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Silver-graphitic electrical contact composite plating layer and method of preparing the same

A composite coating and electrical contact technology, applied in the field of metal materials, can solve the problems of rough coating surface, short service life, environmental pollution, etc., and achieve the effect of smooth surface, low production cost and simple process

Inactive Publication Date: 2008-09-03
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the innovation of the prior art, Siemens Company of Germany developed a process method for preparing silver-graphite composite coating by composite electroplating under the cyanide silver plating system, but the existing problem is that the surface of the prepared coating is rough, loose and porous, resulting in wear big, not long lifespan
At the same time, because cyanide is highly toxic and causes huge pollution to the environment, it will soon face elimination.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The first step is to prepare a composite electroplating solution: the parameters of the prepared electroplating solution are: silver methanesulfonate 0.05M / L, succinimide 0.25M / L, boric acid 0.05M / L, graphite content 10g / L, pH 8.

[0022] The second step, the dispersion of graphite particles: add dispersant content 2g / L (lauryl polyoxyethylene ether) to the composite electroplating solution, then stir for 10 minutes to fully dissolve it, and then place the composite electroplating solution in an ultrasonic tank Ultrasonic treatment in medium for 10 minutes to fully disperse the graphite colloid in the solution.

[0023] The third step, substrate pretreatment:

[0024] Configure the mixed acid for removing oxidation film: the volume percentage is: H 2 SO 4 : HNO 3 :HCl=90:9:1.

[0025] Place the base copper parts in acetone solution, degrease in an ultrasonic tank for 5 minutes, and then pickle in a mixed acid for 1 second to remove the oxide film.

[0026] The four...

Embodiment 2

[0029] In the first step, the parameters of the prepared electroplating solution are:

[0030] Silver methanesulfonate 0.15M / L, succinimide 0.75M / L, boric acid 0.15M / L, graphite content 30g / L, pH 10.

[0031] The second step, the dispersion of graphite particles:

[0032] Add dispersant 2g / L (polyoxyethylene lauryl ether) to the composite electroplating solution, then stir for 20 minutes to make it fully dissolve, then place the composite electroplating solution in an ultrasonic tank for ultrasonic treatment for 20 minutes, so that the The graphite colloid is fully dispersed.

[0033] The third step, substrate pretreatment:

[0034] Configure the mixed acid for removing oxidation film: the volume percentage is: H 2 SO 4 : HNO 3 :HCl=90:9:1.

[0035] Place the base copper parts in acetone solution, degrease in an ultrasonic tank for 10 minutes, and then pickle in a mixed acid for 3 seconds to remove the oxide film.

[0036] The fourth step, composite plating:

[0037] T...

Embodiment 3

[0039] In the first step, the parameters of the prepared electroplating solution are: silver methanesulfonate 0.5M / L, succinimide 1.5M / L, boric acid 0.5M / L, graphite content 50g / L, pH11.

[0040] The second step, the dispersion of graphite particles:

[0041] Add dispersant 2g / L (lauryl polyoxyethylene ether) to the composite electroplating solution, then stir for 30 minutes to make it fully dissolve, then place the composite electroplating solution in an ultrasonic tank for ultrasonic treatment for 30 minutes, so that the The graphite colloid is fully dispersed.

[0042] The third step, substrate pretreatment:

[0043] Configure the mixed acid for removing oxidation film: the volume percentage is: H 2 SO 4 : HNO 3 :HCl=90:9:1.

[0044] Place the base copper parts in acetone solution, degrease in an ultrasonic bath for 15 minutes, and then pickle in a mixed acid for 5 seconds to remove the oxide film.

[0045] The fourth step, composite plating:

[0046] The pretreated ...

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Abstract

Silver -black lead electrical contact composite plating and manufacture method thereof, which belongs to metallic material technology field. The steps are: confecting compound plating solution, black lead granule dispersing, and substrate preprocess, compound plating solution ingredient: methane sulfonic acid silver 0.05M / L, succinimide 0.15M / L-1.5M / L, composite plating. boracic acid 0.5M / L-0.5M / L, black lead content in solution 2g / L-50g / L. The composite plating is made up of silver and black lead, wherein the black lead volume percent is: 1-15%, silver volume fraction 85%-99%, contact resistance 1.2-2m Omega, hardness 70-100Hv, density more than 99.9%. The present invention plating solution is protection environment and non-toxic; the ultrasonic energy promoting adequate distribution of black lead granule, the produced composite plating has smooth surface and high density.

Description

technical field [0001] The invention relates to a silver-graphite composite material and a preparation method thereof, in particular to a silver-graphite electric contact composite coating and a preparation method thereof, belonging to the technical field of metal materials. Background technique [0002] Silver is widely used as an electrical contact material in industry, but pure silver has low hardness, poor wear resistance, and poor welding resistance. The composite of silver and graphite not only has excellent lubricity, but also greatly improves the oxidation resistance and welding resistance of silver, so it has special application advantages in parts that require sliding contact. At present, powder metallurgy is mainly used in the industry to prepare silver-graphite composite materials. There are problems such as poor material density, uneven distribution of graphite, poor electrical life of contacts, and the inability to prepare parts with complex shapes. In additio...

Claims

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Application Information

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IPC IPC(8): H01H1/02H01H1/025H01B1/00C25D3/46
Inventor 陈哲王浩伟张亦杰李险峰马乃恒
Owner SHANGHAI JIAO TONG UNIV
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