FIB Process for Selective and Clean Etching of Copper

a selective and clean etching technology, applied in vacuum evaporation coatings, sputtering coatings, coatings, etc., can solve the problems of difficult to achieve clean uniform fib etching of copper for ce, non-uniform and uneven fib etching of copper, and rough surface of etched copper, etc., to prevent electrical short circuit, low volatility, and high stickiness
US20110048931A1Inactive Publication Date: 2011-03-03TIZA LAB
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
TIZA LAB
Publication Date
2011-03-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

Etch assisting agents for focused ion beam (FIB) etching of copper for circuit editing of integrated circuits both prevent loss of adjacent dielectric due to sputtering by the ion beam, and render sputtered re-deposited copper on adjacent surfaces non-conductive to avoid electrical short circuits. The agents comprise hydrazine and hydrazine derivatives having an N—N(N being Nitrogen) bonding in their molecules and boiling points between about 70° and 220° C., and NitrosAmine derivatives saturated with two hydrocarbon groups selected from Methyl, Ethyl, Propyl and Butyl. Preferred agents are Hydrazine monohydrate (HMH), HydroxyEthylHydrazine (HEH), NDMA, NMEA, NDEA, NMPA, NEPA, NDPA, NMBA or NEBA, alone or in combination with Nitrogen Tetroxide. The agents are effective for etching copper in high aspect ratio (deep) holes.
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Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation-in-part (CIP) of U.S. application Ser. No. 12 / 547,368, filed Aug. 25, 2009.BACKGROUND OF THE INVENTION

[0002] This invention relates generally to focused ion beam etching of copper and copper materials, and more particularly to the chemically-assisted etching of copper over dielectric materials.

[0003] Copper (Cu) is the primary material used in integrated circuits (ICs) to create electrically conductive interconnects, and the etching of copper in ICs using focused ion beam (FIB) techniques is important in the field of circuit editing (CE) for failure verification and debugging of the ICs. Circuit editing of ICs with a focused-ion-beam (FIB) system requires that copper planes and traces be milled (cut) uniformly and cleanly so as to electrically isolate circuit elements across the separation created.

[0004] Achieving clean uniform FIB etching of copper for CE is difficult. In spite of significant past efforts ...

Claims

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