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Metal salts of maleimide compounds as conductivity promoters

A technology of maleimide and maleimide acid, which is applied to conductive materials, semiconductor devices, semiconductor/solid-state device components dispersed in non-conductive inorganic materials, etc., can solve the problem of affecting the rheological properties of the composition. And other issues

Inactive Publication Date: 2006-12-27
NAT STARCH & CHEM INVESTMENT HLDG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, both methods may affect the rheology or other performance properties of the composition

Method used

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  • Metal salts of maleimide compounds as conductivity promoters
  • Metal salts of maleimide compounds as conductivity promoters
  • Metal salts of maleimide compounds as conductivity promoters

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1. Preparation of maleimide caproic acid (2.1MOL) / semi-pentahydrate copper nitrate (II) (1.0MOL)

[0020]

[0021] Raw material, maleimide caproic acid

Prepared by adding one molar equivalent of maleic anhydride in acetonitrile to one molar equivalent of 6-aminocaproic acid in acetic acid. The mixture was reacted at room temperature for three hours. The white crystals formed were filtered off, washed with cold acetonitrile and dried to give the amic acid adduct. The amic acid was mixed with triethylamine in toluene, and the mixture was heated to 130° C. for two hours. The water of reaction was collected in a Dean-Stark trap. The organic solvent was evaporated and enough 2M HCl was added to reach a pH of 2. Extracted with ethyl acetate, MgSO 4 Drying followed by evaporation of the solvent affords 6-maleimidocaproic acid (MCA).

[0022] MCA (76.83 g, 0.3641 mol) and 100 mL of water were combined in a 1 liter four necked round bottom flask equipp...

Embodiment 2

[0025] Embodiment 2. Preparation of maleimide propionic acid (2.1MOL) / semi-pentahydrate copper nitrate (II) (1.0MOL)

[0026]

[0027] Maleimide propionic acid (61.58 g, 0.3641 mol) and 100 mL of water were combined in a 1 liter four necked round bottom flask equipped with a mechanical stirrer, thermometer and pH probe. The reaction was heated to 60°C with stirring, resulting in a slightly cloudy golden solution. When the reaction solution was cooled to room temperature, a solution of copper(II) nitrate hemipentahydrate (Aldrich, 223395, 98%) (50.00 g, 0.2150 mol in 50 ml of water) was prepared.

[0028] Join NH 4 OH (28-30% assay), raising the pH to 2.31 to ~7.0. After joining NH 4 During the OH period, the reaction temperature rose to 44°C, and the reactant became quite transparent orange-red. The reaction was cooled to 25°C and the measured pH was 6.64. At this temperature, the reaction became cloudy and a pink solid precipitated out of solution. Add 50 mL of wat...

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Abstract

A conductive resin composition comprises a resin, a conductive filler, and the metal salt of a compound containing maleimide functionality.

Description

field of invention [0001] The present invention relates to a conductive resin composition, particularly to a conductive resin composition containing a metal salt of a maleimide compound. Background of the invention [0002] A conductive filler is added to the resin composition to impart thermal or electrical conductivity. The conductive resin composition is widely used, for example, instead of solder, such as connecting circuit components to a circuit board or connecting a semiconductor chip to a lead frame; for shielding, such as being used as a conductive Coatings; as conductive inks, such as polymer thick film inks or RFID inks for conductive antennas; as tantalum capacitors; or as thermal interface materials, such as silicone or grease for heat dissipation. [0003] In particular, the conductive resin may be used as an adhesive for connecting a semiconductor die or chip to a substrate. For certain applications which require high levels of electri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/20C08L61/06C08L63/00C08L33/00C08L35/00C08L67/00C08L83/04C08L101/12
CPCH01L2224/83851H01L23/36H01L2224/29339H01L24/83H05K1/095C08K5/3415H01L2924/01021H01L2224/2929H01L2224/29344H01L2924/0781H01L2224/29357H01L2924/01079H01L2224/29324H05K2203/121H01L2224/29347H01L2924/01019C08K5/0091H01L2224/29364H01L2224/29355H01L2224/29439H01L2224/29369H01L23/552H01L2924/01012H01L2924/14H01L2924/00014H01L2924/00H01B1/22
Inventor O·M·穆萨
Owner NAT STARCH & CHEM INVESTMENT HLDG CORP