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Solvent-free cardanol aldehyde amine epoxy resin curing agent containing thiazole structure and preparation method of solvent-free cardanol aldehyde amine epoxy resin curing agent

A phenalkamine epoxy resin, solvent-free technology, applied in the direction of epoxy resin coating, organic chemistry, coating, etc., can solve the problem of single variety, etc., achieve fast drying speed, high adhesion, strong wear resistance and solvent resistance Effect

Pending Publication Date: 2022-03-29
ZHEJIANG WANSHENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But because the raw material aliphatic amine or cycloaliphatic amine in the cashew nut phenalk is single in variety and simple in structure, it cannot meet the demand of the market gradually, so it is imperative to develop a kind of cashew nut phenalkamine type epoxy resin curing agent with novel structure

Method used

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  • Solvent-free cardanol aldehyde amine epoxy resin curing agent containing thiazole structure and preparation method of solvent-free cardanol aldehyde amine epoxy resin curing agent
  • Solvent-free cardanol aldehyde amine epoxy resin curing agent containing thiazole structure and preparation method of solvent-free cardanol aldehyde amine epoxy resin curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1: Cardanol: 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole: formaldehyde = 1.2: 0.72: 1.8 according to the molar ratio, and the cashew nut phenolic formaldehyde of the present invention is synthesized according to this feeding ratio Amine type epoxy resin curing agent.

[0022] Steps: first heat 360 g (1.2 mol) of cardanol and 121.85 g (0.72 mol) of 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole to 55 ℃ and stir for 15 minutes, fully dissolve and mix Then, add 54 g (1.8mol) formaldehyde, react at 90°C for 1 h, then raise the temperature to 120°C for 2 h, decompress and vacuum dehydrate at 10 kPa for 1 h after the reaction, then lower the temperature to After reaching 85°C, add 16g of accelerator ethanolamine with a total mass of raw materials of 3% (mass percentages in the following examples are all relative to the total mass of raw materials), and discharge after stirring for 0.5 h to obtain cashew phenalkamine epoxy resin curing agent A. According to the "Determin...

Embodiment 2

[0024] Example 2: Cardanol: 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole: formaldehyde = 1.25: 0.77: 1.85 according to the molar ratio, and the cashew phenalkamine ring was synthesized according to this feeding ratio Oxygen resin curing agent.

[0025] Steps: first heat 375 g (1.25 mol) of cardanol and 130.314 g (0.77 mol) of 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole to 60 ℃ and stir for 15 minutes, fully dissolve and mix Afterwards, 55.5 g (1.85 mol) of formaldehyde was added, reacted at 95 °C for 1 h, and then heated to 120 °C for 2 h. After the reaction was completed, vacuum dehydration was carried out under reduced pressure and vacuum for 1 h under the condition of 11 kPa. After the temperature was lowered to 85 ° C, 19.63 g of 3.5 % accelerator diethanolamine was added, and the material was stirred for 0.5 h to obtain the cashew nut phenalkamine epoxy resin curing agent A . According to the "Determination of Viscosity of Adhesives" GB / T 2794-1995, the viscosity was tes...

Embodiment 3

[0027] Example 3: Cardanol: 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole: formaldehyde = 1.27: 0.75: 1.89 according to the molar ratio, and the cashew phenalkamine ring was synthesized according to this feeding ratio Oxygen resin curing agent.

[0028] Steps: first heat 381 g (1.27 mol) of cardanol and 126.93 g (0.75 mol) of 2,6-diamino-4,5,6,7-tetrahydrobenzothiazole to 60 ℃ and stir for 15 minutes, fully dissolve and mix Afterwards, 56.7 g (1.89 mol) of formaldehyde was added, reacted at 95 °C for 1 h, and then heated to 120 °C for 2 h. After the reaction, vacuum dehydration was carried out at 12 kPa for 1 h. After the temperature was lowered to 85 °C, 19.635 g of 3.5% accelerator ethanolamine was added, and the mixture was stirred for 0.5 h to obtain the cashew phenalkamine epoxy resin curing agent A. According to "Determination of Viscosity of Adhesives" GB / T 2794-1995, the viscosity was tested at 40°C, the viscosity was 15610mPa·S, and the amine value was determined to be...

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Abstract

The invention discloses a thiazole structure-containing solvent-free cardanol aldehyde amine epoxy resin curing agent and a preparation method thereof, the thiazole structure-containing solvent-free cardanol aldehyde amine epoxy resin curing agent is a cardanol aldehyde amine epoxy curing agent based on cardanol, 2, 6-diamino-4, 5, 6, 7-tetrahydrobenzothiazole and formaldehyde, and the preparation method comprises the following steps: firstly, adding cardanol, 2, 6-diamino-4, 5, 6, 7-tetrahydrobenzothiazole and formaldehyde into a reaction kettle, and stirring to obtain the thiazole structure-containing solvent-free cardanol aldehyde amine epoxy resin curing agent. The preparation method comprises the following steps: heating 1, 3, 5, 6, 7-tetrahydrobenzothiazole, stirring until the 1, 3, 5, 6, 7-tetrahydrobenzothiazole is completely dissolved, then adding formaldehyde, reacting for 0.5-1 hour at 90-100 DEG C, finally heating to 120 DEG C, reacting for 2 hours, dehydrating under reduced pressure after the reaction is finished, reducing the temperature to 85 DEG C or below, adding an accelerant, stirring for 0.5 hour, and discharging to obtain the cashew phenolic aldehyde amine epoxy resin curing agent. The solvent-free cashew phenolic aldehyde amine epoxy resin curing agent prepared by the method is novel in structure, high in impact resistance, high in hardness, high in solvent resistance and high in bonding strength. Meanwhile, matching with E51 type epoxy resin varnish proves that the paint has relatively short drying time and a good paint film surface, and the product is good in economical efficiency and suitable for industrial production.

Description

technical field [0001] The invention relates to a solvent-free cardanol phenalkamine epoxy resin curing agent containing a thiazole structure and a preparation method thereof. Background technique [0002] Among many low-level aliphatic amine epoxy resin curing agents, such as ethylenediamine, diethylenetriamine or polyethylene polyamine, due to their high toxicity and high volatility, and the texture of the paint film after matching with epoxy resin is relatively brittle Moreover, the impact resistance is poor, and the surface of the paint film is not smooth, and there are defects such as defects, which limit its application in some fields. In order to overcome the problems caused by low-level aliphatic amines, modified amine products are becoming more and more popular in the market. Typical representatives include polyamides, T31 curing agents, and modified phenalkamines. Amine epoxy resin curing agent has always been favored due to its excellent anti-corrosion performanc...

Claims

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Application Information

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IPC IPC(8): C08G59/62C09D163/00C09D5/08C07D277/82
CPCC08G59/623C09D163/00C09D5/08C07D277/82
Inventor 顾奇曾伟张潇罗海明陈熙梦
Owner ZHEJIANG WANSHENG
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