Chemical nickel plating process on surface of wood

A technology for electroless nickel plating and wood surface, applied in the field of chemical plating on wood surface, can solve the problems of environmental pollution coating and non-metal bonding strength, complex process, complex composition of activation solution, etc., achieves good electromagnetic shielding effect, does not pollute the environment, simple method effect

Inactive Publication Date: 2010-11-17
NORTHEAST FORESTRY UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a method for electroless nickel plating on wood surfaces in order to solve the problems of complex activation solution composition, complex process, polluted environment and low bonding strength between coating and non-metal existing in the existing non-metal electroless nickel plating

Method used

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  • Chemical nickel plating process on surface of wood
  • Chemical nickel plating process on surface of wood
  • Chemical nickel plating process on surface of wood

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specific Embodiment approach 1

[0008] Specific embodiment one: the method for chemical nickel plating on the wood surface of the present embodiment is realized according to the following steps: one, NaBH 4 Solution and NaOH solution are mixed to obtain reducing agent, and NaBH in reducing agent 4 The concentration of NaOH is 2-10g / L, and the concentration of NaOH is 0.5-5g / L; 2. Mix nickel sulfate, sodium hypophosphite, sodium acetate, lactic acid, ammonium chloride and thiourea solution to obtain a plating solution, and the pH of the plating solution is The value is 7~9, the concentration of nickel sulfate in the plating solution is 20~50g / L, the concentration of sodium hypophosphite is 20~50g / L, the concentration of sodium acetate is 10~30g / L, and the concentration of lactic acid is 10~50g / L. 25mL / L, the concentration of ammonium chloride is 10-30g / L, and the concentration of thiourea is 0.001-0.006g / L; 3. Immerse the wood in the reducing agent for 2-10min, take it out and place it at room temperature for...

specific Embodiment approach 2

[0009] Specific embodiment two: the difference between this embodiment and specific embodiment one is that NaBH in step one reducing agent 4 The concentration of NaOH is 5g / L, and the concentration of NaOH is 2g / L. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0010] Specific embodiment three: what this embodiment is different from specific embodiment one is that the concentration of nickel sulfate in the step two plating solution is 35g / L, the concentration of sodium hypophosphite is 35g / L, the concentration of sodium acetate is 20g / L, The concentration of lactic acid was 18mL / L, the concentration of ammonium chloride was 23g / L, and the concentration of thiourea was 0.003g / L. Other steps and parameters are the same as those in Embodiment 1.

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Abstract

The invention relates to a method for chemical nickel plating on the surface of wood, which relates to a surface chemical plating method. The method solves the problems in the prior nonmetal chemical nickel plating of complex compositions of activating agent, complex technique, environmental pollution and low bonding strength between a coating and nonmetals. The method is as follows: firstly, reducer solution is prepared; secondly, plating solution is prepared; thirdly, the wood is immersed into the reducer, is taken out and stands at a room temperature, and then immersed into the plating solution, and the wood with surface chemical nickel plating is obtained. The method is simple and easy to operate, does not use toxic and volatile substances, does not pollute the environment, and has high bonding strength between the coating and the wood surface.

Description

technical field [0001] The invention relates to a method for chemical plating on the surface of wood. Background technique [0002] Electroless plating can be plated with complex shapes of plating materials, the coating is uniform, and the mechanical properties are good. It can endow non-metals with surface conductivity and electromagnetic shielding properties. It is an important way for non-metals to be metallized. Wood electroless plating is generally activated by colloidal palladium, but PdCl 2 It is a salt of precious metal, which is expensive, toxic and complicated in process. Therefore, at present, active nickel is used instead of metal palladium to reduce the cost and be environmentally friendly; however, in the existing non-metallic electroless nickel plating, there are complex components of the activation solution, complex processes, and poor coating performance, which are mainly manifested in the gap between the coating and the non-metal. The bonding strength bet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36
Inventor 王立娟李坚刘一星冯昊
Owner NORTHEAST FORESTRY UNIVERSITY
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