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Polyimide precursor, resin composition comprising same, polyimide resin film, resin film, and method for producing same

A technology of polyimide precursor and resin composition, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve the problems that are difficult to use in fields requiring transparency and low light transmittance in the visible light region and other problems, to achieve the effect of excellent laser peeling, low yellowness, and less warping

Pending Publication Date: 2021-10-26
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, general polyimide resins, including the polyimides described in the above documents, are colored brown or yellow due to their high electron density, and therefore have low light transmittance in the visible light region, making it difficult to use them in demanding applications. domain of transparency

Method used

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  • Polyimide precursor, resin composition comprising same, polyimide resin film, resin film, and method for producing same
  • Polyimide precursor, resin composition comprising same, polyimide resin film, resin film, and method for producing same
  • Polyimide precursor, resin composition comprising same, polyimide resin film, resin film, and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

manufacture example

[0314] figure 1 It is a schematic diagram showing the structure above the polyimide substrate of a top-emission type flexible organic EL display as an example of the display of this embodiment.

[0315] against figure 1 The organic EL structure part 25 will be described. In the organic EL structure part 25, for example, an organic EL element 250a emitting red light, an organic EL element 250b emitting green light, and an organic EL element 250c emitting blue light are used as a unit, and are arranged in a matrix, and the partition walls (bank) 251 to define the light emitting area of ​​each organic EL element. Each organic EL element is composed of a lower electrode (anode) 252 , a hole transport layer 253 , a light emitting layer 254 , and an upper electrode (cathode) 255 . In addition, a plurality of TFTs 256 ( It is selected from low-temperature polysilicon (LTPS), metal oxide semiconductor (IGZO, etc.), interlayer insulating film 258 having contact hole 257 , and low...

Embodiment

[0328] Hereinafter, the present invention will be described in more detail based on examples, but these are described for explanation, and the scope of the present invention is not limited to the following examples.

[0329] Various evaluations in Examples and Comparative Examples were performed as follows.

[0330]

[0331] Weight average molecular weight (Mw) and number average molecular weight (Mn) were measured by gel permeation chromatography (GPC) under the following conditions.

[0332] As a solvent, N,N-dimethylformamide (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography) was used, and 24.8 mmol / L of lithium bromide monohydrate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added immediately before measurement. , purity of 99.5%) and 63.2 mmol / L phosphoric acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., for high performance liquid chromatography) and dissolved therein). A ...

Synthetic example 1(1-1

[0380] 90.00 g of N-methyl-2-pyrrolidone (NMP) was dropped into a 500 ml separable flask replaced with nitrogen, and 11.30 g (49.5 mmol) of 4-aminophenyl-4-aminobenzoate (APAB), 4,4-Azodiphenylamine (AzBz) 1.06 mg (5.0 μmоl) was stirred to dissolve APAB and AzBz. Thereafter, 14.7 g (50 mmol) of biphenyl-3,3', 4,4'-tetracarboxylic dianhydride (BPDA) and 13.25 g of N-methyl-2-pyrrolidone (NMP) were added to form the polyamic acid The concentration was adjusted so as to be 20% by mass, and the polymerization reaction was performed under a nitrogen stream at 80° C. and stirring for 3 hours. Then, it cooled to room temperature and obtained the NMP solution (it is also hereafter called the varnish containing a polyimide precursor) of a polyamic acid. The weight average molecular weight (Mw) of the obtained polyamic acid was about 100,000.

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Abstract

A polyimide precursor, a resin composition comprising the same, a polyimide resin film, a resin film, and a method for manufacturing the same. Provided are: a polyimide resin film which has low residual stress, little warpage, low yellowness (YI value) at high temperatures (particularly 430 DEG C or higher), low haze (Haze value), and excellent laser peelability from a substrate; and a method for producing the polyimide resin film. A polyimide precursor comprising: (a1) a structural unit L represented by general formula (1); and (a2) a structural unit M represented by general formula (2). The ratio of the amount of the structural unit M to the total amount of the structural unit L and the structural unit M is 0.005-0.5 mol%.

Description

technical field [0001] The present invention relates to a polyimide precursor and a resin composition containing the same, a polyimide resin film, a resin film, and a manufacturing method thereof, which are used in the manufacture of, for example, substrates for flexible devices. Background technique [0002] Generally, a film of polyimide resin is used as the resin film in applications requiring high heat resistance. General polyimide resins are produced by solution-polymerizing aromatic carboxylic acid dianhydrides and aromatic diamines to produce polyimide precursors, which are thermally imidized at high temperatures or chemically processed using catalysts. High heat-resistant resin produced by imidization. [0003] Polyimide resin is a super heat-resistant resin that does not dissolve or melt, and has excellent properties such as thermal oxidation resistance, heat resistance, radiation resistance, low temperature resistance, and chemical resistance. Therefore, polyimid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18H01L51/56H01L27/32G09F9/30
CPCC08G73/1067C08G73/1064C08G73/1007C08G73/1039C08J5/18G09F9/301C08J2379/08H10K59/12H10K77/111H10K59/1201H10K71/00Y02E10/549
Inventor 加藤聪佐藤雄太
Owner ASAHI KASEI KK
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