Preparation method of solar cell, solar cell and power generation device
A solar cell and phosphorus source technology, applied in the field of solar cells, can solve problems such as cell failure, product efficiency improvement, and limitation of solar cells, and achieve the effect of increasing phosphorus content
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[0025] According to an embodiment of the present invention, a method for preparing a solar cell includes the following steps:
[0026] placing the P-type doped silicon wafer in a reaction chamber, and forming an N-type doped layer on the surface of the silicon wafer;
[0027] Passing a phosphorus source into the reaction chamber, controlling the flow rate of the phosphorus source to be 1200 sccm-1500 sccm, and heating the silicon wafer to form a phosphosilicate glass layer on the surface of the N-type doped layer;
[0028] Doping the part on the silicon wafer used for the screen printing grid line electrode by laser, so that the phosphorus atoms in the phosphorous silicate glass layer in the part doped by the laser diffuse into the N-type doped layer;
[0029] The phosphorous silicate glass layer is removed, and a gate line electrode is formed on the surface layer of the silicon wafer at a position used for screen printing the gate line electrode, and a sintering process is pe...
Embodiment 1
[0060] Example 1: Preparation of silicon wafers with high phosphorus content phosphosilicate glass layers
[0061] (1) Send the textured silicon wafer into the reaction furnace tube, and the furnace tube is heated to 760℃±100℃;
[0062] (2) The temperature of each temperature zone is kept at 760±100℃, and the vacuum is evacuated to 50Pa-150Pa;
[0063] (3) Keep the temperature of each temperature zone at 760±100℃, evacuate to 50Pa-150Pa, stop the evacuation, and carry out the furnace tube leak detection;
[0064] (4) Pre-oxidation: the temperature of each temperature zone is kept at 760±100°C, the pressure in the reaction furnace tube is kept at 100±10Pa, the oxygen is oxidized, the time is controlled at 3min, and the oxygen flow is 600sccm;
[0065] (5) Pre-deposition: after oxidation, the temperature of each temperature zone is kept at 770±20℃, the pressure is kept at 100±10Pa, oxygen and phosphorus oxychloride are supplied, the oxygen flow rate is 600sccm, and the flow rat...
Embodiment 2
[0087] Get the sample of embodiment 1 and carry out the following processing:
[0088] (1) Use the preset grid line position on the surface of the silicon wafer by laser doping, so that the phosphorus in the PSG diffuses into the surface of the silicon wafer, the laser power is set at 25W, and the frequency is set in the laser engraving parameters of the pattern sub-grid and the anti-break grid. It is set at 220kHz, and the energy factor value is set at 250kHz;
[0089] (2) The grid electrode was screen-printed and sintered, and the sintering temperature was set to 780°C.
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