Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve problems such as insufficient satisfaction, and achieve the effects of excellent flame retardancy and excellent photosensitivity

Inactive Publication Date: 2009-09-16
TOYO INK SC HOLD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These requirements cannot be fully met when using photo-solder resists that are currently commercially available

Method used

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  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin
  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin
  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0106] The preparation method provided by the present invention of the carboxyl-containing photosensitive polyurethane resin (A) includes:

[0107] The first step in which the polymer polyol (e), the carboxylic acid compound (f) and the diisocyanate compound (g) having two hydroxyl groups in the molecule are reacted as essential components to obtain a carboxyl-containing polyurethane prepolymer (a),

[0108] The carboxyl-containing polyurethane prepolymer (a) obtained in the first step reacts with a compound (b) having an epoxy group or an oxetanyl group and an ethylenically unsaturated group to obtain a hydroxyl-containing polyurethane prepolymer the second step of (c), and

[0109] A third step of reacting the hydroxyl group-containing polyurethane prepolymer (c) obtained in the second step with the acid anhydride group-containing compound (d).

[0110] As the reaction conditions of the first step, it is preferable to react by heating and stirring at a temperature of room t...

Embodiment

[0206] The following examples illustrate the present invention more specifically, but the following examples do not limit the scope of rights of the present invention in any way. In addition, "part" in an Example means a "weight part."

[0207] The measurement conditions of GPC are as follows.

[0208]

[0209] For the measurement of Mw, GPC (gel permeation chromatography) "HPC-8020" manufactured by Tosoh Corporation was used. GPC is a liquid chromatography that separates and quantifies substances dissolved in a solvent (THF:tetrahydrofuran) based on the difference in molecular size. In the measurement in the present invention, two columns of "LF-604" (manufactured by Showa Denko Co., Ltd.: GPC column for rapid analysis: 6mmID x 150mm size) are used in series, at flow rate 0.6ml / min, column temperature It carried out on the condition of 40 degreeC, and the determination of the weight average molecular weight (Mw) was carried out by polystyrene conversion.

preparation example 1

[0211] Add polytetramethylene glycol (PTG1000sn: manufactured by Hodo Ketani Chemical Co., Ltd.: hydroxyl value=110mgKOH / g, Mw=1020) into a four-necked flask equipped with a stirrer, reflux cooling pipe, nitrogen gas introduction pipe, introduction pipe, and thermometer 156 129 parts, 129 parts of dimethylolbutyric acid (manufactured by Nippon Chemicals Co., Ltd.), and 375 parts of cyclohexanone as a solvent were heated up to 60° C. while stirring under a nitrogen stream, and dissolved uniformly. Next, 215 parts of isophorone diisocyanate was put into this flask, and it stirred at 90 degreeC for 8 hours, and performed the urethanization reaction. After completion of the reaction, a small amount of sampling was performed to obtain a carboxyl group-containing polyurethane prepolymer having a polystyrene-equivalent weight average molecular weight of 13,000 and an actually measured acid value of the resin solid content of 98 mgKOH / g.

[0212] Then, the introduction of nitrogen gas...

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Abstract

Disclosed is a photosensitive resin composition containing a carboxyl group-containing photosensitive urethane resin (A), a photopolymerization initiator (B) and a photosensitive ethylenically unsaturated group-containing compound (C). This photosensitive resin composition is characterized in that the carboxyl group-containing photosensitive urethane resin (A) is a resin obtained by reacting a hydroxy group in a hydroxy group-containing urethane prepolymer (c) with an acid anhydride group in an acid anhydride group-containing compound (d). The hydroxy group-containing urethane prepolymer (c) is obtained by reacting a carboxyl group in a carboxyl group-containing urethane prepolymer (a), which is obtained by reacting a polymer polyol (e), a carboxylic acid compound (f) having two hydroxy groups in a molecule and a diisocyanate compound (g) as essential ingredients, with an epoxy group or an oxethane group in a compound (b) having an epoxy group or an oxethane group and an ethylenically unsaturated group. This photosensitive resin composition is excellent in sensitivity to an active energy ray and enables to form a fine pattern. A cured coating film of the photosensitive resin composition is excellent in flexibility, insulating property, adhesion, solder heat resistance, coating film resistance and flame retardance, and is thus suitably used for a photosolder resist.

Description

technical field [0001] The present invention relates to a photosensitive resin composition containing a carboxyl group-containing photosensitive polyurethane resin useful for printed wiring boards and the like, a cured product thereof, and a method for producing the photosensitive resin. More specifically, it relates to a solder resist for flexible printed wiring boards, a plating resist, an interlayer electrical insulating material for multilayer printed wiring boards, a photosensitive optical waveguide, etc. A photosensitive resin composition containing a specific carboxyl group-containing photosensitive polyurethane resin that provides a cured product excellent in adhesion, flexibility (bendability), soldering heat resistance, chemical resistance, electrical insulation, etc. Its cured product and the preparation method of the above-mentioned photosensitive resin. Furthermore, it is related with the highly flame-retardant photosensitive solder resist ink (solder resist ink)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027C08F290/06C08G18/83G03F7/004
CPCC08G18/0823C09D175/16C08G18/6659C08G18/6692C08F290/06H05K3/287C08F290/067C08F283/006G03F7/035G03F7/027C08G18/674C08G18/44G03F7/028
Inventor 秦野望清水格东比吕子石川崇松泽孝洋小林英宣
Owner TOYO INK SC HOLD CO LTD
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