Method for making GaN-based LED with back hole structure
A light-emitting diode, gallium nitride-based technology, applied in the field of semiconductors, can solve problems such as hindering high-power light-emitting diodes and large thermal resistance
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[0041] first as figure 1 As shown, this is a cross-sectional view of the die structure of a GaN-based light-emitting diode. The manufacturing process is to epitaxially grow a GaN N-type contact layer 11 on a sapphire substrate 10 using MOCVD method, a light-emitting active region 12 and a P-type GaN contact layer 13; the shape of the die is designed to be a square, with a size of 1mm×1mm, and then an N-type mesa (N-type contact layer 11) is etched according to the designed die pattern and dry-etched by an ICP system. Ni / Au / Ag / Ni / Au (50 Å / 50 Å / 1500 Å / 200 Å / 1200 Å) was prepared by electron beam evaporation (or sputtering) on the P-type GaN contact layer 13, and annealed at 500 degrees Celsius For 5 minutes, an ohmic contact electrode 14 of P-type GaN with low ohmic contact and high reflectivity is formed. Ti / Al / Ni / Au (150 Å / 2200 Å / 400 Å / 500 Å) was prepared on the N-type GaN layer 11 by electron beam evaporation (or sputtering), and annealed at 900 degrees Celsius for 30 secon...
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