PERC solar single crystal cell alkali polishing front protection process
A solar energy and single crystal technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of affecting the electrical performance of the battery, insufficient protection effect, corrosion of phospho-silicate glass, etc., to achieve lower technical threshold, good protection effect, and larger The effect of corrosion
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Embodiment 1
[0036] The present embodiment provides a process for protecting the front surface of a PERC solar monocrystalline cell by alkali polishing, which includes the following steps:
[0037] S1. Pre-cleaning: Use mixed solution A to clean single crystal silicon wafers at 45°C for 60s. The volume ratio of hydrogen peroxide, potassium hydroxide and pure water in mixed solution A is 14:1.5:320;
[0038] S2. Surface modification: Add 100 g of dimethyldichlorosilane to 900 g of trichloroethylene in the surface modification tank to obtain a surface modification solution, and immerse the pre-cleaned single crystal silicon wafer into the surface modification solution. The modification time was 300s, and the modification temperature was 25°C.
[0039] S3. Alkali polishing: the single crystal silicon wafer after surface modification in step S2 is subjected to alkali polishing for 210s at 65°C with mixed solution B. The volume ratio of potassium hydroxide, additives and pure water in mixed sol...
Embodiment 2
[0044] The present embodiment provides a process for protecting the front surface of a PERC solar monocrystalline cell by alkali polishing, which includes the following steps:
[0045] S1. Pre-cleaning: Use mixed solution A to clean single crystal silicon wafers at 55°C for 75s. The volume ratio of hydrogen peroxide, potassium hydroxide and pure water in mixed solution A is 14:1.5:320;
[0046] S2. Surface modification: 150g of dimethyldichlorosilane was added to 850g of trichloroethylene in the surface modification tank to obtain a surface modification solution, and the single crystal silicon wafer after pre-cleaning was immersed in the surface modification solution. The modification time was 300s, and the modification temperature was 25°C.
[0047] S3. Alkali polishing: the single crystal silicon wafer after surface modification in step S2 is subjected to alkali polishing for 230s at 80°C with mixed solution B. The volume ratio of potassium hydroxide, additives and pure wate...
Embodiment 3
[0052] The present embodiment provides a process for protecting the front surface of a PERC solar cell by alkali polishing, which includes the following steps:
[0053] S1. Pre-cleaning: Use mixed solution A to clean single crystal silicon wafers at 30°C for 50s. The volume ratio of hydrogen peroxide, potassium hydroxide and pure water in mixed solution A is 14:1.5:320;
[0054] S2. Surface modification: Add 100g of hexamethyldisilazane to 900g of dimethylformamide in the surface modification tank to obtain a surface modification solution, and immerse the pre-cleaned single crystal silicon wafer into the surface modification In liquid, the modification time is 300s, and the modification temperature is 25℃.
[0055] S3. Alkali polishing: the single crystal silicon wafer after surface modification in step S2 is subjected to alkali polishing for 195s at 60°C with mixed solution B. The volume ratio of potassium hydroxide, additives and pure water in mixed solution B is 16:4: 320;...
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