Preparation method of metal nanometer line with controllable size
A technology of metal nanowires and dimensions, applied in chemical instruments and methods, single crystal growth, polycrystalline material growth, etc., can solve the problems of complicated manufacturing process, many raw materials, environmental pollution, etc., and achieve a strong universal effect
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Embodiment 1
[0016] The specific steps of preparation are as follows: the first step is to put the surrounding aluminum sheet in an acid solution with a concentration of 0.2M, and anodize it at a DC voltage of 20V for 3 hours; among them, the purity of the aluminum sheet is 99.9%, and the acid solution for sulfuric acid solution. Then soak it in a mixed solution of 8wt% phosphoric acid and 1.6wt% chromic acid at a temperature of 50°C for 6h. Next, it was anodized for the second time under the same process conditions for 10 hours, and then the unoxidized aluminum on the back was removed with copper chloride solution, and then the aluminum oxide barrier layer at the bottom of the hole was etched away with 3wt% phosphoric acid solution. , to obtain a through-hole alumina template with aluminum around it and a pore size of 30 nm. In the second step, after evaporating a 90nm-thick gold film on one side of the through-hole alumina template by ion sputtering, first place the non-gold-coated side...
Embodiment 2
[0018] The specific steps of preparation are as follows: the first step is to first place the aluminum sheet sealed around it in an acid solution with a concentration of 0.25M, and anodize it at a DC voltage of 30V for 4 hours; wherein, the purity of the aluminum sheet is 99.99%, and the acid solution for sulfuric acid solution. Then soak it in a mixed solution of 7wt% phosphoric acid and 1.7wt% chromic acid at a temperature of 55°C for 7h. Next, it was anodized for the second time under the same process conditions for 11 hours, and the unoxidized aluminum on the back was removed with a tin chloride solution, and then the aluminum oxide barrier layer at the bottom of the hole was etched away with a 4wt% phosphoric acid solution. , to obtain a through-hole alumina template with aluminum around it and a pore size of 40 nm. In the second step, use the ion sputtering method to vapor-deposit a 100nm thick gold film on one side of the through-hole alumina template, first place the ...
Embodiment 3
[0020] The specific steps of preparation are as follows: the first step is to put the surrounding aluminum sheet in an acid solution with a concentration of 0.3M, and anodize it at a DC voltage of 40V for 5 hours; the purity of the aluminum sheet is 99.9%, and the acid solution For oxalic acid solution. Then soak it in a mixed solution of 6wt% phosphoric acid and 1.8wt% chromic acid at a temperature of 60° C. for 8 hours. Next, it was anodized for the second time under the same process conditions for 12 hours, and then the unoxidized aluminum on the back was removed with copper chloride solution, and then the aluminum oxide barrier layer at the bottom of the hole was etched away with 5 wt% phosphoric acid solution. , to obtain a through-hole alumina template with aluminum around it and a pore size of 50 nm. In the second step, after using the ion sputtering method to vapor-deposit a 110nm thick gold film on one side of the through-hole alumina template, first place the non-go...
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