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Uvioresistant epoxy composition and its preparing method and use

An epoxy composition, anti-ultraviolet technology, applied in electrical components, circuits, electrical solid devices, etc., can solve the problems of resin stability, low transmittance in the short wavelength field, resin discoloration, etc., which are unfavorable for sealing semiconductors, and achieve improvement LED luminous intensity is uneven, excellent anti-ultraviolet aging performance, the effect of preventing ultraviolet leakage

Inactive Publication Date: 2006-11-08
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the prior art of using bisphenol A epoxy resin to package LED, which will cause resin discoloration, and then cause the transmittance in the short-wavelength field to decrease, which has a great impact on the luminosity of the device; the use of aliphatic epoxy When the resin is used as the main component of the packaging material, the thermal stability is low, which is not conducive to ensuring that the resin sealing the semiconductor can have the stability of welding and operation, which will cause reliability problems and the defect of thermal discoloration, so as to provide a An anti-ultraviolet epoxy composition that has good anti-ultraviolet aging performance, high heat resistance, can prevent ultraviolet rays from leaking, and can also improve the unevenness of LED luminous intensity

Method used

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  • Uvioresistant epoxy composition and its preparing method and use
  • Uvioresistant epoxy composition and its preparing method and use
  • Uvioresistant epoxy composition and its preparing method and use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] In a 200ml Erlenmeyer flask, add 50 parts by weight of hexahydrophthalic anhydride (curing agent), 0.15 parts by weight of tetraethylammonium bromide (curing accelerator), 1 part by weight of 2,2 methylene-bis(4 -methyl-6-tert-butylphenol) (antioxidant), 0.001 parts by weight of 2,4-dihydroxybenzophenone (ultraviolet absorber), 0.001 parts by weight of BaTiO 2 (absorbent and scattering agent), heated to 80° C. under magnetic stirring, and cooled to room temperature after the mixture was completely dissolved. Add 100 parts by weight of bisphenol A epoxy resin DGEBA and stir evenly to obtain the UV-resistant epoxy composition I of the present invention.

Embodiment 2～10

[0038] According to the method of Example 1, anti-ultraviolet epoxy compositions II to X with different compositions were prepared, and their compositions and contents are listed in Table 1.

[0039] Reality

Embodiment 11

[0041] With embodiment 1~10 and comparative example 1 # Prepared anti-ultraviolet epoxy composition I~X and I # After vacuum defoaming, solidify in an oven at 130°C for 2 hours, and take out the sample after cooling in the oven. Then reheat to 130°C for 2h to remove residual stress and volatile components. Then the samples were tested for photoaging properties, mechanical properties, and thermal properties, and the obtained data are listed in Table 2.

[0042] 1. Photoaging performance: The fluorescent lamp Q-UV Tester with a wavelength of 340nm was used to irradiate for 1000h, and the transmittance of the sample was measured with an Agilengt 8453UV-visible Spectroscopy System UV-visible spectrophotometer before and after irradiation.

[0043]2. Mechanical properties: The flexural strength test of the samples was measured on the RGT-20A testing machine of the Cryogenic Materials Laboratory of the Institute of Physics and Chemistry, Chinese Academy of Sciences according to th...

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Abstract

The present invention relates to uvioresistant epoxy composition and its preparation process and use. The uvioresistant epoxy composition is prepared through heating the mixture of curing agent 50-150 weight portions, curing promoter 0.1-5.0 weight portions, ultraviolet stabilizer 0.001-5.0 weight portions and light scattering agent 0.001-1 weight portion to 80-100 deg.c for dissolving completely; cooling; and mixture the mixture with epoxy resin 100 weight portions. It may also include antioxidant 0.1-3.0 weight portions. The uvioresistant epoxy composition has excellent uvioresistant performance, excellent heat resistant performance, glass transition temperature higher than 130 deg.c and high transparency, and is suitable for use in white light LED package. When it is used in package for white light LED based on ultraviolet ray, it can prevent ultraviolet ray from leaking and improve the LED luminous intensity homogeneity.

Description

technical field [0001] The invention relates to an anti-ultraviolet epoxy composition and its preparation method and application. Background technique [0002] Semiconductor lighting devices are one of the most promising high-tech fields in the 21st century. Since the 1990s, with the rise of the third-generation semiconductors represented by gallium nitride, blue and white light-emitting diodes have been successfully developed. The new high-efficiency solid-state light source has the remarkable advantages of long life, energy saving, and environmental protection. It has become another leap in the history of human lighting after incandescent lamps and fluorescent lamps, and its economic and social significance is huge. [0003] At present, epoxy resin is mainly used to encapsulate semiconductor lighting devices. For example, in the prior art, bisphenol A epoxy resin is usually used to encapsulate white light-emitting diodes (LEDs) based on ultraviolet light. Since epoxy resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/524H01L23/28
Inventor 付绍云李元庆杨果李明
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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