Method of pre-electrodepositing copper on zinc surface by ion liquid

A technology of ionic liquid and copper deposition, applied in the field of pre-electrodeposition of copper on zinc surface

Inactive Publication Date: 2007-10-17
SHANGHAI UNIV
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for pre-electrodepositing copper on the surface of zinc by using ionic liquids, so as to solve the en

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[0018] Butyl chloride and 1-methyl-imidazole are dissolved in a mixed solvent of toluene and water in a molar ratio of 1:1, wherein the volume ratio of toluene and water is 1:1, and after heating to reflux for 72 hours, Obtain the 1-methyl-3-butylimidazolium chloride ionic liquid intermediate; then use a rotary evaporator to remove impurities in vacuum at 80-82°C for 5-6 hours; combine the ionic liquid intermediate with Ammonium fluoroborate is mixed into a mixed solution in a molar ratio of 1.1:1, and acetone is added as a reaction medium, wherein the volume ratio of acetone to the mixed solution is 1:1, and after reflux reaction for 72 hours, the ammonium chloride is separated by filtration, and the filtrate is Vacuum rotary evaporation at 80-82°C for 18-24 hours to remove acetone, other side-reaction organic impurities and moisture to obtain BMIBF 4 ionic liquid; under stirring, add anhydrous cuprous chloride to the BMIBF 4 In the ionic liquid until saturated; the pretreat...

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Abstract

The present invention relates to a process for pre-electrodeposition of copper at zincium surface by adopting ion liquid. Said method in accordance with the present invention comprises the following steps: selectively synthesizing intermediate of chlorinated 1-methyl-3-butyl-imidazole (BMIM-Cl), preparing BMIBF4 ionic liquid from the BMIM-Cl together with NH4BF4, adding the intermediate of 10%(BMIM-Cl ) and dissolving it in BMIBF4 ionic liquid, and adding waterless copper chloride into the ionic liquid mentioned above finally, stirring them uniformly to form an ionic liquid electrolyte for electroplate copper, wherein said ionic liquid can be used for electric plating zincium surface with one layer of cuprum because that the ionic liquid will substantially not erode surfaces of zincium substrate and will not be involved in a metatheticalreaction with the cupric ions in the ionic liquid at the same time. The electrical current efficiency of the ionic liquid for pre-electrodeposition of copper in accordance with the present invention may achieve 100%. The pin-holing phenomena in plating and hydrogen separation in aqueous solution electrodeposition of copper will not occur for the ionic liquid for electrodeposition of copper. Said ionic liquid for electrodeposition of copper will not pollute the environments.

Description

technical field [0001] The invention relates to a method for pre-electrodepositing copper on the surface of zinc, in particular to a method for pre-electrodepositing copper on the surface of zinc by using ionic liquid. Background technique [0002] Zinc alloy die castings are low in price, high in production efficiency, high in processing accuracy, and have certain mechanical strength. They can be die-cast into various parts with complex shapes and high precision. Corrosion resistance and low price are used in daily hardware, light industrial appliances, machinery and electronics, and imitation crafts. For this reason, domestic electroplating workers have conducted a lot of research on the electroplating technology of zinc die castings in recent years. [0003] The surface chemical properties of zinc castings are relatively active, and their corrosion resistance is relatively poor. Therefore, it is necessary to electroplate a layer of metal with strong corrosion resistance ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/34
Inventor 朱萍周鸣吴金华周劲
Owner SHANGHAI UNIV
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