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Rapid leveling ultra-thin grid adhesive tape and preparation method thereof

A grid, ultra-thin technology, used in adhesives, pressure-sensitive films/sheets, film/sheet release liners, etc. Combines fast leveling, excellent temperature resistance, and high fit

Active Publication Date: 2022-01-25
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With ordinary ultra-thin double-sided adhesive tape, due to the poor venting property of the tape itself, air bubbles will be generated when it is bonded to the graphite sheet in a large area, resulting in weak bonding of the graphite sheet, delamination at high temperature, and a decrease in thermal conductivity
[0003] Some of the existing grid tapes in the market have excellent exhaust performance, but the exhaust channels on the adhesive layer will reduce the contact area between the glue and the object to be pasted, reducing the stickiness of the grid tape
And due to the thickness limit of the tape itself, the adhesive layer on the tape is thin, and the exhaust channel cannot disappear through the flow of the adhesive layer itself after the graphite is pasted. After high temperature, the graphite is prone to delamination.
[0004] Patent CN202010213880.6 discloses a preparation method of ultra-thin grid glue, which is to increase the Tg of the entire formula system by adding a tackifying resin with a high softening point, so that the tape has good temperature resistance; but this method The disadvantage is that the grid adhesive cannot be quickly leveled; and the patent discloses the production of double-sided adhesive with a thickness of 8-20 μm. This type of double-sided adhesive generally cannot be used on graphite heat dissipation components.

Method used

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  • Rapid leveling ultra-thin grid adhesive tape and preparation method thereof
  • Rapid leveling ultra-thin grid adhesive tape and preparation method thereof
  • Rapid leveling ultra-thin grid adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A preparation method for fast leveling ultra-thin grid tape, comprising the following steps:

[0046] S1. In parts by mass, 100 parts of acrylic pressure-sensitive adhesive, 8 parts of tackifying resin, 1 part of curing agent, and 200 parts of solvent were mixed and stirred, and ultrasonically dispersed to obtain a coating mixture;

[0047] Acrylic pressure sensitive adhesive, glass transition temperature (Tg) at -15°C, weight average molecular weight M W It is 457800, the molecular weight distribution is 2.2; the normal temperature is 23°C, the storage modulus G' is 33086Pa, and the loss factor tanδ is 0.67; the high temperature is 85°C, the storage modulus G' is 10056Pa, and the loss factor tanδ is 0.61;

[0048] Tackifying resin is terpene resin; curing agent is polyisocyanate; solvent is ethyl acetate;

[0049] S2. Coating the coating mixture in step S1 on the release surface of the grid release film, drying and curing in 8 temperature zones, to obtain the pressure...

Embodiment 2

[0056] A preparation method for fast leveling ultra-thin grid tape, comprising the following steps:

[0057] S1. In parts by mass, 100 parts of acrylic pressure-sensitive adhesive, 12 parts of tackifying resin, 2 parts of curing agent, and 300 parts of solvent were mixed and stirred, and ultrasonically dispersed to obtain a coating mixture;

[0058] Acrylic pressure sensitive adhesive, glass transition temperature (Tg) at -30°C, weight average molecular weight M W It is 425100, the molecular weight distribution is 2.3; the normal temperature is 23°C, the storage modulus G' is 38021Pa, and the loss factor tanδ is 0.63; the high temperature is 85°C, the storage modulus G' is 12574Pa, and the loss factor tanδ is 0.63;

[0059] Tackifying resin is petroleum resin; curing agent is epoxy curing agent; solvent is toluene;

[0060] S2. Coating the coating mixture in step S1 on the release surface of the grid release film, drying and curing in 8 temperature zones, to obtain the pressu...

Embodiment 3

[0067] A preparation method for fast leveling ultra-thin grid tape, comprising the following steps:

[0068] S1. In parts by mass, 100 parts of acrylic pressure-sensitive adhesive, 25 parts of tackifying resin, 3 parts of curing agent, and 500 parts of solvent were mixed and stirred, and ultrasonically dispersed to obtain a coating mixture;

[0069] Acrylic pressure sensitive adhesive, glass transition temperature (Tg) at -34°C, weight average molecular weight M W It is 389100, the molecular weight distribution is 1.9; the normal temperature is 23°C, the storage modulus G' is 41245Pa, and the loss factor tanδ is 0.68; the high temperature is 85°C, the storage modulus G' is 13841Pa, and the loss factor tanδ is 0.64;

[0070] Tackifying resin is rosin resin; curing agent is polyisocyanate; solvent is toluene;

[0071] S2. Coating the coating mixture in step S1 on the release surface of the grid release film, drying and curing in 8 temperature zones, to obtain the pressure-sensi...

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Abstract

The invention provides a quick-leveling ultra-thin grid adhesive tape and a preparation method thereof. Acrylic pressure-sensitive adhesive and the tackifying resin are utilized and matched with a unique grid release film, so that the prepared grid adhesive tape can be rapidly leveled and has excellent adhesive property and temperature resistance. Phenyl is introduced into linear polysiloxane with a fluorine-containing group on a side chain to prepare modified fluorosilicone oil, then tackifying resin is modified and then added into the grid adhesive tape, and the temperature resistance and aging resistance of the adhesive tape are greatly improved. The modified tackifying resin is added into the adhesive tape, the molar weight of the added fluorine group and phenyl group is limited, and the wear-resistant protection stability of the adhesive tape is improved, so that the mechanical property and temperature resistance of the prepared adhesive tape are greatly improved because of the unique process design.

Description

technical field [0001] The invention relates to the field of grid tape preparation, in particular to a fast leveling ultra-thin grid tape and a preparation method thereof. Background technique [0002] In recent years, the electronics industry has developed rapidly, and smart electronic products such as mobile phones are being updated faster and faster. The pursuit of thinner and lighter bodies, narrow frames and excellent performance experience is getting higher and higher; but it is accompanied by the problem of heat dissipation in mobile phones. , At present, graphite heat sinks are mainly used inside the fuselage, and the superposition of multi-layer graphite relies on the bonding of ultra-thin double-sided tape. With ordinary ultra-thin double-sided tape, due to the poor venting property of the tape itself, air bubbles will be generated when it is bonded to a large area of ​​graphite sheet, resulting in weak bonding of graphite sheet, delamination at high temperature, a...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/38C09J7/40C09J11/08C09J133/00
CPCC09J7/255C09J7/385C09J7/40C09J133/00C09J11/08C09J2301/124C09J2301/302C09J2301/408C09J2203/326C08L45/00C08L57/02C08L93/04C08L83/08Y02E60/10
Inventor 顾正青赵肖宁周奎任计建荣
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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