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Stripping layer treating fluid and preparation method of strippable carrier-attached ultrathin copper foil

A technology of ultra-thin copper foil and treatment liquid, applied in the electrolysis process, electroforming and other directions, can solve the problems of toxicity, high price, human body harm, etc., and achieve the effect of low cost, stable quality and stable peeling

Active Publication Date: 2022-01-04
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inorganic peeling layer is mainly a metal layer or an alloy layer; the composite peeling layer often uses an organic layer and an alloy layer as the peeling layer, and the alloy layer contains rare earth metals, and the price is relatively high; the organic peeling layer is usually made of benzotriazole, benzene The treatment film of organic substances such as imidazole and thiocyanuric acid and their derivatives. These organic substances are mostly used in the preparation process of ultra-thin copper foil with a carrier, but most of them have certain toxicity. Unavoidable hazards to humans and the environment

Method used

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  • Stripping layer treating fluid and preparation method of strippable carrier-attached ultrathin copper foil

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A method for preparing a peelable ultra-thin copper foil with a carrier, comprising the steps of:

[0029] S1 Preparation of peeling layer treatment solution: Dissolve copper sulfate, zinc sulfate, and potassium pyrophosphate in water respectively, mix after clarification, add additive A solution and additive B solution, and adjust pH value and solution temperature.

[0030] Additive A solution is a mixed aqueous solution of cysteine ​​8g / L, sodium tungstate 5g / L, potassium iodide 6g / L, pH 9.0; additive B solution is nickel sulfate 65g / L, ferrous sulfate 20g / L, coke Potassium phosphate 90g / L mixed aqueous solution.

[0031] In this peeling layer treatment solution, the copper sulfate concentration is 7g / L, the zinc sulfate concentration is 8g / L, and the potassium pyrophosphate concentration is 45g / L. In every liter of the peeling layer treatment solution, the additive A solution volume is 200mL, and the additive B solution volume is 600mL . Adjust the pH value to 10.5...

Embodiment 2

[0036] A method for preparing a peelable ultra-thin copper foil with a carrier, comprising the steps of:

[0037] S1 Preparation of peeling layer treatment solution: Dissolve copper sulfate, zinc sulfate, and potassium pyrophosphate in water respectively, mix after clarification, add additive A solution and additive B solution, and adjust pH value and solution temperature.

[0038] Among them, additive A solution is a mixed aqueous solution of methionine 6g / L, sodium tungstate 6g / L, potassium iodide 8g / L, and pH value 9.0; additive B solution is cobalt sulfate 35g / L, zinc sulfate 20g / L, sulfuric acid A mixed aqueous solution of iron 8g / L, potassium sodium tartrate 20g / L, and potassium pyrophosphate 130g / L.

[0039] In this peeling layer treatment solution, the copper sulfate concentration is 9g / L, the zinc sulfate concentration is 9g / L, and the potassium pyrophosphate concentration is 70g / L. In every liter of the peeling layer treatment solution, the additive A solution volume...

Embodiment 3

[0044] A method for preparing a peelable ultra-thin copper foil with a carrier, comprising the steps of:

[0045] S1 Preparation of peeling layer treatment solution: Dissolve copper sulfate, zinc sulfate, and potassium pyrophosphate in water respectively, mix after clarification, add additive A solution and additive B solution, and adjust pH value and solution temperature.

[0046] Among them, the additive A solution is a mixed aqueous solution of valine 11g / L, sodium tungstate 4g / L, potassium iodide 4g / L, and pH 9.0; the additive B solution is nickel sulfate 40g / L, cobalt sulfate 15g / L, pyrophosphoric acid Potassium 85g / L mixed aqueous solution.

[0047]In this peeling layer treatment solution, the copper sulfate concentration is 4g / L, the zinc sulfate concentration is 5g / L, and the potassium pyrophosphate concentration is 90g / L. In every liter of the peeling layer treatment solution, the additive A solution volume is 150mL, and the additive B solution volume is 300mL , pH v...

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Abstract

The invention relates to a stripping layer treating fluid and a preparation method of a strippable carrier-attached ultrathin copper foil. The stripping layer treating fluid comprises a mixed aqueous solution of copper sulfate, zinc sulfate and potassium pyrophosphate, an additive A solution and an additive B solution, wherein the additive A solution is a mixed aqueous solution of amino acid, sodium tungstate and potassium iodide; the additive B solution is a mixed aqueous solution containing at least two of soluble nickel, cobalt, iron, molybdenum and zinc salts. The strippable carrier-attached ultrathin copper foil is prepared by the following steps of S1, preparing the stripping layer treating fluid; S2, pretreating a carrier copper foil; S3, electro-depositing a nano metal layer; and S4, electro-depositing an ultrathin copper foil. The preparation materials are easy to obtain, low in cost, green, safe and environmental-friendly; the method is simple in process, high in operability, stable in quality of a treatment layer, moderate in binding force between an ultrathin copper foil layer and a carrier copper foil layer before and after high-temperature hot pressing, stable stripping can be achieved, and a basis can be provided for subsequent industrial production of the carrier-attached ultrathin copper foil.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil preparation, and in particular relates to a preparation method of a peeling layer treatment solution and a peelable ultra-thin copper foil with a carrier. Background technique [0002] Printed Circuit Board (PCB for short) is an important part of electronic products. With the development of electronic products in the direction of light, thin, short, small, multi-functional and high added value, copper foil as the main raw material of PCB It is also developing in a thinner and thinner direction. The thinner the copper foil, the more difficult it is to produce, and it is easy to wrinkle and tear during transportation. The production technology of ultra-thin copper foil has become a research hotspot. [0003] In order to solve problems such as wrinkles and tears, ultra-thin copper foil is mostly prepared by attaching a carrier. Most of the ultra-thin copper foil with carrier usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/22C25D1/20C25D1/04
CPCC25D1/22C25D1/20C25D1/04
Inventor 孙云飞王学江王先利王其伶范翠玲张艳卫姜大鹏刘丽娟
Owner SHANDONG JINBAO ELECTRONICS