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Resin composition, prepreg and application thereof

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., and can solve problems such as low flow rate, uniformity of forming, and low bonding force of PI film. , to achieve the effect of good mechanics, strong binding force and good wettability

Pending Publication Date: 2022-04-01
久耀电子科技(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to overcome the defects that the low-flow glue prepregs in the prior art cannot satisfy the low flow glue and uniformity of forming at the same time, and the low bonding force with the PI film, and provides a resin composition, a prepreg and Its application to overcome the above drawbacks

Method used

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  • Resin composition, prepreg and application thereof
  • Resin composition, prepreg and application thereof
  • Resin composition, prepreg and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0064] Preparation of soluble polyimide:

[0065] The preparation method of the first soluble polyimide is as follows: under the low temperature of 10 ℃ and nitrogen atmosphere, first make the diamine monomer (I) 1.86g (5mmol) and 2,2-bis(3-amino-4-hydroxybenzene base) hexafluoropropane (hereinafter referred to as BAHF1.28g (3.5mmol) was dissolved in 10g of N-methyl-2-pyrrolidone (NMP), and 3.12g (10mmol) of bis(3,4 -dicarboxyphenyl) ether dianhydride (ODPA), then add 4-aminophenol 0.327g (3mmol) as end-capping agent, react 4h, obtain clear and transparent glue solution, then add toluene (the amount of toluene and the amount of solvent The amount is equal), stirred and reacted at 180°C for 4 hours, cooled to room temperature after the reaction, and then put it into a 1:1 mixed solution of methanol and water. The amount of the mixed solution was 5 times that of the glue, precipitated, and repeated After washing, dry in a vacuum oven at 80° C. for 12 hours to obtain the first s...

Embodiment 1

[0072] In the mixture of 4 parts of the first soluble polyimide powder and 16 parts of the second soluble polyimide powder, add 100 parts of hydrogenated bisphenol A type epoxy resin (Japan ADEKA EP-4080E), and add 100 parts of γ-butyrolactone (GBL) as an organic solvent, stir and dissolve at room temperature, after the dissolution is uniform, add 25 parts of curing agent aromatic amine SM113 and 15 parts of glass powder as an inorganic filler, and add 50 parts of GBL at the same time and stir to dissolve , stirred evenly, and filtered to obtain the resin mixture, which was stored at room temperature for later use.

Embodiment 2

[0074] In the mixture of 5 parts of the first soluble polyimide powder and 15 parts of the second soluble polyimide powder, add 100 parts of hydrogenated bisphenol A epoxy resin (Japan ADEKA EP-4080E), and add 100 parts of γ-butyrolactone (GBL) as an organic solvent, stir and dissolve at room temperature, after the dissolution is uniform, add 25 parts of curing agent aromatic amine SM113 and 15 parts of glass powder as an inorganic filler, and add 50 parts of GBL at the same time and stir to dissolve , stirred evenly, and filtered to obtain the resin mixture, which was stored at room temperature for later use.

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Abstract

The invention relates to the field of printed circuit boards, in particular to a resin composition, a prepreg and application of the prepreg, and the resin composition at least comprises epoxy resin, soluble polyimide and a curing agent. Wherein the soluble polyimide comprises first soluble polyimide and second soluble polyimide; the first soluble polyimide molecule contains an acceptor unit of a hydrogen bond; the second soluble polyimide molecule contains a donor unit of a hydrogen bond. According to the resin composition disclosed by the invention, polyimide capable of forming hydrogen bonds is introduced into the epoxy resin, so that dual strong and weak crosslinking effects between chemical bonds and hydrogen bonds are realized, and the obtained prepreg can realize a better low-gummosis even no-gummosis effect; meanwhile, on the basis of achieving the low-gummosis even non-gummosis effect, good wettability is achieved, the adhesive can enter each gap of a reinforcing material, and therefore the filling capacity and the bonding strength of the adhesive are greatly improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a resin composition, a prepreg and applications thereof. Background technique [0002] With the development of electronic products towards functionalization, the integration of components is getting higher and higher. At the same time, electronic products are also developing in the direction of thinner, lighter and smaller. Rigid-flex board (rigid-flex), as a special interconnection technology, has been widely used in computers, aerospace, military electronic equipment, collection, digital cameras, Communication equipment and analytical instruments, etc. [0003] A special bonding material, namely low-flow prepreg (low-flow PP), needs to be used in the process of rigid-flex board. In order to achieve the low-flow characteristics of the low-flow prepreg, it is necessary to use some technologies to achieve the low-flow performance of the resin, but in some current technical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L79/08C08K3/40C08K3/36C08G73/10C08J5/24B32B27/38B32B27/26B32B15/20B32B15/092H05K1/03
Inventor 陈明王林祥
Owner 久耀电子科技(江苏)有限公司