Epoxy adhesive used under low temperature

Abstract

The invention relates to an epoxy resin adhesive used under low temperature, which comprises epoxy resin, a liquid aromatic amine curing agent, a modifying agent and a coupling agent; the weight proportion of the epoxy resin, the liquid aromatic amine curing agent, the modifying agent and the coupling agent is 100:(10-50):(0-40):(0-3); the epoxy resin can adopt aromatic glycidyl ether epoxy resin, aromatic glycidyl amine epoxy resin or alicyclic ethylene oxidic ester epoxy resin; the liquid aromatic amine curing agent adopts a liquid aromatic diamine curing agent; the modifying agent adopts a flexible flexibilizer including polyester, polyurethane or / and polyether segment; the coupling agent adopts gamma-aminopropyltriethoxylsilane or gamma-glycidyl ether propyl trimethoxy silane. The adhesive is liquid at the room temperature and low temperature, thereby having good flow property, tenacity and cold-proof and heat-proof impact property; the performance of the adhesive is stable; the preparation method is simple; in addition, the used raw materials all come from the market, and the raw materials are low in price and are easy to be acquired.

Description

Technical field [0001] The invention relates to an adhesive, particularly an epoxy resin adhesive for low temperature. Background technique [0002] Relatively high-quality resin-based composite materials are favored for their typical lightweight characteristics, excellent specific strength, specific modulus, unique ablation resistance, designability of material properties, flexibility of preparation, and ease of processing. In addition to the use of high-performance reinforcing materials (such as high-strength, high-modulus carbon fiber or glass fiber), the resin matrix composite material must also have high performance. In the fields of aerospace and electrical applications, the matrix materials are mostly thermosetting resin systems, and epoxy resin systems occupy an absolute dominant position. In recent years, due to the development of large-scale low-temperature engineering, superconducting applications, and the aerospace industry, there has been an increasing demand for hig...

AI Technical Summary

Problems solved by technology

However, because aromatic amines are mostly crystals or solid powders, which bring a lot of inconvenience to the construction process, coupled with severe toxicity and strong dyeing properties (which can make the skin and utensils turn yellowish brown and difficult to wash off), people stay away from them, so they appear. Many modified products

However, the modification also brings about the denaturation of the cured product, generally resulting in poor performance.

[0003] In addition, the cured product of pure epoxy resin has a high cross-linking density. Even at room temperature, there are disadvantages such as brittleness, low toughness, and poor impact resistance. When the temperature drops to low temperature, the cold shrinkage of the adhesive itself makes the adhesive Larger thermal stress concentration occurs inside. In addition, the chain segments of the polymer will be frozen, and the movement of molecular chains is extremely difficult, which increases the brittleness of the adhesive.

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