Improved multilayer circuit board and manufacturing method thereof

A multi-layer circuit board and manufacturing method technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, circuit lamination, etc., can solve the problems of outer layer copper foil wrinkles, poor flatness, etc., to ensure yield and flatness High, guaranteed quality effect

Pending Publication Date: 2021-10-19
DIGITAL PRINTED CIRCUIT BOARD CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the present invention provides an improved multilayer circuit board and its manufacturing meth

Method used

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  • Improved multilayer circuit board and manufacturing method thereof

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[0027] Example 1

[0028] refer to figure 1 shown:

[0029] A manufacturing method of a multilayer circuit board, comprising the following steps:

[0030] S1 Production of the first inner layer board: prepare the first inner layer board 6, the upper and lower ends of the first inner layer board 6 are electroplated, dry filmed and etched to form the first inner layer copper foil 5 and the second inner layer copper foil 7 respectively , the residual copper ratio of the first inner layer copper foil 5 and the second inner layer copper foil 7 after etching is 56%;

[0031] S2 Second inner layer board production: prepare the second inner layer board 12, the upper and lower ends of the second inner layer board 12 are electroplated, dry filmed and etched to form the third inner layer copper foil 11 and the fourth inner layer copper foil 13 respectively , the residual copper rate of the third inner layer copper foil 11 after etching is 51%, and the residual copper rate of the fourt...

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Abstract

The invention discloses an improved multilayer circuit board and a manufacturing method thereof. The improved multilayer circuit board comprises a multilayer circuit board. The multilayer circuit board comprises a first outer-layer copper foil, a first glass fiber PP layer, a second glass fiber PP layer, a third glass fiber PP layer, a first inner-layer copper foil, a first inner-layer plate, a second inner-layer copper foil, a fourth glass fiber PP layer, a fifth glass fiber PP layer, a first PP layer, a third inner-layer copper foil, a second inner-layer plate, a fourth inner-layer copper foil, a second PP layer, a sixth glass fiber PP layer, a seventh glass fiber PP layer, a fifth inner-layer copper foil, a third inner-layer plate, a sixth inner-layer copper foil, an eighth glass fiber PP layer, a ninth glass fiber PP layer, a tenth glass fiber PP layer and a second outer-layer copper foil which are sequentially stacked from top to bottom. The multilayer circuit board is manufactured through the procedures of first inner-layer plate manufacturing, second inner-layer plate manufacturing, third inner-layer plate manufacturing, pressing, copper reduction, film drying and etching. According to the improved multilayer circuit board and the manufacturing method thereof, the problems that the flatness is poor and the outer copper foil is wrinkled after the multilayer circuit board is laminated can be solved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an improved multilayer circuit board and a manufacturing method thereof. Background technique [0002] A circuit board, also known as a printed circuit board, is the provider of electrical connections for electronic components. Its development has a history of more than 100 years, and its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. According to the number of layers of circuit boards, printed circuit boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] Multilayer circuit boards are usually made of single-layer boards and PP boards. In order to improve the strength, heat resistance, hardness and dimensional stability between the boa...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K3/06H05K3/46H05K1/02
CPCH05K3/022H05K3/061H05K3/4611H05K1/0298H05K2203/05H05K2203/06H05K2201/0335
Inventor 张涛王锋
Owner DIGITAL PRINTED CIRCUIT BOARD CO LTD
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