Efficient gallium oxide doping method based on unbalanced laser plasma
A laser plasma and plasma technology, which is applied to the field of high-efficiency doping of gallium oxide in plasma, can solve the problems of low doping activation efficiency and high temperature, and achieve the improvement of growth quality, fast growth speed and free carrier concentration. Effect
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[0027] Example one
[0028] Since the gallium oxide material is larger than silicon, germanium, gallium nitride and other semiconductor materials are large, it is difficult to achieve efficient activation through existing process methods, and therefore, this embodiment provides a non-balanced Laser plasma gallium oxide high-efficiency doping method, the method of the present embodiment, using a pulsed laser deposition process (PLD), growing the gallium oxide epitaxial layer on the gallium oxide substrate, resulting in a growth rate of the gallium oxide epitaxial layer Faster, and use laser bombardment to blend the gallium oxide target to obtain a doped gallium oxide plasma, a plasma self-belt energy (kinetic energy and thermal energy), which is easy to activate doping.
[0029] See figure 1 , figure 1 It is a flow chart of an efficient doping method based on the gallium oxide laser plasma provided by the embodiment of the present invention. As shown, the method of the present embo...
Example Embodiment
[0048] Example 2
[0049] In this example, the method of extension of the Sn-doped oxide is an example of the first embodiment, wherein the Sn doping concentration is 4.89 × 10 20 cm -3 .
[0050] Specifically, please refer to Figure 2A-Figure 2B , Figure 2A-Figure 2B It is a process flow diagram of an efficient doping method based on the gallium oxide of a non-balanced laser plasma according to an embodiment of the present invention, as shown, in the present embodiment, the method comprising the steps of:
[0051] Step 1: Put the gallium oxide substrate into a volume ratio of 3: 1 h 2 SO 4 Ho 2 O 2 The mixed solution (eating people in etch) was etched 40s, followed by cleaning three times with deionized water;
[0052] Step 2: Place the gallium oxide substrate after etching into the muffle in an annealing treatment, an annealing temperature of 850 ° C, the temperature rise rate is 10 ° C / min, the annealing time is 10 min, resulting in the surface pre-pretreatment of gallium oxi...
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