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Silicon microchannel production method

A production method and micro-channel technology, applied in the field of microelectronics and micro-electromechanical systems, to achieve the effect of omitting plate-making costs, low cost and good effect

Inactive Publication Date: 2006-02-22
EAST CHINA NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the one hand, as an application on a microchannel plate amplifier, the resolution of the image is required as long as it can be used; on the other hand, the geometric shape of the hole arrangement is only for the average effect, and it is not deliberately required to be a square Arrangement or other arrangements, so if the photolithography step can be omitted, it may save expensive plate making costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: microchannel fabrication method

[0018] Select n(100) silicon, the resistivity is 0.5-30 ohm cm, in order to make the back have good conductivity, it is easy to form ohmic contact with the back electrode, and the back is firstly reduced by ion implantation to reduce the resistivity, which has reached a uniform anodic oxidation current the goal of.

[0019] Then, using the porous silicon method, at a concentration of 40% HF:C 2 h 5 Anodize in OH=1:4 for 5 minutes, the temperature is 25°C, take it out and wash it, then use 25% TMAOH solution at 85°C for 2 minutes, rinse and dry with deionized water, and use HF:C with a concentration of 5% 2 h 5 The solution of OH=1:1 is used as the anodizing solution to anodize the treated silicon wafer, and the current is kept constant by changing the light intensity on the back side. Anodizing was carried out at -25°C and etched for 1 hour to obtain channels with a length of 100 microns.

Embodiment 2

[0020] Example 2: Fabrication of gene chip DNA hybrid sensor

[0021] For the production of DNA sensors, since multiple samples are expected to be measured at the same time, generally before porous silicon etching, gold-chromium alloy, silicon nitride (preferably LPCVD or low stress) and other materials that can resist HF corrosion are used as masks Divide the area that needs to be made of porous silicon into several areas, and then make porous silicon, and the electrodes are made on the back, using double-sided photolithography. Before making electrodes, try to use dry or wet etching process The low-resistance layer previously diffused or ion-implanted is removed.

Embodiment 3

[0022] Example 3: Biomolecular Physical Filters

[0023] The etched silicon wafer needs to be thinned on the back side to form through microchannels, which can be used to make biomolecular filters or further used to make microchannel plates.

[0024] There are two types of thinning, mechanical or chemical, and chemical thinning can be divided into chemical plasma thinning and chemical etching liquid thinning. A less costly solution is to use solution etching. The problem that must be considered in solution etching is when the back side is etched close to the channel structure, because once the channel structure starts to corrode, the solution will probably destroy the channel structure very quickly. For this reason, we propose to use acetic acid and other solutions to soak the front when approaching the pore structure, and to neutralize the alkaline solution when the alkaline solution on the back corrodes to the microchannel, thereby delaying corrosion and achieving the purpo...

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PUM

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Abstract

The invention relates to a method for preparation of a micro channel in the process of preparing Micro Electro-Me-chanical Systems elements, belonging to the technical field of Micro Electro-Me-chanical Systems. The resistance silicon from n (100) can form a hole of about 1 micrometer in special condition in solution of a concentration of 40% of HF: C2H5OH=1: 1, with this layer as template to be corroded out a reverse pyramid depression by KOH or tetramethyl ammonium hydroxide or the similar solution, and with the cellular silicon corrosion technique, the micro channel is corroded. The micro channel sheet for night-vision device can be prepared by oxygenizing the micro channel structure. With the method, the minimum micro-channel diameter and the center distance of channel have a great improvement, the electron multiplication effect also is perfect, the treatment temperature of the micro channel plate can achieve to 1200Deg. C, and the secondary electron emission efficiency is highly improved.

Description

[0001] The invention relates to a manufacturing method of micro-electro-mechanical system devices, in particular to a micro-channel manufacturing method in the manufacturing of micro-electro-mechanical system devices, and belongs to the technical field of microelectronics and micro-electro-mechanical systems. technical background [0002] The micro-nano channel of silicon refers to the fabrication of micro-nano hole arrays on the silicon substrate by etching. Due to the large increase in the specific surface area of ​​silicon, it will play a very critical role in the manufacture of some devices related to the specific surface area of ​​silicon. . Typical of these applications are DNA hybrid sensors. [0003] In addition, in modern night vision equipment, the micro-channel plate low-light night vision device is the main equipment in the field of night vision equipment at present. It mainly uses the electrons moving in the channel to collide with the tube w...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 王连卫吴俊徐
Owner EAST CHINA NORMAL UNIV
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