Polyhedral crystalline copper powder and production thereof

A polyhedron and copper powder technology is applied in the field of crystalline copper powder and its preparation, as well as in the field of preparation of micron copper powder. short cycle effect

Inactive Publication Date: 2006-08-16
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the above method, the use of ascorbic acid aqueous solution is only suitable for the preparation of 1-2 μm copper powder, and there is no technical solution for controlling the shape of the copper powder itself.

Method used

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  • Polyhedral crystalline copper powder and production thereof
  • Polyhedral crystalline copper powder and production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Dissolve 9.60g of ascorbic acid, 2.75g of sodium hydroxide, 12.50g of sodium acetate and 1.0g of gum arabic in 50ml of deionized water, stir at room temperature for 30min, raise the solution to 60°C, and then add 10ml of 25-28% ammonia water. 8.50 g of copper chloride dihydrate was dissolved in 30 ml of deionized water, and the temperature of the solution was also raised to 60° C. Add the copper chloride aqueous solution into the rapidly stirred mixed solution containing ascorbic acid, and react for 30 minutes. The resulting copper powder precipitate was centrifuged, washed three times with deionized water, washed twice with ethanol, and finally vacuum-dried at 60°C. The dried copper powder is bright pink with strong metallic luster.

[0025] Such as figure 1 As shown, the morphology of the prepared copper powder was observed with a scanning electron microscope, and it was found that the copper powder was in the shape of a polyhedron, with obvious crystal edges on a s...

Embodiment 2

[0027] Change the consumption of dispersant gum arabic into 1.5g, sodium hydroxide consumption into 3.0g, all the other conditions are with embodiment 1. The prepared copper powder is in the shape of a polyhedron, with obvious crystalline surfaces on a single particle; the particles are well dispersed without agglomeration; the particle size distribution ranges from 1.4 to 3.0 μm, most of which are concentrated in the range of 2.1 to 2.6 μm, and the average particle size is 2.3 μm.

Embodiment 3

[0029] Dissolve 19.2g of ascorbic acid, 5.5g of sodium hydroxide, 12.50g of sodium acetate and 2.5g of gum arabic in 50ml of deionized water, stir at room temperature for 30min, raise the solution to 40°C, and then add 25-28% ammonia water 20ml. 17.0 g of copper chloride dihydrate was dissolved in 30 ml of deionized water, and the temperature of the solution was also raised to 40° C. Add the copper chloride aqueous solution into the rapidly stirred ascorbic acid solution, and react for 30 minutes. The prepared copper powder is multifaceted, and the particle size distribution range is 3.5-5.0 μm

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Abstract

A polygonal crystalline copper powder with high dispersity and diameter uniformity (1-5 microns) is prepared through preparing the solution of Cu salt and the solution of reducer, adding disperser and ammonia water to both solutions, mixing, reacting, separating, washing and drying.

Description

Technical field: [0001] The invention relates to an electronic component material, especially a preparation method of micron copper powder, specifically crystalline copper powder with regular crystal shape, good dispersibility and narrow particle size distribution meeting the requirements of copper-based conductive paste and a preparation method thereof . technical background: [0002] Copper-based conductive pastes are widely used to form external electrodes on ceramic electronic components such as chip capacitors and chip resistors, and to form printed circuits on ceramic and plastic substrates. As the main component of the slurry, the characteristic properties of copper powder, such as particle shape, particle size distribution, and oxidation resistance, play a key role in the quality of the slurry and the conductivity of the electrode. Compared with spherical particles, polyhedral-shaped crystalline copper particles have higher oxidation resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 符小艺凌志远
Owner SOUTH CHINA UNIV OF TECH
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