Gas barrier laminated film and laminated material using it

A gas barrier and film technology, applied in coatings, rigid containers, layered products, etc., can solve the problems of mechanical strength deterioration such as adhesive strength, gas barrier property reduction, and content quality deterioration, etc., to achieve excellent gas barrier properties , Excellent impact resistance

Active Publication Date: 2007-09-19
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, polar groups such as hydroxyl and amide groups are easy to combine with water molecules, so that their gas barrier properties decrease with the increase of ambient humidity.
That is to say, when the content is a liquid containing moisture, or food containing moisture is added, the gas barrier property is reduced due to the influence of moisture vapor in the c

Method used

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  • Gas barrier laminated film and laminated material using it
  • Gas barrier laminated film and laminated material using it
  • Gas barrier laminated film and laminated material using it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0204] (1) Using a biaxially stretched polyethylene terephthalate film with a thickness of 12 μm, it was mounted on the delivery roll of the plasma chemical vapor deposition apparatus, and then, according to the conditions shown below, the A vapor-deposited film of silicon oxide having a thickness of 200 angstroms was formed on the corona-treated surface of the axially stretched polyethylene terephthalate film.

[0205] (deposition condition)

[0206] Evaporation surface: corona treatment surface

[0207] The gas introduced is: hexamethyldisiloxane: oxygen: helium = 1.0: 3.0: 3.0 (unit: slm)

[0208] Vacuum degree in vacuum chamber: 2~6×10 -6 mBar

[0209] Vacuum degree in evaporation chamber: 2~5×10 -3 mBar

[0210] Cooling and electrode drum power supply: 10kW

[0211] Line speed: 100m / min

[0212] Next, immediately after forming the vapor-deposited film of silicon oxide with a film thickness of 200 angstroms in the above, on the surface of the vapor-deposited film of...

Embodiment 2

[0230] (1) Use a biaxially stretched polyethylene terephthalate film with a thickness of 12 μm, install it on the delivery roll of the plasma chemical vapor deposition device, and then, according to the conditions shown below, in the above-mentioned A vapor-deposited film of silicon oxide having a thickness of 200 angstroms was formed on the corona-treated surface of the biaxially stretched polyethylene terephthalate film.

[0231] (deposition condition)

[0232] Evaporation surface: corona treatment surface

[0233] The amount of gas introduced is: hexamethyldisiloxane: oxygen: helium = 1.0: 3.0: 3.0 (unit: slm)

[0234] Vacuum degree in vacuum chamber: 2~6×10 -6 mBar

[0235] Vacuum degree in evaporation chamber: 2~5×10 -3 mBar

[0236] Cooling and electrode drum power supply: 10kW

[0237] Line speed: 100m / min

[0238] Next, immediately after forming the vapor-deposited film of silicon oxide with a film thickness of 200 angstroms in the above, on the surface of the v...

Embodiment 3

[0253] (1) Use a biaxially stretched polyethylene terephthalate film with a thickness of 12 μm, install it on the delivery roll of the plasma chemical vapor deposition device, and biaxially stretch it according to the conditions shown below. A silicon oxide vapor-deposited film with a thickness of 200 angstroms was formed on the corona-treated surface of the nylon film.

[0254] (deposition condition)

[0255] The reaction gas mixing ratio is: hexamethyldisiloxane: oxygen: helium = 1.2: 5.0: 2.5 (unit: Slm)

[0256] Arrival pressure: 5.0×10 -5 mbar

[0257] Membrane pressure: 7.0×10 -2 mbar

[0258] Line speed: 150m / min

[0259] Power: 35kW

[0260] Next, just after forming the vapor-deposited film of silicon oxide with a thickness of 200 angstroms in the above, on the surface of the vapor-deposited film of silicon oxide, a glow discharge plasma generator was used under a power of 9 kw using oxygen: argon = The mixed gas formed by 7.0:2.5 (unit: Slm), at the mixed gas p...

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Abstract

Disclosed is a gas barrier multilayer film having excellent gas barrier properties, transparency and excellent impact resistance. Also disclosed is a method for producing such a gas barrier multilayer film. Specifically disclosed is a gas barrier multilayer film wherein a vapor deposition film of an inorganic oxide is formed on a base and a gas barrier coating film is formed on the vapor deposition film. Such a gas barrier multilayer film is characterized in that a side of the base on which the vapor deposition film is to be formed is subjected to a pretreatment or a primer coating treatment and the gas barrier coating film is formed by applying a gas barrier coating liquid on the inorganic oxide film and then heating the thus-applied coating liquid.

Description

technical field [0001] The present invention relates to a laminated film having gas barrier properties and a method for producing the same, and more specifically, to a laminated film having excellent gas barrier properties, transparency, and impact resistance, and its production method. Background technique [0002] Conventionally, as a packaging material having gas barrier properties, a packaging material in which an aluminum foil layer is provided on a base material has been used. However, although this packaging material has stable gas barrier properties, it has problems such as poor incineration suitability and difficulty in disposal after use because it has an aluminum foil layer as a barrier layer. In addition, since it has an aluminum foil layer, there is also a problem that a transparent packaging material cannot be obtained. [0003] In order to solve such problems, a packaging material having a barrier layer formed of polyvinylidene chloride (PVDC) or ethylene-vi...

Claims

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Application Information

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IPC IPC(8): B32B9/00C23C14/08C23C16/42B65D1/00
Inventor 藤井均秋田纪雄柴田步千叶大道三上浩一坂元寿
Owner DAI NIPPON PRINTING CO LTD
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