Modified polyphenyl composite insulation board and production technique thereof

Abstract

The present invention relates to the technical field of energy-saving, environment-friendly building materials, in particular to a modified polyphenyl composite thermal insulation board and a production technique thereof. The present invention also relates to the fabrication method of the thermal insulation board material, the thermal insulation board material includes six layers: the first layer is polymer mortar, the second layer is fiber glass mesh cloth, the third layer is a modified polyphenyl board, the fourth layer is polymer adhesive emulsion, the fifth layer is a calcium silicate board and the sixth layer is coating, and with a novel production technique, the six layers are compounded together to form the thermal insulation board material. Because the modified polyphenyl board is added with 5 percent to 10 percent of rare earth material, diatomite, and an aluminium plate is embedded in the middle, the properties of the product, such as ageing resistance, crack resistance, etc., are increased, and meanwhile, the service life of the product is prolonged by over one time.

Description

Technical field: [0001] The invention relates to the technical field of energy-saving and environment-friendly building materials, in particular to a modified polystyrene composite thermal insulation board and its production process. Background technique: [0002] At present, my country's construction industry is developing very fast, but all kinds of wall materials and roof insulation boards are very backward. With the increase of high-rise buildings, most of them use frame structures to pour cement wall panels as a whole, which has poor thermal insulation and requires additional insulation layers. Therefore, my country's wall reform is imperative, in view of this, several wall insulation panels came into being. About, foam cement board, gypsum foam board, foam polystyrene board or colloidal materials such as cement, gypsum, magnesite powder, plus fly ash, wood chips or plant fibers. Generally speaking, most of the above materials have the above disadvantages: large capacit...

AI Technical Summary

Problems solved by technology

Generally speaking, most of the above materials have the above disadvantages: large capacity, unsatisfactory thermal conductivity, low strength, and thick plates

In addition, if wood chips and plant fibers are used as reinforced skeleton materials, it is difficult to withstand the test of time, and it is worrying in terms of durability.