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Ceramic-based continuous complex-phase adhesive film with high bonding strength and preparation method of ceramic-based continuous complex-phase adhesive film

A ceramic-based, high-bond technology, used in non-polymer adhesive additives, adhesives, inorganic adhesives, etc. Low coefficient of thermal expansion, suppression of bubble generation, and effect of suppressing shrinkage

Pending Publication Date: 2022-07-12
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic-based continuous multiphase adhesive film with high bonding strength to solve the problems of easy shrinkage of the adhesive film, low ceramic yield and low bonding strength

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0028] The preparation method of the above-mentioned high bonding strength ceramic-based continuous multiphase adhesive film, comprising the following steps:

[0029] S1. Weigh the solid ceramic precursor and the liquid ceramic precursor according to the composition ratio, add an organic solvent after mixing, and stir rapidly to obtain a uniform liquid A;

[0030] S2, adding the inorganic filler to the uniform liquid A, stirring rapidly, and removing the organic solvent after the inorganic filler is uniformly dispersed in the liquid A to obtain a solid compound B;

[0031] S3. On the release paper or fiber cloth, the solid rubber compound B is scraped at a rate of 1-6mm / min at a temperature of 90°C-130°C and a viscosity of 3-50Pa·s by a hot-melting method to obtain a thickness Uniform ceramic-based continuous composite film.

[0032] The areal density of the ceramic-based continuous composite film is 100-900g / m 2 , the thickness is 0.05-0.8mm.

[0033] The fiber cloth is on...

Embodiment 1

[0035] S1. Take 400 g of liquid polycarbosilane with a molecular weight of 544 and 400 g of solid polycarbosilane with a molecular weight of 603, add n-hexane, and use mechanical stirring to obtain a light yellow uniform mixed liquid.

[0036] S2. To the mixed liquid, add 400 g of ZrB with a particle size of 1.5 μm 2 powder, continue to use mechanical stirring to obtain a black mixed system, remove n-hexane to obtain polycarbosilane and ZrB that are solid at room temperature 2 Mix rubber.

[0037] S3. Use a coating machine to coat the solid polycarbosilane with ZrB by hot-melt method 2 The mixed rubber compound, at 130 °C and the viscosity of 32.6 Pa s, was coated on the release paper with a coating machine to form a uniform and continuous polycarbosilane precursor and ZrB 2 The composite ceramic film, the coating speed is 5m / min, and the areal density is 178g / m 2 , the thickness is 0.1mm.

[0038] The film prepared above was cured at 240°C for 4 hours, and the residual we...

Embodiment 2

[0040] S1. Take 300g of liquid SiBCN ceramic precursor with molecular weight of 744 and 225g of solid SiBCN ceramic precursor with molecular weight of 783, add n-hexane, and use mechanical stirring to obtain a light yellow uniform mixed liquid.

[0041] S2. To the mixed liquid, add 350 g of ZrC powder with a particle size of 3.5 μm, continue to use mechanical stirring to obtain a black mixed system, remove the n-hexane to obtain a solid SiBCN ceramic precursor and ZrC mixed rubber at room temperature .

[0042] S3. Use a coating machine to coat the solid SiBCN ceramic precursor and ZrC mixed rubber with a hot-melt method at 110 ° C and a viscosity of 3.6 Pa·s, and use a coating machine to coat the release paper to a uniform thickness. And the continuous polycarbosilane precursor and ZrC composite ceramic film, the coating speed is 2m / min, and the areal density is 312g / m 2 , the thickness is 0.2mm.

[0043] The adhesive film prepared above was cured at 270°C for 4 hours, and th...

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Abstract

The invention discloses a ceramic-based continuous complex-phase adhesive film with high bonding strength. The ceramic-based continuous complex-phase adhesive film comprises the following components in parts by mass: 40-70 parts of a liquid ceramic precursor, 30-60 parts of a solid ceramic precursor, 5-50 parts of an oxygen-free inorganic filler and an organic solvent. The molecular weight of the solid ceramic precursor and the molecular weight of the liquid ceramic precursor are 500-2000, and the molecular formulas and the molecular weights are close to each other. And the average particle size of the inorganic filler is 0.3-5.0 [mu] m. The invention also discloses a preparation method of the ceramic-based continuous complex-phase adhesive film with high bonding strength. By adopting the ceramic-based continuous complex-phase adhesive film with high bonding strength and the preparation method of the ceramic-based continuous complex-phase adhesive film, the problems that an adhesive film is easy to shrink, the ceramic yield is low and the bonding strength is low can be solved.

Description

technical field [0001] The invention relates to the technical field of adhesive film materials, in particular to a ceramic-based continuous multiphase adhesive film with high bonding strength and a preparation method thereof. Background technique [0002] The adhesive film has the characteristics of uniform thickness and simple construction process, so it is widely used in the aerospace field. As a whole, the integrated manufacturing of the device is realized. [0003] At present, organic polymer films such as polyimide, phenolic and epoxy are the most widely used adhesive films. However, these polymer films have serious shrinkage and weak high temperature resistance in high temperature environments. The ceramic precursor molecules contain a large amount of Si-CH 3 , Si-H and other active groups, so it has high cohesion ability, and can cross-link with various curing agents to form a grid structure, which can promote the bonding of devices. However, in the process of for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J11/04C04B35/515C04B35/622
CPCC09J1/00C09J11/04C04B35/515C04B35/622C04B2235/3813C04B2235/3839C04B2235/3826C04B2235/483C04B2235/96
Inventor 张中伟苏耿庞旭班梓发李玮洁
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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