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Rapid thermal pressed sintering molding process for titanium-aluminum alloy targets

A technology of hot-press sintering and titanium-aluminum alloy, which is applied in the fields of metal materials, vacuum surface coating materials, and powder metallurgy processing. Industrial applications and other issues, to achieve the effect of small grains, high density, and low cost

Active Publication Date: 2009-09-09
HUNAN HYDRO DYNAMIC NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When manufacturing titanium-aluminum alloy targets by smelting process, bubbles, porosity and segregation are prone to occur during the casting process; at the same time, it is difficult to ensure the uniformity of the composition and structure of the alloy, resulting in unstable target quality, and at the same time, the size is too small, which limits its For large-scale industrial applications, the powder metallurgy hot isostatic pressing sintering method used has high process requirements, unstable material properties, high cost, and difficult practical use

Method used

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  • Rapid thermal pressed sintering molding process for titanium-aluminum alloy targets
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  • Rapid thermal pressed sintering molding process for titanium-aluminum alloy targets

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Experimental program
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Effect test

Embodiment 1

[0025] It is aimed at the magnetron sputtering target material whose alloy composition is 25at% Ti-Al composition.

[0026] Ti powder with an average particle size of 50 μm and Al powder with a particle size of 10 μm are used, wherein the purity of the Ti powder is 99.9%, the purity of the Al powder is 99.9%, and the oxygen content is lower than 200ppm. After weighing the two powders according to the mass component ratio of 37:63, they were mixed in a ball mill for 12 hours. Put the mixed powder into the mold and vibrate evenly. Place the mold with Ti-Al powder on the induction heating hot press, see figure 1 , 1-upper indenter, 2-lower indenter, 3-hot die, 4-upper die pad, 5-Ti-Al target, 6-lower die pad, pre-press the indenter at room temperature Mold, the pressing force is 5MPa. The upper and lower rams can heat the entire mold together with the internal metal powder by passing current. When the temperature rise rate reaches 480°C, keep it warm for 5 minutes to discharge...

Embodiment 2

[0028] Magnetron sputtering target for 50at% Ti-Al composition.

[0029] Ti powder with an average particle size of 30 μm and Al powder with a particle size of 30 μm are used, wherein the purity of the Ti powder is 99.9%, the purity of the Al powder is 99.9%, and the oxygen content is lower than 200ppm. After weighing the two powders according to the mass component ratio of 64:36, they were mixed in a ball mill for 4 hours, and a 1% mass content of stearic acid forming agent was added during the mixing. Put the mixed powder into the mold and vibrate evenly. Place the mold with Ti-Al powder on the induction heating hot press, see figure 1 , at room temperature, pre-press the pressure head to press the mold with a pressing force of 40MPa. The upper and lower rams can heat the entire mold together with the internal metal powder through the current. When the temperature rise rate reaches 500°C, keep it warm for 15 minutes to discharge the gas between the metal powder and the mol...

Embodiment 3

[0031] Magnetron sputtering target for 75% atTi-Al composition:

[0032] Ti powder with an average particle size of 10 μm and Al powder with a particle size of 50 μm are used, wherein the purity of the Ti powder is 99.9%, the purity of the Al powder is 99.9%, and the oxygen content is lower than 200ppm. After weighing the two powders according to the mass component ratio of 84:16, they were mixed in a ball mill for 16 hours, and a 3% mass content of stearic acid forming agent was added during the mixing. Put the mixed powder into the mold and vibrate evenly. Place the mold with Ti-Al powder on the induction heating hot press, see figure 1 , pre-press the pressure head to press the mold at room temperature, and the pressing force is 50MPa. The upper and lower rams can heat the entire mold together with the internal metal powder by passing current. When the temperature rise rate reaches 520°C, keep it warm for 20 minutes to discharge the gas between the metal powder and the mo...

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Abstract

The invention discloses a rapid thermal pressed sintering molding process for titanium-aluminum alloy targets. A rapid thermal pressed powder molding process is adopted to sinter and mold materials under the combined action of heat and force, and the characteristic that aluminum in the Ti-Al mixture has a low melting point is utilized to bond titanium powder together so as to obtain needed titanium-aluminum alloy targets with various components; and accordingly, titanium-aluminum alloy targets with various components in various dimensions can be prepared, have high compactness, small grains and even components and can satisfy the requirements of large-scale industrialization. The rapid thermal pressed sintering molding process for the titanium-aluminum alloy targets has the advantages of short flows, low cost, hardly oxidated powder, high compactness, good filming effect, even components and large dimensions.

Description

technical field [0001] The invention relates to a hot-pressing sintering molding process of a titanium-aluminum alloy target material used for vacuum sputtering on the surface of a material, and relates to the fields of metal materials, vacuum surface coating materials, and powder metallurgy processing. Background technique [0002] In recent years, with the enhancement of people's awareness of environmental protection and energy crisis, the surface coating technology of materials has gradually transitioned from traditional electroplating and electroless plating technology to vacuum sputtering technology. Vacuum magnetron sputtering technology has been widely used in the fields of hardware decoration coating, surface protection coating, electronic product coating, electromagnetic shielding coating, plastic coating and automotive and architectural glass coating. Therefore, the demand for sputtering targets to be used as the coating film layer of this technology is even more u...

Claims

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Application Information

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IPC IPC(8): B22F3/12B22F9/04C23C14/34C23C14/14
Inventor 余琨蔡志勇
Owner HUNAN HYDRO DYNAMIC NEW MATERIAL CO LTD
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