Photosensitive polyimide resin composition

A technology of polyimide resin and resin composition, applied in the direction of photosensitive material processing, optics, optomechanical equipment, etc., can solve the problems of improving physical properties and achieve the effect of fully cross-linked structure

Pending Publication Date: 2022-01-28
HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The positive type is more sensitive than the negative type, but it is difficult to expec

Method used

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  • Photosensitive polyimide resin composition
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  • Photosensitive polyimide resin composition

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preparation example Construction

[0113] Preparation method of photosensitive polyimide pattern

[0114] A photosensitive polyimide pattern can be prepared on a substrate using a photosensitive polyimide resin composition containing the above components. Specifically, the photosensitive polyimide pattern can be prepared by a method including the following steps: (1) forming a resin composition on the substrate by applying the above-mentioned photosensitive polyimide resin composition of the present invention on the substrate; (2) The process of exposing the resin layer; (3) Developing the exposed resin layer to form the insulating material of electronic parts and the passivation film, buffer coating film and interlayer in the semiconductor package A step of patterning a photosensitive polyimide such as an insulating film; and (4) a step of forming a permanent insulating film by heat-treating the photosensitive polyimide pattern.

[0115] Hereinafter, typical embodiments of each step will be described.

[011...

Embodiment 1

[0131] A stirrer, a nitrogen introduction tube, and a cooling tube equipped with a moisture receiver were attached to a glass-made detachable three-necked flask. Charge 64.45g (0.2 mol) of 3,4,3',4'-benzophenone tetracarboxylic dianhydride (hereinafter referred to as BTDA), 29.23g (0.1 mol) of 1,3-bis(3- Aminophenoxy)benzene, 1.5g (0.015 mole) of valerolactone, 2.4g (0.03 mole) of pyridine, 200g of NMP, 30g of toluene, at room temperature, under a nitrogen atmosphere, after stirring for 30 minutes at 200rpm , heated up to 180°C, heated and stirred for 1 hour. During the reaction, toluene-water azeotropic components were removed.

[0132] After cooling to room temperature, 48.33 g (0.15 moles) of BTDA, 44.57 g (0.25 moles) of 2,4-diethyl-6-methyl-1,3-phenylenediamine (relative to N- Aromatic diamine having an alkyl group), 360 g of NMP, and 90 g of toluene were stirred at room temperature for 30 minutes, then heated up to 180° C., and heated and stirred for 1 hour. While rem...

Embodiment 2

[0134] A stirrer, a nitrogen introduction tube, and a cooling tube equipped with a moisture receiver were attached to a glass-made detachable three-necked flask. Charge 64.45g (0.2 mol) of 3,4,3',4'-benzophenone tetracarboxylic dianhydride (hereinafter referred to as BTDA), 29.23g (0.1 mol) of 1,3-bis(3- Aminophenoxy)benzene, 1.5g (0.015 mole) of valerolactone, 2.4g (0.03 mole) of pyridine, 200g of NMP, 30g of toluene, at room temperature, under a nitrogen atmosphere, after stirring for 30 minutes at 200rpm , heated up to 180°C, heated and stirred for 1 hour. The toluene-water azeotropic component was removed during the reaction.

[0135] After cooling to room temperature, 48.33 g (0.15 moles) of BTDA, 51.08 g (0.25 moles) of 5,7-diamino-1,1,4,6-tetramethylindan (relative to N- Aromatic diamine having an alkyl group), 360 g of NMP, and 90 g of toluene were stirred at room temperature for 30 minutes, then heated up to 180° C., and heated and stirred for 1 hour. While removin...

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Abstract

The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts by weight of the solvent-soluble polyimide (A).

Description

technical field [0001] The present invention relates to a photosensitive polyimide resin composition. Background technique [0002] In recent years, in semiconductor packaging substrates, active research has been carried out from FC-CSP or FC-BGA to fan-out wafer-level packaging (FO-WLP) that can reduce height, improve electrical characteristics (R, L, C), and reduce warpage. ) transition, some FO-WLPs have been mass-produced. Key materials among the organic materials used in the FO-WLP are sealing materials and various protective film materials, and photosensitive polyimide is used as the protective film material. [0003] Several methods for imparting photosensitivity to photosensitive polyimide are known (Patent Document 1), and are roughly classified into positive type and negative type according to the image forming process. The positive type is more sensitive than the negative type, but since photolysis reaction is used, it is difficult to expect improvement of physi...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/038G03F7/008G03F7/20
CPCG03F7/004G03F7/038G03F7/0085G03F7/20C08G73/10G03F7/008H05K3/28H05K3/46G03F7/0125G03F7/0387G03F7/26C08G73/1042C08G73/1075C08L79/08C08L63/00
Inventor 铃木铁秋黑泽稻太郎
Owner HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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