Quick self-repairing epoxy resin cured product, preparation method and application
An epoxy resin curing and epoxy resin technology, which is applied in the field of rapid self-healing epoxy resin cured products and preparation, can solve the problems of few self-healing epoxy resins, increasing the difficulty of the repair process, and adverse performance recovery. Good self-healing effect, fast self-repairing speed and moderate curing temperature
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[0048] The preparation method of fast self-repairing epoxy resin cured product of the present invention, comprises the steps:
[0049] Step 1: fully mix the epoxy resin and the secondary amine derivative, heat and react to obtain a linear oligomer containing hydroxyl side groups;
[0050] Step 2: Dissolving the linear oligomer containing hydroxyl side groups in an organic solvent, adding isocyanate, and stirring until fully mixed;
[0051] Step 3: Pour the mixed reactants into the mold, heat and vacuum dry, and remove air bubbles and solvents to obtain a self-healing epoxy resin cured product.
[0052] The heating temperature in step 1 is 30-150°C.
[0053] The organic solvent in step 2 is one or more solvents. In general, any solvent can be used as long as it can dissolve the reactants and does not chemically react with the reactants. For example: one or a combination of dichloromethane, chloroform, toluene, ethyl acetate, tetrahydrofuran, acetone, butanone, dioxane, N,N-dim...
Embodiment 1
[0063] (1) Refer to figure 1 , 6.8gN,N'-bis(tert-butyl)ethylenediamine and 7.8g bisphenol A glycidyl ether type epoxy resin were added into a beaker with magnetic stirring, and were mixed uniformly at room temperature, then at 70 Reaction at ℃ to obtain a linear oligomer containing hydroxyl side groups. Dissolve it fully with dichloromethane, add 4.2g of hexamethylene diisocyanate dropwise, mix well at room temperature, pour it into a mold, and dry it in vacuum at 80°C to remove air bubbles and solvents to obtain a self-healing epoxy resin.
[0064] (2) Cut off the prepared sample, and then treat it at 180°C / 3MPa for 10 minutes, and observe the repair of the scratch with an optical microscope. The results show that the cut sample can be reconnected and the repaired sample only exists very shallow traces, such as figure 2 shown. The tensile strength is 22MPa, and the tensile strength after repair is 16MPa. The repair efficiency of mechanical damage is about 73%.
[0065] ...
Embodiment 2
[0067] (1) Add 6.8g N, N'-bis(tert-butyl)ethylenediamine and 11.7g bisphenol A glycidyl ether type epoxy resin into a beaker with magnetic stirring, mix it uniformly at room temperature, and then React at 70°C to obtain a linear oligomer containing hydroxyl side groups. Dissolve it fully with dichloromethane, add 4.2g of hexamethylene diisocyanate dropwise, mix well at room temperature, pour it into a mold, and dry it in vacuum at 80°C to remove air bubbles and solvents to obtain a self-healing epoxy resin.
[0068] (2) Cut off the prepared sample, and then treat it at 180°C / 3MPa for 10 minutes, and observe the repair of the scratch with an optical microscope. The results show that the cut sample can be reconnected and the repaired sample only exists Very shallow marks. The tensile strength is 26MPa, and the tensile strength after repair is 15MPa. The mechanical damage repair efficiency is about 58%.
[0069] (3) Conduct a high-voltage DC breakdown test on a sample with a t...
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