Metal circuit board of aluminum baseplate magnetic-controlled sputtering-jetted and LED illuminating device

Abstract

The preparation method comprises: making insulation oxidation treatment for the surface of aluminium substrate to form a oxide coating having electrical insulation property on the aluminium substrate surface; using masking or photo etch approach to form circuit pattern on the oxide coating; using magnetron sputtering method to alternatively deposit basilar membrane, conduction membrane and soldering membrane so as to form the metalized circuit layer with heat conductivity and solderability; encapsulating electronic component or LED chip on it. The invention can be used the encapsulation substrate of the thick film circuit and LED chip.

Description

Technical field: [0001] The invention relates to a direct heat dissipation aluminum-based insulating and oxidized circuit board used for electronic components or LED chips, and a high-power LED lighting device manufactured by using an aluminum-based insulating and oxidized circuit board, an aluminum-based circuit board and an aluminum-based circuit board. High-power LED lighting device manufacturing field. Background technique: [0002] With the rapid development of electronic technology, electronic components are increasingly miniaturized, especially the development of high-power LEDs, which makes the heat generation per unit volume of components rise step by step, which will seriously affect the performance improvement and work of components. reliability. There is an urgent need for a semiconductor packaging substrate with low cost, high heat dissipation, and compliance with international environmental protection trends. In addition to conventional heat dissipation techn...

AI Technical Summary

Problems solved by technology

Its shortcomings: first, the preparation process is complicated, energy consumption is large, and the cost is high; second, due to its processing technology requirements and material characteristics, it is not easy to make a structure with heat dissipation characteristics

But the disadvantages: First, this process consumes a lot of energy. The silver paste needs to be sintered at a peak temperature of 575-650°C for 8-12 minutes, and the entire sintering cycle takes 40-60 minutes; second, the thickness of the silver paste is relatively thick and expensive. More metal materials are used and the cost is high; what is more serious is that the silver paste used in the background technology contains heavy metals such as lead, which does not meet the RoHS requirements, so it is difficult to popularize and apply; the third is the long production cycle, such as including screen printing and sintering The process takes at least 90 minutes, and the production efficiency is low; Fourth, the insulation performance of the oxide layer formed by oxidation will be greatly reduced after high-temperature sintering

But the disadvantages: first, the preparation process is complex, energy-consuming, long cycle, high cost, not convenient for mass production; second, due to its poor mechanical properties, it is not easy to make a structure with heat dissipation characteristics

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