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Carbonized polyimide resin powder and preparation method of composite film of carbonized polyimide resin powder

A technology for carbonizing polyimide resin and polyimide resin is applied in the field of preparation of carbonized polyimide resin powder and its composite film, which can solve problems such as increase in dielectric loss, suppress dielectric loss, promote Dispersion, the effect of increasing the dielectric constant

Pending Publication Date: 2022-04-29
SICHUAN UNIVERSITY OF SCIENCE AND ENGINEERING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After carbonization at 600°C, the main chain structure of polyimide is still intact, which makes the filler and the matrix have good compatibility. The problem of increased loss

Method used

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  • Carbonized polyimide resin powder and preparation method of composite film of carbonized polyimide resin powder

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0020] (1) Disperse 0.475g of carbide C in 50ml of N,N-dimethylformamide solution, and ultrasonicate for 1 hour at room temperature to uniformly disperse it into a suspension of carbide C;

[0021] (2) Under the environment of nitrogen and ice-water bath, 3.6444g of N,N-dimethylformamide (ODA) is added in the above-mentioned suspension of carbide C, and it is fully stirred until completely dissolved, after that, add Add 5.8651g of pyromellitic dianhydride (PMDA), and the reaction lasts for 6 hours. To obtain a uniformly dispersed polyimide acid / carbide C (PAA / C) mixed solution;

[0022] (3) Place the PAA / C mixed solution obtained in (2) on a clean glass plate, and complete imidization at a temperature of 100-350°C to obtain polyimide / carbide C (PI / C ) composite film;

[0023] (4) Take off the imidized PI / C composite film, make a sample, coat the surface with conductive adhesive, put it in an ordinary oven and dry it at 120°C for 30 minutes, and conduct a dielectric test. At ...

example 2

[0025] (1) Disperse 0.95 carbide C in 50ml of N,N-dimethylformamide solution, and ultrasonicate for 1 hour at room temperature to uniformly disperse it into carbide C suspension;

[0026] (2) Under the environment of nitrogen and ice-water bath, 3.6444g of N,N-dimethylformamide (ODA) is added in the above-mentioned suspension of carbide C, and it is fully stirred until completely dissolved, after that, add Add 5.8651g of pyromellitic dianhydride (PMDA), and the reaction lasts for 6 hours. To obtain a uniformly dispersed polyimide acid / carbide C (PAA / C) mixed solution;

[0027] (3) Place the PAA / C mixed solution obtained in (2) on a clean glass plate, and complete imidization at a temperature of 100-350°C to obtain polyimide / carbide C (PI / C ) composite film;

[0028] (4) Take off the imidized PI / C composite film, make a sample, coat the surface with conductive adhesive, put it in an ordinary oven and dry it at 120°C for 30 minutes, and conduct a dielectric test. At 1MHz, poly...

example 3

[0030] (1) Disperse 1.425 carbide C in 50ml of N,N-dimethylformamide solution, and ultrasonicate for 1 hour at room temperature to uniformly disperse it into carbide C suspension;

[0031] (2) Under the environment of nitrogen and ice-water bath, 3.6444g of N,N-dimethylformamide (ODA) is added in the above-mentioned suspension of carbide C, and it is fully stirred until completely dissolved, after that, add 5.8651g of pyromellitic dianhydride (PMDA) was added, and the reaction continued for 6 hours. To obtain a uniformly dispersed polyimide acid / carbide C (PAA / C) mixed solution;

[0032] (3) Place the PAA / C mixed solution obtained in (2) on a clean glass plate, and complete imidization at a temperature of 100-350°C to obtain polyimide / carbide C (PI / C ) composite film;

[0033] (4) Take off the imidized PI / C composite film, make a sample, coat the surface with conductive glue, put it in an ordinary oven and dry it at 120°C for 30 minutes, and conduct a dielectric test. At 1MH...

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Abstract

The invention discloses carbonized polyimide resin powder and a preparation method of a composite film of the carbonized polyimide resin powder. The invention essentially belongs to the field of organic / inorganic composite materials, because two elements of O and H are completely removed after carbonization treatment of polyimide resin powder (ODA + ODPA) at 600 DEG C, and only two elements of C and N are retained in a main chain of polyimide. According to the composite material, polyimide (PI) is used as a matrix, carbide (C) of polyimide resin powder (ODA + ODPA) is used as dielectric filler, and the polyimide / carbide (PI / C) composite film material is prepared. Wherein when the polyimide resin powder (ODA + ODPA) is prepared, the solid content of the polyimide resin powder is 16wt%, and the mass fraction of carbide C in the PI / C composite film is 5-50wt%. According to the preparation method disclosed by the invention, the PI / C composite film with high dielectric constant and low dielectric loss can be obtained. The high-dielectric-constant polyimide composite film material prepared by the invention can be applied to high-density energy storage devices.

Description

technical field [0001] The invention belongs to the field of inorganic / organic composite materials, and designs a method for preparing carbonized polyimide resin powder and a composite film thereof. Background technique [0002] The chemical structure of polyimide determines that it has many distinctive properties and performance characteristics, mainly including excellent heat resistance, mechanical properties, good chemical stability and moisture resistance, as well as radiation resistance and dielectric properties. With the development of science and technology, especially the rapid development of the integrated circuit and electronics industry in the high-tech field, the demand for materials with high dielectric constant and low dielectric loss is becoming more and more urgent. These developments place new demands on the storage of energy. In the field of energy storage, according to the energy storage density formula, the storage of energy by a medium is proportional t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/04C08J5/18C08G73/10
CPCC08J5/18C08G73/1071C08J2379/08C08K3/04
Inventor 李科彭明云黄丙亮程杰左文燕胡磊
Owner SICHUAN UNIVERSITY OF SCIENCE AND ENGINEERING
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