Check patentability & draft patents in minutes with Patsnap Eureka AI!

High-conductivity copper paste, preparation method, flexible high-conductivity copper film and application of flexible high-conductivity copper film

A high-conductivity, copper paste technology, applied in the field of preparation, flexible high-conductivity copper film, and high-conductivity copper paste, can solve the problems of anti-oxidation technology that needs to be broken through, copper powder is easily oxidized, affecting product performance, etc., and achieves cost-effective green environmental protection , The effect of uniform film resistance distribution and low cost

Pending Publication Date: 2021-11-26
XIAMEN UNIV +1
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper powder is easily oxidized. In the existing technology, even if the oxide layer on the copper surface is removed in advance or a substance that can remove the oxide layer on the copper surface is added to the slurry, the surface of the copper material is still relatively easy to be oxidized after the copper paste is cured. Lead to poor conductivity and affect product performance
The existing anti-oxidation technology of copper powder and copper paste needs to be broken through, and related applications can be promoted

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-conductivity copper paste, preparation method, flexible high-conductivity copper film and application of flexible high-conductivity copper film
  • High-conductivity copper paste, preparation method, flexible high-conductivity copper film and application of flexible high-conductivity copper film
  • High-conductivity copper paste, preparation method, flexible high-conductivity copper film and application of flexible high-conductivity copper film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Take 110 parts of cardanol-modified novolac resin, add 5 parts of propylene glycol diethyl ester, perform homogenization treatment (revolution at 1000 rpm, time 3 minutes), defoam, and place in an oven at 40°C for 1 hour to obtain resin blend 1.

[0050] Take 20 parts of the above-mentioned resin blend 1, 13 parts of isobutanolamine and 15 parts of triethanolamine, homogenize, homogeneously revolve at 1000rpm for 2min, add 100 parts of the above-mentioned anti-oxidation copper powder C-1 and 24 parts of ethylene glycol Alcohol monobutyl ether, homogenized, homogeneous revolution 1400rpm, time 2min, to obtain a coarse slurry; the coarse slurry was ground with a three-roll mill, and the roll spacing was adjusted to 50μm, 30μm and 10μm in turn to obtain high-conductivity copper Pulp, denoted as P-1.

[0051] Such as figure 1 as shown, figure 1 It is the physical picture of the highly conductive anti-oxidation copper paste P-1 of the present invention.

Embodiment 2

[0053] Take 20 parts of cardanol-modified novolac resin, 5 parts of isobutanolamine and 5 parts of triethanolamine, homogenize, homogeneous revolution 1000rpm, time 3min, add 100 parts of the above anti-oxidation copper powder C-1 and 25 parts of B Glycol monomethyl ether, homogenize, homogeneous revolution 1400rpm, time 2min, to obtain a coarse slurry; the coarse slurry is then ground with a three-roll mill, and the roll spacing is adjusted to 50μm, 30μm and 10μm in turn to obtain high-conductivity copper Pulp, denoted as P-2.

Embodiment 3

[0055] Take 30 parts of octylphenol-modified novolak resin, add 1.6 parts of propylene glycol dimethyl ester, revolutionize 1000rpm homogenize for 2min, add 10 parts of isobutanolamine and 8 parts of N-methyldiethanolamine, and then revolutionize 1000rpm homogenize for 2min, Add 100 parts of the above anti-oxidation copper powder C-2 and 20 parts of ethylene glycol monomethyl ether, homogenize, homogeneous revolution 1400rpm, time 2min, to obtain a coarse slurry; the coarse slurry is then ground with a three-roll mill, The roll distance was adjusted to 50 μm, 30 μm and 10 μm in turn to obtain a high-conductivity copper paste, which was denoted as P-3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Resistivityaaaaaaaaaa
Resistivityaaaaaaaaaa
Resistivityaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of conductive materials, and relates to high-conductivity copper paste, a preparation method, a flexible high-conductivity copper film and application of the flexible high-conductivity copper film. The high-conductivity copper paste consists of the following raw material components: 100 parts of antioxidant micron copper powder, 15-30 parts of phenolic resin, 10-40 parts of a curing agent and 10-80 parts of an organic solvent, and can further comprise an organic ester compound additive. The high-conductivity copper paste has the advantages of low resistivity, good consistency, bending resistance and good stability in different environments after being cured to form a film, and can be widely applied to flexible products.

Description

technical field [0001] The invention belongs to the technical field of conductive materials, and relates to a high-conductivity copper paste, a preparation method, a flexible high-conductivity copper film and applications thereof. Background technique [0002] More and more flexible electronics such as folding screen mobile phones and curved screen e-books have received a lot of attention and research due to their wide range of application scenarios, and the flexible conductive design of their core components is the key to device preparation. There are currently two main strategies for flexible conductive design: [0003] First, the flexibility of rigid inorganic materials is achieved through the micro-nano structure design of materials. When the size of the material is reduced to the micro-nano scale, the hard material itself will show bendable and flexible characteristics. Generally, it can be achieved by vapor deposition, electroplating, Calendering, stretching, evaporat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01B1/22H01B13/00H01B5/14
CPCH01B1/22H01B13/00H01B5/14
Inventor 吴炳辉刘池敏郑南峰
Owner XIAMEN UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com