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High temperature resistant epoxy resin composite with lasting storage stability and temperature thixotropy

An epoxy resin and epoxy resin matrix technology, which is applied in the field of polymer material science, can solve the problems of unrepeatable rheological properties and limit the application of epoxy resin, and achieves high curing reaction activity of the system, simple preparation process, and room temperature storage. long term effect

Inactive Publication Date: 2005-08-17
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN1156166A proposes to use polydibutyl terephthalate or its block copolymer as the anti-flow modifier of epoxy resin to obtain the pasty epoxy resin adhesive with stable anti-flow property, but this technology is in Heating at high temperature dissolves poly(dibutyl terephthalate) or its block copolymer in epoxy resin. During this process, poly(dibutyl terephthalate) or its block copolymer easily interacts with epoxy resin. Transesterification reaction, rheological properties cannot be repeated
Therefore, the application of epoxy resin in some fields is limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Add acetylacetone lanthanide transition metal complex accelerator (0.3% to 1.3%) into the DEL-4206 epoxy resin matrix (44.5-48.5%, the following are weight percentages), and stir at 85°C Add methyltetrahydrophthalic anhydride (44.5% to 48.5%) and silane coupling agent KH-550 (0.8% to 2.3%), heat up to 90°C, stir evenly, then add nano silicon dioxide ( 3.5% to 9.5%), and then the whole system was continuously stirred for 5 hours to obtain the epoxy resin compound. The fiber is subjected to fiber prepreg experiment. After the resin matrix is ​​heated at a constant temperature of 50-60°C for 10-20 minutes, the continuous glass fiber or carbon fiber or aramid fiber is impregnated for 30-60S. After soaking, the continuous fiber prepreg is naturally cooled to room temperature. Winding. After 60 days of storage at room temperature, it can be unrolled directly. Little change in viscosity during storage, no resin migration, no sticking. It can meet the requirements of resin m...

Embodiment 2

[0014] Add acetylacetonate lanthanide transition metal complex (0.3% to 1.3%) into the DEL-4206 epoxy resin matrix (44.5-48.5%, the following are weight percentages), stir well at 85°C and add methyl Hexahydrophthalic anhydride (44.5% ~ 48.5%) and silane coupling agent KH-550 (0.8% ~ 2.3.%), heat up to 90 ° C, stir evenly and add nano silicon dioxide (3.5% ~9.5%), and then the whole system continued to stir for 5 hours to obtain the epoxy resin compound. The fiber is subjected to fiber prepreg experiment. After the resin matrix is ​​heated at a constant temperature of 50-60°C for 10-20 minutes, the continuous glass fiber or carbon fiber or aramid fiber is impregnated for 30-60S. After soaking, the continuous fiber prepreg is naturally cooled to room temperature. Winding. After 60 days of storage at room temperature, it can be unrolled directly. Little change in viscosity during storage, no resin migration, no sticking. It can meet the requirements of resin matrix for pre-we...

Embodiment 3

[0016]Add acetylacetonate lanthanide transition metal complex (0.3% to 1.3%) into the DEL-4206 epoxy resin matrix (44.5-48.5%, the following are weight percentages), stir well at 85°C and add methyl Nadic acid anhydride (44.5%~48.5%) and silane coupling agent KH-550 (0.8%~2.3%), warming up to 90°C, stirring evenly, adding nano silicon dioxide (3.5%~9.5%) while stirring, Then the whole system continued to stir for 5 hours to obtain the epoxy resin compound. The fiber is subjected to fiber prepreg experiment. After the resin matrix is ​​heated at a constant temperature of 50-60°C for 10-20 minutes, the continuous glass fiber or carbon fiber or aramid fiber is impregnated for 30-60S. After soaking, the continuous fiber prepreg is naturally cooled to room temperature. Winding. After 60 days of storage at room temperature, it can be unrolled directly. Little change in viscosity during storage, no resin migration, no sticking. It can meet the requirements of resin matrix for pre-...

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Abstract

The present invention belongs to the field of high molecular material science and technology, and provides heat resistant epoxy resin composition with long term chemical stability and temperature thixotropy. The present invention features that acetyl acetone- lanthanide complex as promoter, liquid acid anhydride as curing agent, silane coupling agent and nanometer silica as thiotropic agent are dispersed homogeneously in epoxy resin matrix to obtain the heat resistant epoxy resin composition. The heat resistant epoxy resin composition features good wettability with reinforcing material, fast viscosity increment after finishing infiltration for easy winding, less viscosity change during storing, long shelf period at room temperature, and relatively high reaction activity of the curing system.

Description

technical field [0001] The invention belongs to the field of polymer material science and technology, and belongs to a class of high-temperature-resistant epoxy resin compound with long-term chemical storage stability and temperature thixotropy, which meets the requirements of advanced composite material pre-soaked fiber winding technology. Background technique [0002] Epoxy resin is a kind of thermosetting polymer synthetic material with good adhesion, corrosion resistance, electrical insulation, high strength and other properties. It has been widely used in the bonding of various metals and non-metals, corrosion-resistant coatings, electrical insulation materials, FRP / composite materials, etc. It plays an important role in electronics, electricity, machinery manufacturing, chemical anticorrosion, aerospace, shipping and many other industrial fields, and has become an indispensable basic material in various industrial fields. Epoxy resin can only show its inherent excelle...

Claims

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Application Information

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IPC IPC(8): C08K5/541C08L63/08
Inventor 陈平刘扬王秀杰王士巍
Owner DALIAN UNIV OF TECH
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