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Radiation-sensitive composition, laminate, process for producing the sane and electronic part

A sensitive, radiation-based technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as inapplicability, pattern formation, etc., achieve high shape retention, improve film thickness reduction, transparency and resistance Excellent medicinal effect

Active Publication Date: 2007-05-09
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curable composition disclosed here is not suitable for effective pattern formation by activating radiation, and when heat-resistant shape retention and solvent resistance are highly required, these requirements may not be fully satisfied.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0124] Hereinafter, the present invention will be explained more specifically with reference to synthesis examples and examples. In addition, the parts and% in each example are quality standards unless otherwise specified.

[0125] In addition, each characteristic was evaluated according to the following method.

[0126] [Weight average molecular weight (Mw) and number average molecular weight (Mn) of polymer]

[0127] Using gel permeation chromatography (manufactured by Tosei Co., Ltd., product name "HLC-8020"), it was determined in terms of molecular weight in terms of polyisoprene.

[0128] [Hydrogenation rate]

[0129] The hydrogenation rate is passed 1 The H-NMR spectrum is obtained as the ratio of the number of moles of hydrogenated carbon-carbon double bonds to the number of moles of carbon-carbon double bonds before hydrogenation.

[0130] [Iodine value]

[0131] Measured in accordance with JIS K0070B.

[0132] [Formation of Patterned Resin Film]

[0133] The radiation-sen...

Synthetic example 1

[0172] 62.5 parts of 8-carboxytetracyclic [4.4.0.1 2，5 .1 7，10 ]Dodec-3-ene, 37.5 parts of N-phenyl-(5-norbornene-2,3-dicarboxyimide), 1.3 parts of 1-hexene, 0.05 parts of 1,3-dimethyl Imidazolidine-2-indene (tricyclohexylphosphino)benzylidene ruthenium dichloride and 400 parts of tetrahydrofuran were put into a nitrogen-substituted glass pressure reactor, and the reaction was carried out at 70°C while stirring. 2 Within hours, polymer solution A (solid content concentration: about 20%) was obtained.

[0173] A part of this polymer solution A was transferred to an autoclave equipped with a stirrer, and hydrogen was dissolved and reacted at a pressure of 4 MPa at 150°C for 5 hours to obtain a polymer solution B containing a hydrogenated polymer (hydrogenation rate 100%). Solid content concentration: about 20%).

[0174] A heat-resistant container with 1 part of activated carbon powder added to 100 parts of polymer solution B was placed in an autoclave, and while stirring, hydrogen ...

Synthetic example 2

[0176] Put 100 parts of 8-methyl-8-methoxycarbonyl tetracyclic [4.4.0.1 2，5 .1 7，10 ]Dodec-3-ene, 1.3 parts of 1-hexene, 0.05 parts of 1,3-dimethylimidazolidine-2-indene (tricyclohexylphosphino)benzylidene ruthenium dichloride, and 400 parts Toluene was added to a glass pressure-resistant reactor replaced with nitrogen, and the polymerization reaction and the hydrogenation reaction were carried out in the same manner as in Synthesis Example 1 to obtain a hydrogenated polymer. The Mw of the hydrogenated polymer obtained was 5300, and the Mn was 3200. The iodine value is 1.

[0177] 100 parts of hydrogenated polymer, 100 parts of N-methylpyrrolidone, 500 parts of propylene glycol and 84.5 parts of potassium hydroxide aqueous solution (85%) were added to the reactor, and heated and stirred at 190°C for 4.5 hours. The obtained reaction solution is poured into a large amount of a mixed solution of water, tetrahydrofuran, and hydrochloric acid to solidify the hydrolyzate. The coagulated...

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PUM

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Abstract

The invention provide a radiation-sensitive composition that excels in electrical properties, being free from any film thickness decrease and developed film detachment at the time of development and that even after heating at high temperature, exhibits high shape retention capability and transparency, also excelling in chemical resistance. Provide is a laminate having a resin film of this radiation-sensitive composition superimposed on a basal plate; and a process for producing the laminate. There is provided a radiation-sensitive composition comprising a polymer having a polar group reactive with an epoxy group, a crosslinking agent containing a polyepoxy compound which has an alicyclic structure in its main chain skeleton and has three or more epoxy groups, and a radiation-sensitive compound. Further, there is provided a laminate comprising a basal plate and a resin film of this crosslinkable resin composition.

Description

Technical field [0001] The present invention relates to a radiation-sensitive composition and a laminate having a resin film obtained from the radiation-sensitive composition on a substrate. More specifically, it relates to electronics suitable for manufacturing display elements, integrated circuit elements, solid-state imaging elements, etc. A radiation-sensitive composition of a component, a laminate having a resin film obtained from the radiation-sensitive composition on a substrate, and a method for producing the same. Background technique [0002] Electronic components such as display elements, integrated circuit elements, solid-state imaging elements, color filters, and black matrices are provided as a protective film to prevent deterioration or damage, a planarizing film to planarize the surface of the element or wiring, and Various resin films such as electrical insulating films for ensuring electrical insulation. In addition, in order to insulate the wirings arranged in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038C08G59/32G03F7/033G03F7/40H01L21/027C08L63/00G03F7/00
CPCC08G59/32C08L63/00G03F7/0007G03F7/038
Inventor 大森宏纪寺田和代木内孝司
Owner ZEON CORP
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