Exposure apparatus, exposure method using the same, and method of manufacture of circuit device

Abstract

A reflective member is fixedly or movably provided near the pupil plane of a projection optical system with which a projection exposure apparatus is equipped. A collimated measuring beam with an exposure wavelength is incident from the object plane side or image plane side of the projection optical system, and the intensity of the beam reflected by the reflective member is detected photoelectrically to measure a value corresponding to the attenuation factor (transmissivity or reflectivity) of the projection optical system or the variation with time of the attenuation factor (transmissivity or reflectivity) of the projection optical system. In accordance with the measurement results, the exposing conditions when a photosensitive substrate is exposed are corrected to avoid the deterioration of the exposure control precision due to the variation of the attenuation factor (transmissivity variation or reflectivity variation) which is caused in the projection optical system and illumination optical system of a projection exposure apparatus which uses ultraviolet illumination light.

Description

[0001] The present invention relates to an exposure apparatus for use in a lithography process in a production line for manufacturing semiconductor devices, liquid crystal display devices and an exposure method using such exposure apparatus. The present invention also relates to a method for manufacturing circuit devices for use in forming electronic circuit devices on a semiconductor substrate (wafer), glass substrate, and so on.BACKGROUND TECHNOLOGY[0002] Recently, at plants for manufacturing semiconductor devices such as super LSIs and so on, developments for mass-producing D-RAMs (memory chips), processor chips and the like, having a degree of integration and a fineness of a class of 256 Mbits on a large scale have been carried out extensively with great effort. As developments advance, exposure apparatuses for use in a next-generation lithography process (representatives being processes for coating a resist, exposing, developing resist, etc.) are also required to have a higher ...

AI Technical Summary

Benefits of technology

[0022] In another aspect, the present invention has a further object to provide an improved measurement method for measuring a transmittance in an image projection region of the projection optical system or measuring an average illuminance or an irregularity of illuminance in the image projection region of the projection optical system. In a further aspect, the present invention has a still further object to provide a method for manufacturing a circuit device that can form a pattern image of a circuit device on the substrate always at an appropriate amount of exposing light and in a favorable imaging state.

Problems solved by technology

Moreover, in the case of use of quartz and fluorite for the projection exposure apparatus, achromatism in the projection optical system becomes difficult upon using illumination light.

From these reasons, the narrow-banded laser light source suffers from the disadvantages that a laser output is lowered as compared with a broad-band laser light source, and its life is shorter and its costs of production is more expensive than the broad-band laser light source.

Therefore, at this point of time, there is no way but using two kinds of glass materials, i.e. quartz and fluorite, for the refractive optical elements.

If such improvements could not be made, a throughput will be decreased due to an increase in a longer period of time for exposure.

A decrease in throughput is unacceptable, because it results in higher costs for the production of devices.

As a consequence, severe problems may occur that the transmittance of the projection optical system or the transmittance of the illumination optical system may fluctuate to a great extent for a relatively short period of time.

Such a great fluctuation of the transmittance results in a decrease in a precision for controlling the exposure amount to be provided on the photosensitive substrate, thereby deteriorating a fidelity of transcription of a fine pattern having a design line width of 0.25 to 0.12 micron to be transcribed on the substrate.

Therefore, the such conventional projection exposure apparatus suffers from the disadvantage in that no accurate control of the exposure amount can be performed because no fluctuation in the transmittance of the illumination optical system and the projection optical system behind the portion in the illumination light path is added thereto whatsoever, the portion in the illumination light path being the place where the intensity of the illumination light has been detected for controlling the exposure amount.

In addition, for the causes as described above, there is no assurance that the fluctuation in the transmittance of the projection optical system and the illumination optical system occurs in a uniform manner in the vision field on the image plane side of the projection optical system, so that there is the risk that irregularities of illuminance (or irregularities of the exposure amount) will occur against the projection optical system within the projection region of the pattern image conjugated with the illumination region of the illumination light on the reticle.

Furthermore, there is the concern about an occurrence of the disadvantage that imaging characteristics (e.g., distortion, spherical aberration, astigmatism, coma aberration, etc.) of the projection optical system may vary to a subtle extent, attendant upon an occurrence of such irregularities of illuminance or otherwise.

Therefore, in a projection exposure apparatus using such a laser light source, an error in controlling the exposure amount may occur due to a variation in the transmittance of the illumination optical system and the projection optical system.

Among those causes, in particular, the molecules of the impurities to be attached to the surface of the optical glass material may cause a decrease in an attenuation factor (transmittance or reflectance) in a monotonous way, if they are left non-removed and stayed as they are.

However, once the exposing energy is irradiated, they would be caused to be decomposed chemically and to disperse in a space.

This means to cause the entire attenuation factor (transmittance or reflectance) of the projection optical system and the illumination optical system to fluctuate, each being incorporated with a number of optical elements, and it is difficult to monitor a history of irradiation and the like and to predict characteristics of a variation in the attenuation factor (transmittance or reflectance).

Therefore, a conventional projection exposure apparatus using such an ArF laser light source has an error which may occur in controlling the exposure amount due to a variation in the attenuation factor (variation in transmittance or variation in reflectance) of the illumination system and the projection optical system.

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