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Thermosetting inkjet ink and printing method

A heat-curable, ink-jet technology, applied in copying/marking methods, inks, printing, etc., can solve problems such as insufficient film interface adhesion, and achieve excellent substrate adhesion, good surface adhesion, and high surface hardness Effect

Active Publication Date: 2022-06-21
KONICA MINOLTA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in printed circuit boards, solder resists made of ink using these inkjet methods have insufficient adhesion to the film interface of metal substrates, such as copper substrates, which has become a problem.

Method used

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  • Thermosetting inkjet ink and printing method
  • Thermosetting inkjet ink and printing method
  • Thermosetting inkjet ink and printing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0206]

[0207] The following dispersing agent 1, dispersing agent 2 and dispersion medium were put into a stainless steel beaker, heated and stirred on a hot plate at 65°C for 1 hour to dissolve, and after cooling to room temperature, the following pigment was added to it, and the Put 200g of 0.5mm zirconia beads into a glass bottle and plug it with a stopper. The zirconia beads were removed after dispersing with a paint shaker until the particle size became a desired particle size.

[0208]Dispersant 1: 5.6 parts by mass of EFKA7701 (manufactured by BASF)

[0209] Dispersant 2: Solsperse 22000 (manufactured by ルーブリゾール, Japan)

[0210] 0.4 parts by mass

[0211] Dispersion medium: Dipropylene glycol diacrylate (containing 0.2% UV-10)

[0212] 80.6 parts by mass

[0213] Pigment: PY185 (manufactured by BASF Co., Ltd., パリオトールイエローD1155)

[0214] 13.4 parts by mass

[0215]

[0216] In the preparation of the above-mentioned yellow pigment dispersion, the dispersant, the...

Embodiment 2

[0290]

[0291] In addition to 3.0 g of the yellow pigment dispersion and 1.0 g of the cyan pigment dispersion, ink compositions described in Tables III to V below were added to prepare inkjet inks, which were filtered through a Teflon 3 μm membrane filter manufactured by ADVATEC.

[0292]

[0293] Each of the prepared inkjet inks was loaded into an inkjet recording apparatus having an inkjet recording head provided with piezoelectric type inkjet nozzles. Using this apparatus, patterning was performed on a copper-clad laminate for a printed wiring board (FR-4 thickness 1.6 mm, size 150 mm×95 mm).

[0294] The ink supply system consists of an ink tank, an ink flow path, a sub-tank in front of the inkjet recording head, a pipe with a metal filter, and a piezoelectric head. From the ink tank to the head section, the ink is heated to 90°C. A heater is also built into the piezoelectric head, and the temperature of the ink in the recording head is heated to 90°C. As for the pi...

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Abstract

The present invention addresses the problem of providing a thermosetting inkjet ink capable of forming a coating film having excellent substrate adhesion, high surface hardness, and good surface tackiness. Also provided is a printing method with which it is possible to form a coating film having excellent substrate adhesion, high surface hardness, and good surface tackiness. This thermosetting inkjet ink contains a thermosetting compound, and is characterized by containing a photopolymerizable compound, a thermosetting compound, a photopolymerization initiator and a gel agent, the photopolymerization initiator being an acylphosphine-based initiator or an aminoacetophenone-based initiator, the content of the photopolymerization initiator being within the range of 1-100 mmol / kg, and the content of the gel agent being within the range of 1-100 mmol / kg. And the sol-gel phase change occurs according to the temperature.

Description

technical field [0001] The present invention relates to a thermosetting inkjet ink and a printing method. More specifically, the present invention relates to a thermosetting inkjet ink capable of forming a coating film having excellent substrate adhesion, high surface hardness, and good surface tack. In addition, it relates to a printing method capable of forming a coating film having excellent substrate adhesion, high surface hardness, and good surface tack. Background technique [0002] Conventionally, a photolithography development method and a screen printing method have been used in the formation of a resist, a solder resist, and a mark of a printed circuit board. [0003] As a method of manufacturing a printed circuit board using an inkjet printer, it has been proposed to form a resist for a copper clad laminate for a printed wiring board by drawing a conductor circuit pattern using an inkjet printer, and to perform an etching process (for example, refer to patent Li...

Claims

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Application Information

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IPC IPC(8): C09D11/38B41J2/01C09D11/101C09D11/102B41M5/00
CPCC09D11/101C09D11/38C09D11/102B41M7/0081
Inventor 河南朋惠
Owner KONICA MINOLTA INC
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