Method for inhibiting Laves phase precipitation in nickel-based alloy laser additive manufacturing process
A nickel-based alloy and laser additive technology, which is applied in the direction of additive manufacturing, additive processing, and improvement of process efficiency, can solve problems such as high maintenance costs, low cost performance, and cumbersome on-site repairs, and achieve reduction in size and volume fraction , increase the front temperature gradient, and promote the effect of solid solution
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[0031] Example 1:
[0032] 1) selection of Inconel 718 superalloy as the substrate 2, the surface with sandpaper, and then remove its oil alcohol solution. The prepared powder was placed in an oven-specific removal of water for half an hour, after drying was placed in a boiling-type powder feeder, by way of coaxial powder.
[0033] 2) Use test 2000W semiconductor laser cladding, the spot diameter of the laser beam of the semiconductor laser emitted from the laser processing head 3 to 4mm; selected process as follows: 900W laser power, the scanning speed of 360mm / s, powder feed rate 10g / min. Protective gas and the carrier gas flow rate of 15L / min.
[0034] 3) by the cooling medium is liquid nitrogen cooling device 2 substrate 1, base substrate is cooled to reduce the heat accumulation in the forming process.
[0035] 4) determining a forming position, the position and orientation of the device of three copper tubes chilled adjust sync suppression, an air-cooled open the valve...
Example Embodiment
[0037] Example 2:
[0038] 1) selection of Inconel 625 as the substrate 2, the surface with sandpaper, and then remove its oil alcohol solution.
[0039] 2) The prepared powder was placed in an oven-specific removal of water for half an hour, after drying is placed in a blade-type powder feeder, by way of coaxial powder.
[0040] 3) using a semiconductor laser cladding 2000W, the spot diameter of the laser beam of the semiconductor laser emitted from the laser processing head 3 to 4mm; selected process as follows: 1600W laser power, the scanning speed of 420mm / s, powder feed rate 10g / min.
[0041] 4) determining a forming position, the position and orientation of the device of three copper tubes chilled adjust sync suppression, an air-cooled open the valve; regulating the flow of 3L / min, until the end of Additive process.
[0042] 5) After molding, the sample is cut line, mosaic, coarse grinding, fine grinding, polishing after etching Watch case where a series of processes. ...
Example Embodiment
[0043] Example 3:
[0044] 1) selection of Inconel 939 as the substrate 2, the surface with sandpaper, and then remove its oil alcohol solution.
[0045] 2) The prepared powder was placed in special dryers remove water for half an hour, after drying is placed in a blade-type powder feeder, by way of coaxial powder.
[0046] 3) using a semiconductor laser cladding 2000W, the spot diameter of the laser beam of the semiconductor laser emitted from the laser processing head 3 to 4mm; selected process as follows: 1800W laser power, the scanning speed of 420mm / s, powder feed rate 15g / min.
[0047] 4) determining a forming position, the position and orientation of the device of three copper tubes chilled adjust sync suppression, an air-cooled open the valve; regulating the flow of 20L / min, until the end of Additive process.
[0048] 5) After molding, the sample is cut line, mosaic, coarse grinding, fine grinding, polishing after etching Watch case where a series of processes.
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