Ring-shaped magnetic multi-layer film having metallic core and method for making same and use
A multi-layer film, metal core technology, applied in the application of magnetic film to substrate, multi-layer film of spin exchange coupling, magnetic layer, etc.
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Embodiment 1
[0066] Example 1. Preparation of non-pinning ring-shaped magnetic multilayer film containing metal core by micromachining method
[0067] Using high-vacuum magnetron sputtering equipment in the 1mm thick SiO cleaned by conventional methods 2 On the / Si substrate, the lower buffer conductive layer Ru with a thickness of 5nm, the hard magnetic layer (HFM) Co with a thickness of 3nm, the intermediate layer (I1) Cu with a thickness of 1nm, and the soft magnetic layer (SFM) with a thickness of 1nm Co and a cap layer Ru with a thickness of 4 nm. The growth conditions of the above-mentioned magnetic multilayer film: prepared vacuum: 5×10 -7 Pa; high-purity argon gas pressure for sputtering: 0.07 Pa; sputtering power: 120 watts; sample holder rotation rate: 20rmp; growth temperature: room temperature; Speed; when depositing hard magnetic layer and soft magnetic layer, an induced magnetic field of 50Oe should be added. The deposited magnetic multilayer film adopts the micro-processi...
Embodiment 2
[0068] Example 2. Using insulator micron, submicron or nanoparticle mask method to prepare non-pinning annular metal core-containing magnetic multilayer film
[0069] Using high-vacuum magnetron sputtering equipment in the 0.3mm thick SiO cleaned by conventional methods 2 On the Si substrate, a lower buffer conductive layer Ta with a thickness of 50nm is sequentially deposited, and a layer of SiO with a diameter of 100nm is dispersed on the lower buffer conductive layer. 2 Insulator micron, submicron or nano particles, and then use high vacuum magnetron sputtering equipment to sequentially grow a hard magnetic layer (HFM) Co with a thickness of 20nm 75 Fe 25 , an intermediate layer (I1) MgO with a thickness of 10 nm, a soft magnetic layer (SFM) Co with a thickness of 10 nm 75 Fe 25 and a capping layer Ta with a thickness of 10 nm. The growth conditions of the above-mentioned magnetic multilayer film: prepared vacuum: 5×10 -7 Pa; high-purity argon gas pressure for sputteri...
Embodiment 3
[0070] Example 3. Preparation of a pinned ring-shaped magnetic multilayer film containing a metal core using a micromachining method
[0071] Using high-vacuum magnetron sputtering equipment in the 0.8mm thick SiO cleaned by conventional methods 2 On the Si substrate, the lower buffer conductive layer Cr with a thickness of 25 nm, the antiferromagnetic pinning layer (AFM) IrMn with a thickness of 10 nm, and the pinned magnetic layer (FM1) Co with a thickness of 3 nm were sequentially deposited. 90 Fe 10 Then deposit 1nm of Al, and the insulating layer formed by plasma oxidation for 50 seconds is used as the intermediate layer (I2); on the intermediate layer, a free soft magnetic layer (FM2) Co with a thickness of 1nm is sequentially deposited. 90 Fe 10 and a capping layer of Cu with a thickness of 2 nm. The growth conditions of the above-mentioned magnetic multilayer film: prepared vacuum: 5×10 -7 Pa; high-purity argon gas pressure for sputtering: 0.07 Pa; sputtering power...
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