Unlock instant, AI-driven research and patent intelligence for your innovation.

CMP apparatus

a technology of cmp and cmp plates, which is applied in the direction of grinding/polishing apparatuses, manufacturing tools, lapping machines, etc., can solve the problems of failure to meet the standard, slurry adhesion, and the apparatus inside cannot be observed by the eye, so as to improve the wettability of the apparatus, reduce the adhesion of slurry, and increase the material cost

Inactive Publication Date: 2008-12-04
DAIKIN IND LTD
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a CMP apparatus that is less likely to have slurry adhesion, easy to clean, and resistant to chemicals. This is achieved by covering certain surfaces with a fluororesin material.

Problems solved by technology

There is a problem, however; on the occasion of polishing, splashes of the slurry are scattered and stick to the inside walls of the apparatus main body made of a SUS stainless steel, acrylic resin, polycarbonate resin, rigid poly(vinyl chloride) resin or the like and the inside surfaces of other apparatus and they then dry and become fixed to such walls or surfaces.
In case such fixed slurry splashes, after gradual deposition, fall off from the surface on which they have remained onto the surface under polishing, a problem arises: scratches are given to the product, making the same fail to meet the standard.
Further, when the member surrounding the polishing machine in a CMP apparatus is made of a transparent resin, the slurry adhesion produces another problem: the apparatus inside can no longer be observed by the eye.
However, it is a problem that the slurry once fixed thereto can hardly be removed and the working efficiency is low.
In particular, various cleaners are available on the market but are expensive; and, there is still a problem that a satisfactory level of cleanability has not yet attained with them.
There is still a problem, however; the solution is expensive and the cleanability is not yet sufficient.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • CMP apparatus
  • CMP apparatus

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

Fluororesin Synthesis

[0104]A 820-L glass-lined autoclave was charged with 200 L of pure water and, after sufficient substitution of the system inside gas with nitrogen and the subsequent evacuation, further charged with 113 kg of 1-fluoro-1,1-dichloroethane, 95 kg of hexafluoropropylene and 85 g of cyclohexane. Then, 292 g of perfluoro(1,1,5-trihydro-1-pentene) [CH2═CF(CF2)3H] was fed into the autoclave by means of nitrogen gas, and the vessel inside temperature was maintained at 35° C. and the stirring rate at 200 rpm. Further, tetrafluoroethylene was fed under pressure until arrival of the inside pressure at 7.25 kg / cm2G and then ethylene was fed under pressure until arrival of the inside pressure at 8 kg / cm2G.

[0105]Then, 1.9 kg of a 50% (by mass) solution of di-n-propyl peroxydicarbonate in methanol was fed to the autoclave to initiate the polymerization. The polymerization was continued while maintaining the polymerization pressure at 8 kg / cm2G by additionally feeding, under pre...

example 1

[0107]The fluororesin obtained in Synthesis Example 1 and a nylon 6 / 66 copolymer (Novamid 2430J, product of Mitsubishi Engineering-Plastics Corp.) were subjected to coextrusion using a T die film molding machine (product of Ikegai Corp.) to give a two-layer laminate film (thickness: EFEP layer 10 μm, nylon 6 / 66 copolymer layer 70 μm, total 80 μm).

[0108]Upon adhesion strength measurement of the above laminate film, peeling was impossible.

[0109]The nylon 6 / 66 copolymer side of the above laminate film was coated with an acrylic adhesive (product name S153B, product of Toyo Ink Manufacturing Co.) using a doctor roll coater and the laminate was then stuck on the surface of a rigid poly(vinyl chloride) sheet (30 mm×50 mm in size), and the whole was placed on the inside surface of a CMP apparatus (Musashino Denshi Kogyo's MA-200).

examples 2 and 3

[0110]A laminate film was produced in the same manner as in Example 1 except that an ethylene / vinyl acetate copolymer (F101A, product of Kuraray Co.) or epoxy-modified polyethylene (Bondfast E, product of Sumitomo Chemical Co.) was used in lieu of the nylon 6 / 66 copolymer. Each laminate was placed on the inside surface of the CMP apparatus.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a CMP apparatus.[0003]2. Description of the Prior Art[0004]Chemical mechanical polishing (CMP) apparatus are used for the purpose of flattening polishing target members, such as wafer, interconnection layer and insulating layer surfaces, in the processes for manufacturing IC devices, LSIs and other semiconductor devices, and substrates for thin film magnetic heads, among others.[0005]In CMP apparatus, polishing is carried out by dropping a slurry (abrasive slurry) onto an polishing pad. There is a problem, however; on the occasion of polishing, splashes of the slurry are scattered and stick to the inside walls of the apparatus main body made of a SUS stainless steel, acrylic resin, polycarbonate resin, rigid poly(vinyl chloride) resin or the like and the inside surfaces of other apparatus and they then dry and become fixed to such walls or surfaces.[0006]In case such fixed slurry splashe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B24B29/02
CPCB24B37/04B24B57/02
Inventor OZAKI, HIDENORIKOMORI, MASAJIHIGUCHI, TATSUYA
Owner DAIKIN IND LTD