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Low-silver vacuum solder with small temperature difference between melting point and flow point

A temperature difference and vacuum technology, applied in the field of low-silver vacuum solder, can solve the problems of defects and hidden dangers in workpiece welding, large differences in solder melting point and flow point, and large differences in workpiece welding results, so as to improve wear resistance and corrosion resistance. performance, improved ductility, improved weldability

Pending Publication Date: 2022-04-26
WUXI RIYUE ALLOY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the cost of silver-based materials is relatively high. In order to reduce the cost of solder, it is necessary to reduce the content of silver and increase the content of other metal elements.
However, the addition of other metal elements will cause large differences in the melting point and flow point of the solder, uneven melting of the solder, poor fluidity, and unsatisfactory wettability, which will eventually lead to large differences in the welding results of the workpiece, poor welding, and defects and hidden dangers in the welding of the workpiece

Method used

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  • Low-silver vacuum solder with small temperature difference between melting point and flow point

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A low-silver vacuum solder with a small temperature difference between melting point and flow point, characterized in that the chemical components and mass percentages of the low-silver vacuum solder are: Ag55%, In3%, Ge0.6%, Ni0.9%, The balance Cu is used for batching.

[0030] A kind of preparation method of above-mentioned low-silver vacuum solder, comprises the steps:

[0031] (1) Ag, Cu, In, Ge, Ni five kinds of elements are carried out batching according to above-mentioned mass percentage ratio;

[0032] (2) Heat and melt the prepared material in a vacuum induction furnace, the vacuum degree in the vacuum induction furnace is 0.1Pa; when heated to 900°C, fill with argon, keep it warm for 20min under the protection of argon; then cool to 800 ℃, poured into a mold, cooled to form a 20mm thick solder alloy ingot.

[0033] (3) Homogenize the brazing alloy ingot, peel and remove the oxide layer, cold-roll three times, and then anneal in a nitrogen furnace at a temper...

Embodiment 2

[0036] A low-silver vacuum solder with a small temperature difference between melting point and flow point, characterized in that the chemical components and mass percentages of the low-silver vacuum solder are: Ag57%, In2.5%, Ge0.5%, Ni1%, The balance Cu is used for batching.

[0037] A kind of preparation method of above-mentioned low-silver vacuum solder, comprises the steps:

[0038] (1) Ag, Cu, In, Ge, Ni five kinds of elements are carried out batching according to above-mentioned mass percentage ratio;

[0039] (2) Heat and melt the prepared materials in a vacuum induction furnace, the vacuum degree in the vacuum induction furnace is 0.1Pa; when heated to 900°C, fill with argon, keep it warm for 25min under the protection of argon; then cool to 800 ℃, poured into a mold, cooled to form a 20mm thick solder alloy ingot.

[0040] (3) Homogenize the brazing alloy ingot, peel and remove the oxide layer, cold-roll twice, and then anneal in a nitrogen furnace at a temperature...

Embodiment 3

[0043] A low-silver vacuum solder with a small temperature difference between melting point and flow point, characterized in that the chemical components and mass percentages of the low-silver vacuum solder are: Ag58%, In3.5%, Ge0.8%, Ni1.5 %, the balance of Cu for batching.

[0044] A kind of preparation method of above-mentioned low-silver vacuum solder, comprises the steps:

[0045] (1) Ag, Cu, In, Ge, Ni five kinds of elements are carried out batching according to above-mentioned mass percentage ratio;

[0046] (2) Heat and melt the prepared material in a vacuum induction furnace, the vacuum degree in the vacuum induction furnace is 0.1Pa; when heated to 900°C, fill with argon, keep it warm for 20min under the protection of argon; then cool to 800 ℃, poured into a mold, cooled to form a 20mm thick solder alloy ingot.

[0047] (3) Homogenize the brazing alloy ingot, peel and remove the oxide layer, cold-roll twice, and then anneal in a nitrogen furnace at a temperature of...

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Abstract

The invention discloses a low-silver vacuum solder with a small temperature difference between a melting point and a flow point. The low-silver vacuum solder comprises the following chemical components in percentage by mass: 53 to 60 percent of Ag, 2.0 to 6.6 percent of In, 0.1 to 1.5 percent of Ge, 0.1 to 2 percent of Ni and the balance of Cu. The prepared solder has the low melting point and flow point, the temperature difference between the melting point and the flow point is small, the product strength is high, and the wettability, the ductility, the abrasion resistance and the corrosion resistance of the solder are good.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a low-silver vacuum solder with a small temperature difference between melting point and flow point. Background technique [0002] Silver-copper alloy refers to a silver alloy with copper as the main alloying element. Silver and copper are eutectic alloys with mutual solid solution boundaries. Copper strengthens silver and significantly lowers its melting point and thermal conductivity. Generally speaking, these alloys have the advantages of fine crystallization, no brittleness, good wear resistance, strong sulfide resistance, good mechanical properties and welding resistance, high hardness, good electrical and thermal conductivity. Therefore, the contact material made of silver-copper alloy has been widely used in practice. Another major application of silver-copper alloys is that they can be used as brazing solders. Such as AgCu25, AgCu28, AgCu55, etc., this kin...

Claims

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Application Information

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IPC IPC(8): B23K35/30
CPCB23K35/3006
Inventor 晏弘晏新利庄鸿寿曲文卿王文静魏鹏飞
Owner WUXI RIYUE ALLOY MATERIALS