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Sealing silica gel and preparation method thereof

A technology of silica gel and preparation steps, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor mechanical properties, poor heat resistance, poor heat dissipation, etc. Bubble efficiency, increase the effect of ventilation holes

Inactive Publication Date: 2021-09-03
张碧军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: the existing electronic silica gel has poor mechanical properties, no wear resistance, poor heat dissipation, and poor heat resistance, which limits its application. In order to solve the above technical problems, the purpose of the present invention is to provide A kind of sealing silica gel and preparation method thereof

Method used

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  • Sealing silica gel and preparation method thereof
  • Sealing silica gel and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0053] (1) Weigh the sepiolite fiber and hydrochloric acid with a mass fraction of 20% according to the mass ratio of 1:10, mix them into a stirred tank, stir and soak at 59°C for 10 hours, and filter and separate to obtain a filter cake after soaking. The filter cake was put into an oven and dried at 220°C for 2 hours to obtain modified sepiolite fibers;

[0054] (2) Mix the above-mentioned modified sepiolite fiber with 30% sodium silicate solution at a mass ratio of 1:10, put it into an ultrasonic oscillator, and immerse it in an ultrasonic oscillator at a frequency of 35 kHz for 3 hours. Finally, filter and separate to obtain the filter residue, then put the filter residue in hydrochloric acid with a concentration of 0.5mol / L, and immerse for 2 hours. After the reaction, filter and separate to obtain the filter cake, put the filter cake in an oven, and dry it at 205°C for 5 hours. Obtain self-made anti-thermal shock heat dissipation filler;

[0055] (3) Mix 2,6-di-tert-but...

Embodiment 2

[0062] (1) Weigh the sepiolite fiber and hydrochloric acid with a mass fraction of 20% according to the mass ratio of 1:10, mix them into a stirred tank, stir and soak at 59°C for 10 hours, and filter and separate to obtain a filter cake after soaking. The filter cake was put into an oven and dried at 220°C for 2 hours to obtain modified sepiolite fibers;

[0063] (2) Mix the above-mentioned modified sepiolite fiber with 30% sodium silicate solution at a mass ratio of 1:10, put it into an ultrasonic oscillator, and immerse it in an ultrasonic oscillator at a frequency of 35 kHz for 3 hours. Finally, filter and separate to obtain the filter residue, then put the filter residue in hydrochloric acid with a concentration of 0.5mol / L, and immerse for 2 hours. After the reaction, filter and separate to obtain the filter cake, put the filter cake in an oven, and dry it at 205°C for 5 hours. Obtain self-made anti-thermal shock heat dissipation filler;

[0064] (3) Mix 2,6-di-tert-but...

Embodiment 3

[0071] (1) Weigh the sepiolite fiber and hydrochloric acid with a mass fraction of 20% according to the mass ratio of 1:10, mix them into a stirred tank, stir and soak at 59°C for 10 hours, and filter and separate to obtain a filter cake after soaking. The filter cake was put into an oven and dried at 220°C for 2 hours to obtain modified sepiolite fibers;

[0072] (2) Mix the above-mentioned modified sepiolite fiber with 30% sodium silicate solution at a mass ratio of 1:10, put it into an ultrasonic oscillator, and immerse it in an ultrasonic oscillator at a frequency of 35 kHz for 3 hours. Finally, filter and separate to obtain the filter residue, then put the filter residue in hydrochloric acid with a concentration of 0.5mol / L, and immerse for 2 hours. After the reaction, filter and separate to obtain the filter cake, put the filter cake in an oven, and dry it at 205°C for 5 hours. Obtain self-made anti-thermal shock heat dissipation filler;

[0073] (3) Mix 2,6-di-tert-but...

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Abstract

The invention relates to a sealing silica gel and a preparation method thereof, and belongs to the technical field of electronic sealant preparation. The preparation method comprises the following steps: by taking sepiolite fibers as a raw material, carrying out acid leaching modification to destroy a magnesium oxide octahedral layer part to dissolve out magnesium so as to increase the pore volume and porosity of the sepiolite fibers, and then adsorbing sodium silicate by utilizing the modified sepiolite fibers so as to adsorb and immobilize the sodium silicate in the internal pores of the modified sepiolite fibers, putting the modified sepiolite fibers adsorbing sodium silicate into hydrochloric acid, enabling the hydrochloric acid and sodium silicate to react to generate orthosilicic acid gel which is fixed in internal pores of the sepiolite fibers, and finally drying the sepiolite fibers at high temperature to evaporate water in the orthosilicic acid gel in the pores, forming and fixing the porous dry solid gel in the internal pores of the sepiolite fiber, finally preparing the self-made thermal shock resistant heat dissipation filler, and matching the self-made foaming agent and the self-made heat-resistant antioxidant to finally prepare the sealing silica gel with wear resistance, heat resistance and fast heat dissipation, wherein the use effect is extremely good.

Description

technical field [0001] The invention relates to a sealing silica gel and a preparation method thereof, belonging to the technical field of electronic sealant preparation. Background technique [0002] At present, in the field of electronics, it is very important to provide long-term and reliable protection for many precise and demanding sensitive circuits and components. The application of epoxy resin and polyurethane is greatly affected by the external environment, especially the influence of external temperature. Epoxy resin is easy to embrittle, and polyurethane has insufficient high temperature resistance. When the temperature is high, the structure is unstable. Compared with the above two products, the biggest advantage of electronic silica gel is temperature stability, which can maintain good physical and electrical properties in a relatively wide range of temperature and humidity. Therefore, it is usually used as an electrical insulator, and electronics are not easily...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J183/07C09J11/04C09J11/06C08J9/30C08L83/04C08L83/07
CPCC09J183/04C09J11/04C09J11/06C08J9/30C08L2205/025C08L2201/08C08J2383/04C08J2483/07C08L83/04C08K9/02C08K7/10C08K9/12C08K3/34C08K5/18C08K5/053C08K13/06
Inventor 张碧军
Owner 张碧军
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