrusion The effect of compressive stress

Active Publication Date: 2022-03-08
CEC COMPOUND SEMICON CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a treatment method for graphite parts, which is used to solve the problem that the graphite pretreatment method in the prior art cannot prevent the crystal from being corroded while preventing the graphite thermal field from being corroded. Problems such as stress caused by graphite or tantalum carbide layer extrusion

Method used

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  • Graphite piece and processing method thereof, single crystal growth equipment
  • Graphite piece and processing method thereof, single crystal growth equipment
  • Graphite piece and processing method thereof, single crystal growth equipment

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Embodiment

[0051] 1. Ultrasonic cleaning the surface of the graphite substrate to remove surface impurities, and drying in an oven at 110°C for 8 hours;

[0052] 2. Coat a layer of phenolic resin on the surface of the dried graphite substrate, and then paste a piece of high-purity graphite paper that matches the shape of the graphite substrate. The thickness of the graphite paper is 0.5mm, and then put the graphite substrate in an oven at 160°C for curing 10h;

[0053] 3. Use tantalum ethoxide and tantalum pentoxide to configure an organic solution with a mass ratio of 1:1, and coat the organic tantalum solution on the surface of the graphite paper. The coating amount of tantalum is 0.15g / mm2, and then put it in a 73°C refrigerator after coating Oven drying for 24 hours;

[0054] 4. Put the graphite substrate into the sintering furnace, and keep sintering for 6 hours when the pressure reaches below 0.01mbar and the temperature reaches 2400°C, that is, a tantalum carbide layer is obtaine...

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Abstract

The invention provides a graphite piece, its processing method, and single crystal growth equipment. The treatment method comprises steps: 1) cleaning and drying the graphite piece; 2) attaching graphite paper matching the shape of the graphite piece on the surface of the dried stone grinding piece, and then curing; 3) coating the organic tantalum solution on the surface of the graphite paper , the coating amount of tantalum is 0.001g / mm 2 -10g / mm 2 , and then sequentially dried and sintered at a high temperature to obtain a cracked tantalum carbide layer on the surface of the graphite paper; the pressure of the high-temperature sintering is below 0.01mbar, the temperature is 1700°C-2500°C, and the high-temperature sintering time is 6h-15h; 4) the The graphite piece formed with the tantalum carbide layer is cooled and put into the silicon-containing material, and the graphite piece is baked for a predetermined time under a preset pressure and a preset temperature. Compared with the prior art, the present invention can ensure that the surface of the prepared graphite parts is not corroded when applied in a thermal field environment, and the prepared graphite parts have considerable strength, which can provide a certain structural support.

Description

technical field [0001] The invention belongs to the field of material preparation, in particular to a graphite piece and its processing method, and a single crystal growth equipment; the graphite piece treated by the method is especially suitable for growing single crystal silicon carbide by PVT method or carbonization by CVD method Epitaxial growth of silicon / gallium nitride etc. Background technique [0002] As the third-generation wide-bandgap semiconductor material, silicon carbide has an irreplaceable role and advantages in high-power and high-voltage scenarios. It has become an important research project for integrated circuit materials in the long-term goal outline, and has unlimited market prospects. At present, the most mainstream method of obtaining silicon carbide substrates at home and abroad is to use the PVT method to prepare single-crystal silicon carbide crystals, and relatively small liquid-phase or gas-phase chemical methods. However, no matter which metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B32/21C30B23/02C30B25/18C30B29/36C30B29/40C04B41/50
CPCC01B32/21C04B41/5057C04B41/50C04B41/009C30B23/025C30B25/183C30B29/36C30B29/406C04B14/024
Inventor 薛卫明马远潘尧波
Owner CEC COMPOUND SEMICON CO LTD
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