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Preparation method of glass substrate chip, glass substrate chip and application

A glass substrate and chip technology, which is applied in the field of glass substrate chips and applications, and the preparation of glass substrate chips, can solve the problems of clogging of reaction liquid, unfavorable fluid formation of laminar flow, insufficient smoothness and smoothness, etc. Small, conducive to market promotion and application, the effect of smooth and smooth flow channel

Active Publication Date: 2022-04-05
GUANGDONG INST OF SEMICON IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the existing wet etching method, due to the corrosion load effect of flow channels with different widths, the depth of the microreactor after etching is quite different from the depth of the flow channels in and out, and it is difficult to ensure that the flow channels are smooth and smooth at the same time, and the roughness is low. Large roughness is not conducive to the laminar flow of the fluid in the channel, which will lead to the clogging of the reaction solution and affect the test results
[0006] Therefore, the following problems generally exist in the existing manufacturing process of the channel of the microfluidic chip on the glass substrate: (1) the depth of the reactor is quite different from the depth of the inlet and outlet channels; (2) the channel has a high roughness and is not smooth enough

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  • Preparation method of glass substrate chip, glass substrate chip and application
  • Preparation method of glass substrate chip, glass substrate chip and application
  • Preparation method of glass substrate chip, glass substrate chip and application

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preparation example Construction

[0049] Please refer to figure 1 , the embodiment of the present invention provides a method for preparing a glass substrate chip, which is an optimized process based on hard mask layer, multiple etching and surface modification of the flow channel, which can produce the difference between the depth of the microreactor and the depth of the flow channel in and out. A glass substrate chip with a smooth flow path and low roughness of less than 3um. Specifically include the following steps:

[0050] S1, pre-processing

[0051]Before depositing the hard mask layer 20, the base substrate 10 is cleaned to make the substrate clean and free of impurities. The base substrate 10 may be a general glass substrate or other types of substrates, which is not limited here.

[0052] Specifically, the glass substrate is selected from at least one of quartz glass, fused silica, borosilicate glass, silicate glass, alkali-free glass and soda-lime glass, and may be a single material or a composite...

Embodiment 1

[0072] This embodiment provides a method for preparing a glass substrate chip, using such as figure 1 The shown process route comprises the following steps:

[0073] (1) The quartz glass is used as the substrate for deep cleaning. First soak it with a mixed solution of sulfuric acid and hydrogen peroxide (the volume fraction of concentrated sulfuric acid is 50%) for 30 minutes, then soak it with acetone for 30 minutes, and finally rinse it with deionized water.

[0074] (2) A hard mask layer is formed on the surface of the glass substrate by using chromium oxide by magnetron sputtering, and the thickness is controlled to be 200nm.

[0075] (3) Coating positive photoresist photoresist on the surface of the hard mask layer, the thickness is controlled to be 300nm, and through exposure, the figure 2 The mask runner pattern shown is transferred to photoresist.

[0076] (4) Corrode the hard mask layer with a chromium etching solution (the volume ratio of cerium ammonium nitrate ...

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Abstract

The invention discloses a preparation method of a glass substrate chip, the glass substrate chip and application, and relates to the technical field of glass substrate chips. The preparation method of the glass substrate chip comprises the following steps: firstly, forming a chromium-containing hard mask layer and a photoresist layer on a base substrate, forming a target runner pattern on the photoresist layer through exposure, and corroding the hard mask layer to transfer the target runner pattern to the hard mask layer. The first-concentration acid corrosion liquid is adopted to carry out multiple times of flow channel corrosion on the base material substrate, the corrosion rate is controlled, the difference between the depth of the microreactor and the depth in and out of the flow channel can be smaller, then the second-concentration acid corrosion liquid is adopted to carry out corrosion, the roughness of the flow channel can be modified, and the smooth and flat flow channel is obtained. By improving the preparation process of the glass substrate chip, the glass substrate chip with smaller difference between the depth of the microreactor and the depth of the inlet and outlet flow channel, smooth and flat flow channel and low roughness can be prepared, and the glass substrate chip is suitable for mass production and is beneficial to market popularization and application.

Description

technical field [0001] The invention relates to the technical field of glass substrate chips, in particular to a method for preparing a glass substrate chip, a glass substrate chip and applications thereof. Background technique [0002] The microfluidic chip is to miniaturize a large laboratory system on a glass or plastic substrate, so as to replicate the whole process of complex biological and chemical reactions, and quickly and automatically complete the experiment. Microfluidic chips involve interdisciplinary knowledge of materials, chemistry, materials, biology, medicine, etc., and have important applications in biochemical medical diagnosis, food and commodity testing, environmental monitoring, criminal science, aerospace science and other fields, among which biomedical analysis is hotspot. [0003] Commonly used materials for making microfluidic chips include silicon, glass, polymers, ceramics and other materials, among which glass has good electroosmotic and optical...

Claims

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Application Information

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IPC IPC(8): B01L3/00B01J19/00
CPCY02P40/57
Inventor 曾昭烩李叶林黄昌陈博谦杨荣宜劳建毅刘宁炀陈志涛
Owner GUANGDONG INST OF SEMICON IND TECH