Manufacturing method for multilayered rigidity and flexibility combined printed circuit board

Abstract

The invention discloses a method for manufacturing multilayer flex-rigid printed circuit boards, and aims to solve the technical problem of filling efficiency and product quality in the process of processing the multilayer flex-rigid printed circuit boards. The method comprises that: preprocesses of a rigid circuit board part and a flexible circuit board part are carried out respectively, laminated and formatted, and then thermally compressed and overlapped, and a filler piece is processed by a punching method for the rigidity wiring board part; and when a rigid circuit board is processed, a rigid single-side copper-clad material is adopted, and then the following steps are completed in order: drilling, punching, transfer of inner layer patterns, etching of an inner layer circuit, circuit inspection, surface multibond, and semi-solid preparation of a rigid outer layer film of a washer and pure copper foil. Compared with the prior technology, hardware mould is directly used to perform die cutting on the filler piece on the position of a filling area; therefore, the method reduces the generation of bug dust in the processing process, has good leak tightness of the filling position, and greatly improves the reliability of performance and product percent of pass.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a rigid-flexible multilayer printed circuit board. Background technique [0002] In recent years, with the rapid growth of consumer electronics products, such as mobile phones, laptop computers, digital cameras, digital cameras, VCD, DVD, miniature tape recorders, pickups and fitness monitors, the printed circuit board PCB has been continuously developed to high density. , high precision, high reliability, large area, thin line and small aperture, resulting in a single rigid printed board or flexible printed board can no longer meet the requirements of miniaturization, light weight and multi-function of electronic products , So rigid-flexible printed circuit boards appeared. Rigid-Flex Printed Circuit Board (Rigid-Flex Printed Circuit Board), also known as rigid-flex board, referred to as R-FPCB, is selectively laminated by rigid an...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the rigid part adopts the gong plate (that is, processed by a CNC milling machine) to process the filling piece, and the filling piece of the epoxy resin plate is separately milled into a layered filling area. The disadvantages are: (1) It will cause The generated dust increases, pollutes the surface of the product, needs to increase the cleaning process, increases the cost, and the quality is also affected to a certain extent; (2) Because the diameter of the milling cutter has a certain width, the area of ​​the filling piece is reduced after processing, and the filling piece It cannot be used for filling the original area, so it is necessary to reuse the epoxy resin board of the same specification to process the same size filler piece to fill the empty slot of the rigid-flex printed circuit board, which not only wastes materials but also increases manufacturing costs, and the efficiency is greatly reduced. And there are also deviations in the degree of fit; (3) due to the need for manual single-piece filling, the efficiency is low, and it is uneven, the standard is not uniform, and it is easy to cause artificial quality effects; (4) because the filling gap is uneven or there are seams, the The surface of the product is polluted during liquid etching and micro-acid cleani

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