Double electromagnetic shielding membrane

Abstract

The invention belongs to the new anti-electromagnetic interference shield technology field, specially involves a electromagnetism dual shield film, including the iron, the chromium, the nickel, the titanium manganese and the cobalt, the characters accord the percentage of the metals: Fe: 30%~85%, Cr: 5%~50%, Ni: 1%~20%, Ti: 1~10%; the metals allocate proportion with the chromium equivalent ((Cr)=Cr+Mo+0.015Si+0.005Ti) and nickel equivalent ((Ni)=Ni+0.3C+0.005Mn), the calculating chromium (Ni) equivalent is smaller than 24, the nickel equivalent is bigger than 16; the invention use the austenite nichrome stainless steel as the sputtering target material, whereas the austenite is paramagnetic that has the higher sputtering film speed, may quickly get the ferromagnetism ferrite stainless steel film by sputtering, the film has magnetic shield and electric shield, and also has the good weathering resistance of the stainless steel material, it is one of the ideal metals for plating on the shell surface of the electronic products.

Description

technical field [0001] The invention belongs to the technical field of novel anti-electromagnetic interference (EMI) shielding, in particular to an electromagnetic double shielding film. Background technique [0002] With the development of electronic systems towards thinner and miniaturization, most electronic system boxes now use plastic boxes. Plastic has the advantages of good plasticity, mass production in a short period of time, and insulation. However, the anti-EMI effect of plastic is poor, and a layer of material with high conductivity or high magnetic permeability needs to be plated on a certain area of ​​the plastic surface after molding to achieve electromagnetic shielding. For example, digital products such as mobile phones, PDAs, notebook computers, set-top boxes, etc., must be coated with anti-EMI film materials on the inner surface of the plastic box, that is, plastic metallization, which is an important structure on the surface of the plastic shell of high-f...

AI Technical Summary

Problems solved by technology

The electromagnetic shielding film material is mainly copper or nickel. The good electrical conductivity of copper can play an electrical shielding role, but copper is easy to oxidize and has poor weather resistance; and for occasions with high requirements for anti-EMI, double shielding of electricity and magnetism is required, and nickel has a relatively high performance. High magnetic permeability and low resistivity can play the dual role of electromagnetic shielding and have good weather resistance, but because nickel is a ferromagnetic material, the nickel target will shield the magnetic field on the target surface, resulting in low film formation efficiency, which is not suitable for Industrialized production of magnetron sputtering, which seriously hinders the application of magnetron sputtering in plastic metallization